The new display reduces power consumption by up to 16 percent.

Intel split the Cyclone 10 into the performance-oriented GX and low-power optimized LP series. The GX series uses TSMC's 20nm process and is geared for a number of uses in the industrial, automotive, and broadcast markets. These include machine vision, robotics, infotainment, Advanced Driver Assistance Systems, and audiovisual applications.

Researchers at MIT have developed a low-power chip specialized for automatic speech recognition that could result in a power savings of up to 99%.

When AMD unveiled its new Polaris architecture, there was still some question as to where the new graphics processors would be built. Historically, AMD has built GPUs with TSMC and used Globalfoundries for its CPUs and higher-end APUs, which use integrated graphics.

A new low-power, high-speed memory technology on the horizon could replace solid-state drives, hard drives and DRAM in PCs, and bring higher levels of storage capacity to mobile devices and wearables.

Globalfoundries has announced it is offering a 28nm High-k Metal Gate (HKMG) radio frequency (RF) process technology that will provide power-efficient solutions for highly integrated mobile applications and connected devices.

ARM and SMIC have announced an agreement to offer the ARM Artisan physical IP platform for SMIC's 28nm poly SiON process to provide high-performance, high-density and low-power technologies for SoC designs.

For years, Intel has been battling to replace ARM-based chips used in smartphones and other mobile devices. Now it has partly succumbed to the low-power ARM approach.

Just as its predecessors did, the LPDDR4 specification is aiming to double its data rates while slashing power consumption in half, but first publication of the spec by JEDEC won't be until 2014.

The semiconductor industry is in a standoff over the next big thing - 3D chip stacks. Someone needs to blink before the technology will be viable for creating the next generation of high-performance, low-power systems.

STMicroelectronics and Movea have announced their agreement to integrate Movea's SmartMotion technology into the STM32F401 microcontroller operating as a low-power sensor-hub controller.

Imagination Technologies will release a new CPU design in 2014 for low-power servers.

Semiconductor Manufacturing International (SMIC) has announced the availability of its 1.2-volt low-power embedded EEPROM platform, which is fully compatible with its 0.13-micron low-leakage (LL) process.

Intel's latest effort to crack the smartphone market revolves around its new ultra low-power Atom chip code named Medfield and Google's Android 4.0 "Ice Cream Sandwich" mobile operating system, both of which reportedly appear in a new handset from Motorola that's due to be unveiled at the Mobile World Congress later this month.

Imagination is investing in Toumaz Microsystems, a newly-formed subsidiary of Toumaz, an Aim-traded company which has created a "digital plaster", a credit-card sized device with a wireless chip and electrocardiogram pads that remotely monitors patients' heart rate, body temperature and respiration.

Startup chip design company Adapteva has announced the multicore Epiphany processor, which is designed to accelerate applications in servers and low-power devices such as smartphones and tablets.

Intel has announced that the company is sampling its 32nm "Medfield" handset chip with customers. Scheduled for introduction this year, the Medfield chip will extend the performance benefits of Intel architecture into a low-power solution specifically designed for the smartphone market segment.

Battery Ventures, Flybridge Capital Partners and Highland Capital Partners represent the traditional venture capitalists behind Smooth-Stone. They have been joined by ARM, Texas Instruments and Advanced Technology Investment Company (ATIC).

Following its recent move to TSMC's high-performance, low-power (HPL) process technology at 28nm, Xilinx is aggressively broadening the reach of programmable logic into the traditional ASSP and ASIC markets with three new FPGA families on its roadmap, the low-cost low-power Artix-7, the Kintex-7, and the high-end Virtex-7 due to be sampling in the first quarter of2011.

Samsung Electronics' foundry business, Samsung Foundry, has qualified 32nm low-power (LP) process with high-k metal gate (HKMG) technology. The process has successfully completed reliability testing at Samsung Foundry's 300mm logic fabrication line in Giheung and is now ready for production of customer designs.

The first ASIC prototypes implemented in ST's 32LPH (low-power high-performance) process technology are expected early in 2011 with production ramp-up in the second half of 2011.

IBM, Dell and Intel stand out among technology and consumer-products companies for their policies directed at averting climate change, according to a study released on Thursday.