Frankly speaking

DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges that need to be addressed in an industry that is marked by constant change. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call, especially for companies that are targeting the Greater China market.

The text is available free of charge for three days after publish date; older interviews require membership.

Please contact us if you're interested in arranging an interview.

Displaying interviews tagged IC manufacturing [back to index]

The LED upstream boom: Q&A with Digitimes Research analyst Jessie Lin

Wednesday 9 March 2011

Emerging markets to drive China foundries' growth: Q&A with Digitimes Research analyst Nobunaga Chai

Thursday 24 February 2011

Toward increased mobility: Q&A with ARM president Tudor Brown

Wednesday 24 November 2010

Leveraging flexible pricing: Q&A with TI Taiwan GM Robin Chen

Friday 19 November 2010

Inertial MEMS sensor growth promising: Q&A with Kionix CEO Gregory Galvin

Wednesday 17 November 2010

Partnering with Globalfoundries: Q&A with Socle chairman Song-Hwee Chia

Wednesday 5 May 2010

A peek at the semiconductor industry from the materials side: Q&A with Wouter Taen, BASF director of business management, Asia

Wednesday 30 September 2009

Chipbond gearing up 12-inch wafer bumping output: Q&A with chairman Fei-Jain Wu

Tuesday 30 June 2009

ACM Research finding strength in megasonic cleaning tool: Q&A with CEO David Wang

Thursday 11 June 2009

Globalfoundries already finding potential customers in Japan and Taiwan: Q&A with CEO Doug Grose

Wednesday 25 March 2009

Learning from Taiwan IC industry's marketing sensitivity: Q&A with China-based VeriSilicon CEO Wayne Dai

Monday 15 December 2008

Opportunity is always present in the midst of crisis: Q&A with Freescale CEO Rich Beyer

Thursday 13 November 2008

MEMS mass production to lead to increased foundry outsourcing: Q&A with Siimpel CEO Chee Kwan

Monday 20 October 2008

Semiconductor equipment localization – Don't act like a cry baby: Q&A with Hermes Epitek Archie Hwang

Monday 15 September 2008

Economic and technology challenges moving to 32nm: Q&A with ATMI

Thursday 11 September 2008

The state of the semiconductor industry: Q&A with SEMI president Stanley Myers

Thursday 11 September 2008

KLA Tencor sees the capex glass as half full

Tuesday 9 September 2008

More outsourcing from IDMs implies business potential: Q&A with Global Testing president and CEO Paul Yang

Tuesday 22 July 2008

Opportunity and challenge in China semi inspection and metrology market: Q&A with KLA-Tencor China president Su Hua

Tuesday 15 July 2008

Rohm & Haas ready for 18-inch wafer and new process migration: Q&A with president of microelectronic technologies James Fahey

Friday 11 July 2008

No plan for 450mm wafer migration yet: Q&A with Chartered CEO Song-Hwee Chia

Wednesday 18 June 2008

Interview with Dr. Chii-Ming Yiin, Taiwan's Minister of Economic Affairs

Tuesday 10 June 2008

Profitability more important than ranking: Q&A with UTAC president and CEO JC Lee

Friday 30 May 2008

A focused CMOS image sensor maker: Q&A with OmniVision sales VP Ray Cisneros

Wednesday 21 May 2008
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