- 12 Jan 2015:Canon and other Japanese electronics companies want to bring production of some goods back home, reversing a years-old trend of overseas manufacturing as a rapid decline in the value of the yen makes local goods more competitive.
- Global Unichip and Credo Semiconductor have announced they are collaborating to enable the development of high-performance networking solutions that will be manufactured using TSMC's 16-nm FinFET+ process technology.
- Globalfoundries and industry analyst Jim McGregor say production of a faster, smaller chip known as the 14-nanometer is on schedule at its Fab 8 factory in Malta, New York.
- Globalfoundries is keen to expand its presence in China's lucrative semiconductor market and hoping its recent buyout of IBM's chipmaking business will help lead the way.
- Toshiba will decide during the next business year from April on where to build an additional memory chip plant and will consider overseas locations for the facility, according to company CEO Hisao Tanaka.
- Avnet Technology Solutions has landed the contract to supply Lenovo's recently acquired x86 server products and related offerings across the UK and Europe.
- Vishay Intertechnology has acquired all of the remaining outstanding shares of Taiwan based Capella Microsystems for approximately NT$668.2 million or US$21.0 million.
- 30 Dec 2014:Qualcomm to lay off more than 100 in Silicon Valley (Dec 29) - Silicon Valley/San Jose Business JournalSan Diego-based chipmaker Qualcomm is laying off more than 100 workers in San Jose and Santa Clara, according to a recent state filing.
- The settlement of China's anti-trust probe into Qualcomm is likely to intensify global scrutiny of the firm's highly profitable patent licensing business, and may even call into question its worldwide contracts with smartphone makers such as Apple and Samsung.
- 29 Dec 2014:Samsung Electronics plans to invest KRW13.5 trillion (US$12 billion) in semiconductor facilities next year, up from the KRW13 trillion spent in 2014.
- 26 Dec 2014:The National Development and Reform Commission (NDRC), the country's anti-monopoly regulator which launched a probe of Qualcomm 13 months ago, said the case would be settled lawfully.
- Qualcomm, EE and Huawei successfully complete LTE Category 9 carrier aggregation interoperability testing (Dec 23) - Company releaseThe companies have successfully completed inter-company interoperability testing of LTE Category 9 connectivity with 3-carrier downlink aggregation and download speeds of up to 410 Mbps.
- 23 Dec 2014:China said to push Qualcomm to lower patent fees for phonemakers (Dec 22) - Bloomberg (via Businessweek)China wants Qualcomm to accept lower royalty payments for technology used by domestic smartphone manufacturers, people familiar with the matter said, in a proposal that would hurt the chipmaker's main source of profit.
- Xilinx has announced that its Kintex UltraScale KU040 FPGAs are now the industry's first 20nm device to move into volume production.
- 22 Dec 2014:STATS ChipPAC and Chinese firm Jiangsu Changjiang Electronics Technology (JCET) have extended talks on a proposed takeover for a second time.
- 19 Dec 2014:Chinese companies spent almost US$5 billion in five major chip-related takeovers in the past 18 months, data compiled by Bloomberg show, with most deals getting state funding.
- China is planning to purge foreign technology and replace with homegrown suppliers (Dec 18) - BloombergChina is aiming to purge most foreign technology from banks, the military, state-owned enterprises and key government agencies by 2020, stepping up efforts to shift to Chinese suppliers, according to people familiar with the effort.
- 17 Dec 2014:Qualcomm commits to invest US$40 million into several promising Chinese companies (Dec 12) - Company releaseQualcomm and its subsidiaries have committed to invest an aggregate of US$40M into four Chinese companies and the China Walden Venture Investments, L.P. fund, which is primarily focused on investing in semiconductor or semiconductor-related companies with business in China.
- Imagination Technologies wants investors to think creatively about the future of the company, after the UK-based microchip designer reported declining revenues and slipped into a loss in its half-year results.
- China's factory activity is in contraction, based on a private survey, reinforcing calls for more stimulus.
- 16 Dec 2014:An India court partially lifted a sales ban on Xiaomi, saying the world's third-largest smartphone vendor could import devices as long as they use chips from Qualcomm.
- A story that Apple tried for three weeks to suppress is now part of the public record.
- Qualcomm is vulnerable in China, and the company knows it.
- 11 Dec 2014:US ceramics manufacturing group CoorsTek is buying Japanese semiconductor-materials maker Covalent Materials from Carlyle and a local buyout fund, ending a rocky lossmaking investment spanning eight years.
- Many sensors, including MEMS devices, require thorough calibration and test before being assembled into the end node device.
- 9 Dec 2014:According to Qualcomm, everything is working as scheduled, and the Snapdragon 810 will still be able to ship in 2015H1.
- 5 Dec 2014:While I do think building the entire stack on 14-nanometers will afford Intel a manufacturing lead, and perhaps performance lead, over competitors, the important thing here is that Intel has a complete stack that it can offer to its customers. This means Intel can be a one-stop shop for smartphone and tablet OEMs looking to build out a family of products, as Qualcomm is today.
- 4 Dec 2014:Intel said it would invest up to US$1.6 billion over the next 15 years in its chip plant in Chengdu, China, as the company continues to expand its operations in the country.
- Intel's continuing to push aggressively into the world of wearables. On Wednesday it signed a deal with Luxottica Group to develop smart eyewear in time for a product launch next year.
- British chip designer Imagination has produced a barebones computer to compete with the Raspberry Pi.
- 3 Dec 2014:Samsung's Exynos SoC could be built entirely in-house, in time for Galaxy Note 5 (Dec 2) - Tom's Hardware GuideAccording to sources from South Korea, Samsung may be planning to build not just its own CPU core based on the ARMv8 architecture, but also its own GPU technology. We could see the new GPU, and possibly the new CPU as well, inside next year's Galaxy Note 5 device.
- Broadcom scores quad win with quad-core processor in latest smartwatch from Sony (Nov 24) - ABI ResearchThis is the first Android smartwatch based on the Broadcom system-on-chip (SoC) platform which includes a 1.2GHz Quad-core ARM Cortex A7 processor (BCM23550), an improved GPS and Sensor processing SOC (BCM47531) capable of simultaneously tracking five satellite systems (GPS, GLONASS, QZSS, SBAS, and BeiDou), the now popular Wi-Fi/BT/NFC/FM quad-combo connectivity chip (BCM43341), and a highly integrated power management IC (BCM59054).
- 2 Dec 2014:Samsung Electronics has joined hands with US-based Thermo Fisher Scientific in a bid to expand its presence in the medical industry with its smartphone business slowing down.
- The next generation of Google Glass may have new guts, according to The Wall Street Journal (subscription required), which expects a deal between Google and Intel.
- 30 Nov 2014:Samsung Electronics' semiconductor sales are expected to jump 15.6% on year in 2014, closing the gap with industry leader Intel, a global market tracker said Sunday.
- 26 Nov 2014:The Quintic Wearable & BTLE team of approximately 65 world class engineers located in China (Beijing, Shenzhen, Shanghai) and Sunnyvale, CA, and its leadership is expected to join NXP at close of this transaction which is targeted for Q1 2015.
- 25 Nov 2014:Samsung Electronics spent KRW1.38 trillion (US$1.2 billion) in patent fees in the nine months to September, the most in four years, the company said.
- RF Micro Devices (RFMD) and TriQuint Semiconductor have set Wednesday, December 31, 2014, as the anticipated closing date for the transaction.
- Xilinx and NXP collaborate to reduce capex and opex costs of wireless infrastructure radios (Nov 19) - Company releaseXilinx and NXP have announced their collaboration to reduce capex and opex costs of wireless infrastructure radios.
- KFA: Compact power entry module with filter now with ground line choke
- Advantest wins new customer with installation of V93000 semiconductor test system at Shanghai Haier IC in China
- Indium Corporation features NC-SMQ75 die-attach solder paste at Productronica China
- Advantest opens registration for VOICE 2015 developer conference May 12-14
- G.SKILL releases the fastest DDR4-3400MHz memory kit
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- Perforce Software Introduces Perforce Swarm
- Perforce Unveils Git Fusion, Improving Git Experience
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Chilisin introduces Thin-film chip inductor 0201 size
- Digitimes Research: Smartphone AP suppliers looking to offload inventory to tablet market
- Digitimes Research: Intel simplifies Atom product lines for mobile devices
- Digitimes Research: Qualcomm antitrust probe reshapes patent licensing in China
- Digitimes Research: Qualcomm Snapdragon 810 ships as scheduled for Xiaomi and LG product launches
- Digitimes Research: Nvidia steps up efforts for GPU licensing
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