- 29 Mar 2013:The president of struggling Renesas Electronics said Thursday that the chipmaker is in talks with overseas companies on selling its loss-making mobile device chip operations as part of efforts to streamline its business.
- 28 Mar 2013:STMicroelectronics has signed a loan agreement with the European Investment Bank to strengthen its finances.
- Samsung Semiconductor is moving swiftly to begin work on a new 680,000-square-foot office project that will be built on its existing 215,000-square-foot office complex at North First Street and West Tasman Drive.
- 27 Mar 2013:Persistent speculation about a pending merger between Chinese fabless chip vendors RDA Microelectroics and Spreadtrum Communications may have some basis in reality, but word is that RDA has its sights set on a higher bidder.
- I have to admit I missed this item of news that came out last October. And the news was that successful MEMS company InvenSense had announced that its founder and CEO, Steve Nasiri, would be stepping down from the company.
- 26 Mar 2013:Micron Technology is poised to get a US$400 million discount on the acquisition of Japanese rival Elpida Memory, after a 16% slump in the yen against the US dollar.
- Micron Technology has posted a quarterly loss, hurt by acquisition-related expenses, but the chipmaker's revenue and margins improved.
- The latest toxic gas leaks may not have caused serious physical harm, but the fact that the culprit companies failed to promptly report to state authorities is raising suspicions of corporate negligence.
- Semiconductor Manufacturing International (SMIC), for the first time in a long time, has a good story to tell.
- 22 Mar 2013:Manufacturing activity in China picked up speed in March, an initial HSBC survey has indicated, adding to hopes of a sustained recovery in its economy.
- 20 Mar 2013:The deal aims at building a long-term, mutually beneficial relationship between Renesas and J-Devices as strategic partners in the semiconductor production business. The two companies intend to complete the transfer on June 1, 2013.
- ARM has announced that CEO Warren East has decided to retire from the company, effective 1 July 2013. Simon Segars, currently president of ARM, will become the company's new CEO.
- 18 Mar 2013:STMicroelectronics and Ericsson have agreed to split up their unprofitable ST-Ericsson chip venture after failing to find a buyer for the business, cutting about 1,600 jobs as they divide the assets.
- Each time in recent years that the Federal Reserve has paused in its efforts to stimulate the economy, it has come to regret the decision as premature.
- "We are proud to say that the newest Snapdragon 600 processor is at the heart of the GALAXY S 4 in select regions," Qualcomm said in a blog post.
- Seven O-S-D product categories and device groups reached record-high sales in 2012 compared to 14 new records being set in 2011.
- 15 Mar 2013:Cadence Design Systems has entered into a definitive agreement to acquire Tensilica, a leader in dataplane processing IP, for approximately US$380 million in cash.
- 14 Mar 2013:China is over-reliant on imported goods for its semiconductor industry, and local chip companies supply only about 10% of its domestic needs as they remain in the development stage despite years of investments.
- 13 Mar 2013:Despite continued rumors that Apple has been working very hard to transition away from Samsung for production of A-series chips, it appears that Apple has not yet been able to make that step on a mass production basis, as this new smaller A5 is still being fabbed by Samsung.
- The reason is quite understandable really: demand for DRAM is still dropping, so how can there be a price improvement?
- 12 Mar 2013:Fab equipment spending for front-end facilities is expected to be flat in 2013, remaining around US$31.7 billion, increasing to US$39.3 billion in 2014 - a 24% increase.
- Intel's next CEO is likely to shepherd the top chipmaker into a growing contract-manufacturing business, a strategic shift that could lead to a deal with Apple Inc and give it a fighting chance to make inroads in the mobile arena.
- 11 Mar 2013:Spansion and UMC announce joint technology development and licensing agreement (March 4) - Company releaseSpansion and United Microelectronics (UMC) have announced the joint development of a 40nm process that integrates UMC's 40nm LP logic process with Spansion proprietary embedded Charge Trap (eCT) Flash memory technology. As part of this non-exclusive agreement, UMC is licensed to manufacture products based on this technology for Spansion.
- 10 Mar 2013:"Led by continuing strength in the Americas, the global semiconductor industry has built on its momentum from the end of 2012 with an encouraging start to 2013, but ongoing economic uncertainty is holding back more robust growth," said Brian Toohey, president and CEO of Semiconductor Industry Association (SIA).
- Texas Instruments, the largest maker of analog chips, raised the lower end of its forecasts for first-quarter sales and profit, as customers increase orders ahead of a projected rebound in electronics demand.
- Industry consolidation to just three big DRAM suppliers and a reduction in capital expenditures among these manufacturers helped propel DRAM average selling prices (ASPs) up 13% year over year in January. Capex budgets are also being trimmed for NAND flash (though not nearly as much as DRAM), and that, along with ongoing unit demand, has put upward pressure on ASPs for these memory devices as well.
- 5 Mar 2013:
- 1 Mar 2013:SanDisk partners with Nvidia on Tegra 4-powered tablet reference design (February 25) - Company releaseSanDisk has announced that the iNAND Extreme Embedded Flash Drive (EFD) supports tablet reference designs based on the Nvidia Tegra 4.
- 27 Feb 2013:The board of directors of Toshiba has nominated Hisao Tanaka, corporate senior executive VP of Toshiba, for the post of president and CEO of the company.
- 26 Feb 2013:Growth in the giant China manufacturing sector in February withdrew from the highest point in nearly two years despite a fourth consecutive month of expansion, a private survey showed Monday, as foreign demand remained unsteady.
- JEDEC Solid State Technology Association has announced that its board of directors appointed two new members, Jong H. Oh of SK hynix and Hung Vuong of Qualcomm.
- 21 Feb 2013:Qualcomm has announced a pair of new mobile processors designed for entry-level and mid-range smartphones. Expected in handsets later in 2013, the Snapdragon 200 and 400 balance the high-end 600 and 800 processors introduced in January.
- Globalfoundries offers enhanced 55nm CMOS logic process with ARM next-generation memory and logic IP support for low voltage (February 19) - Company releaseThe 55nm LPe 1V is especially suited for high-volume, battery-operated mobile consumer devices, as well as a broad range of green or energy-saving products. PDK and EDA tools are available now, along with MPW shuttle availability.
- 20 Feb 2013:South Korean chipmaker SK Hynix has appointed its research and development (R&D) chief Park Sung-wook as the new chief executive.
- 19 Feb 2013:Wireless is set to be the leading growth segment for semiconductor spending among original equipment manufacturers (OEMs) in 2013, with expenditures rising by a double-digit margin to support the burgeoning markets for smartphones, tablets and mobile infrastructure gear, according to IHS iSuppli.
- 18 Feb 2013:GlobalFoundries is expected to ramp up to 7nm process technology by 2017.
- 8 Feb 2013:
- 7 Feb 2013:As part of its broader restructuring measures, Fujitsu said it will cut 5,000 jobs, including 3,000 workers in Japan and 2,000 overseas, partly through early retirement offers. Fujitsu currently has about 170,000 workers world-wide.
- Cymer and ASML continue to expect the transaction to close in the first half of 2013.
- Imagination says third party IP becoming a key driving force for silicon vendors
- Enriching multiple MEMS applications for mobile devices
- Dialog Semiconductor expands into ultrabooks and all-in-one PCs with a new generation of multi-touch display sensor ICs
- Altera Cyclone V GT FPGA is industry first low-power FPGA to achieve compliance for PCIe Gen2 at 5 Gbps
- Digi-Key adds Califia Lighting to line card of more than 650 global suppliers
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Chilisin introduces Thin-film chip inductor 0201 size
- Chilisin at 2012 electronics Munich A5/159 & 260
- Chilisin sunken-type molded power inductor for MXM Graphic application
- Coto Technology claims industry's smallest MEMS reed switch
- Silicon Labs introduces single-chip digital radio receivers for CE devices
- Memory makers see better profits as chip pricing improves
- Globalfoundries quietly becoming a threat to competitors
- Digitimes Research: Mobile devices to drive 2013 DRAM market
Samsung Electronics reportedly is looking to expand the purchase of memory products, including mobile DRAM chips and eMMC NAND devices, from outside.
Micron Technology and Elpida Memory's trustees have reached an agreement for Micron to acquire Elpida. Micron also announced a separate agreement with...
Taiwan-based DRAM chipmakers including Powerchip Technology and ProMOS Technologies are considering selling fabs in order to preserve cash and strengthen...
Specializing in the manufacture of memory chips and LCD panels, Samsung's component operations are undergoing a focus shift to advanced process design...
Digitimes recently interviewed Bert Gyselinckx, general manager of the Holst Centre in Eindhoven, to...
Digitimes recently spoke with Karen Lightman, the executive director of MEMS Industry Group (MIG),...
In a relentless competition against rivals including Qualcomm, Nvidia and Media in the smartphone chipset...
Spansion recently announced a joint development with United Microelectronics (UMC) to integrate its...
- Taiwan DRAM module industry overview - Jun 2011
The year 2010 represented a peak in recent years for the DRAM module industry. Optimism surfaced in the second half of 2009 thanks to a return of demand on the...
- Taiwan DRAM-module industry overview - May 2010
Back to 2006 when total revenues for the third-party module market reached US$12.2 billion, Taiwan had over 15 vendors shipping DRAM modules under their own brand...
- Taiwan semiconductor equipment industry overview - Aug 2008
Worries about a global economic downturn have taken a toll on a number of industries, with the semiconductor industry being no exception. Players in the semiconductor...
- Foundry overview - Sep 2006
Taiwan's semiconductor industry has begun to out-run its global peers, once more, in 2006. This followed a trough in 2004, caused by over-inventory, plus volatility...