- 27 Mar 2017:Intel warns partners: Expect tight SSD supply through 2017, with shipment priority on data center SSDs (Mar 24) - CRNIntel is warning its channel partners that demand for SSDs is expected to outstrip supply for all of 2017, forcing the company to prioritize its production for data center SSDs over lower-cost consumer SSDs.
- 13 Mar 2017:As major player Toshiba's flash memory business is up for sale, global chipmakers are weighing their chances of competing against Samsung, which has a runaway lead in 3D NAND flash technology.
- 22 Feb 2017:Toshiba wants to pick the preferred bidder or bidders for a majority stake in its chip unit by the end of May and will hold the first round of bids next month, a source with knowledge of the plan said.
- Toshiba has asked potential bidders for its memory chip business to peg the operations' value at JPY2 trillion (US$17.6 billion) or more, aiming to maximize income from the sale of its crown jewel.
- 16 Feb 2017:Toshiba may delay the sale of its prized flash-memory chip unit after the conglomerate said it would consider selling most, even all, of the marquee business, a person with direct knowledge of the matter said.
- 8 Feb 2017:Toshiba has received bids from South Korea's SK Hynix, Taiwan's Foxconn, private equity fund Silver Lake and at least three other groups for a minority stake in its profitable memory chip business, according to people close to the negotiations.
- 2 Feb 2017:Toshiba said it will sell a minority stake in its memory chip business as it urgently seeks funds to offset an imminent multi-billion dollar writedown, adding that its overseas nuclear division-the cause of its woes-was now under review.
- 26 Jan 2017:Toshiba is expected to sell no more than 19.9% of the unit to be created in a spinoff of its memory chip operations.
- 30 Dec 2016:Samsung Electronics plans to mass produce 64-layer NAND flash memory for the first time in the world early in 2017, while SK hynix plans to mass produce 72-layer NAND flash in the second half of 2017 jumping over 64-layer NAND flash.
- 26 Dec 2016:SK Hynix, one of South Korea's leading manufacturers of memory semiconductors, plans to leapfrog rival Samsung Electronics to mass produce the most-advanced generation of NAND flash - chips that feature 72 layers of data-storing cells.
- 22 Dec 2016:CEO Durcan sees supply-demand balance persisting in 2017.
- 20 Dec 2016:Samsung was Apple's main supplier for the iPhones from the very beginning, making the A-series processors and supplying both NAND flash and DRAM memory chips.
- 5 Oct 2016:Micron Technology has said it is seeing signs of tight supplies of memory chips, a good omen for the company's bottom line but a potential worry for makers of smartphones, computers and other high-tech products.
- 12 Sep 2016:Looking at 2017, the semiconductor industry should see tight DRAM/NAND supply due to unbalanced supply conditions. Mea
- Tech giant Samsung Electronics is gearing up to fully operate a production line for 3D NAND flash memory at its plant in Hwaseong City, Gyeonggi Province. Considering the one-month period to build the equipment and tools, it is expected that the facility will likely be in full operation around the end of 2016.
- 21 Jul 2016:Toshiba is planning to start the manufacturing of the world's first 64-layer 3D NAND flash memory chips in the third quarter of 2016 with Samsung Electronics being expected to release the same type of products in the following quarter.
- 5 Jul 2016:Report : Toshiba, Western Digital commit JPY1.5 trillion on flash memory production (Jul 4) - NASDAQ.comToshiba and US partner Western Digital will commit 1.5 trillion yen or US$14.6 billion over three years toward stepping up flash memory production at their jointly run Japanese plant, in a bid to widen global market share, Nikkei reported.
- 15 Jun 2016:The announcement comes after Korean news media reported that Samsung is planning to invest around KRW25 trillion (US$21.2 billion)- some claimed KRW2.5 trillion - to beef up its production lines for 3D NAND flash memory in Hwaseong, Gyeonggi Province.
- 2 Mar 2016:SK Hynix plans to invest up to KRW15.5 trillion (US$12.5 billion) to build a new memory chip plant next to its Cheongju facility in North Chungcheong Province.
- 15 Feb 2016:Micron announced that it is shipping 2 bit per cell flash memory (MLC) and three bit per cell (TLC) 3D flash memory and that the majority of its total NAND flash output will be on 3D NAND by the second half of 2016.
- 23 Dec 2015:The estimate of its first loss in more than two years sent the company's shares down 5.7% to $13.78 in extended trading on Tuesday.
- 21 Oct 2015:Intel to spend at least $3.5 billion converting China plant for memory chips (Oct 20) - Marketwatch.com (Dow Jones)Intel's move comes as the chip industry undergoes a wave of consolidation and China steps up efforts to build local technology manufacturing capacity.
- 13 Oct 2015:
- 18 Aug 2015:SK Group is considering pouring about 46 trillion won ($38 billion) over the next few years to expand the production facilities of its chipmaking unit SK hynix, officials said Monday.
- 17 Jul 2015:Altera has developed a storage reference design based on its Arria 10 SoCs, which doubles the life of NAND flash and can increase the number of program-erase cycles by up to 7X compared to current NAND flash implementations.
- 15 Jul 2015:The deal, if true, could have broad implications for Micron's technology partner, Intel and NAND-chip competitor SanDisk.
- SanDisk has shipped more than two billion microSD cards since it started commercial shipment of the technology ten years ago.
- 1 Jul 2015:Micron Technology was bullish about the coming year at a conference in May, but its latest quarterly earnings released in late June have investors less optimistic.
- 26 Jun 2015:Micron Technology said it expects a further decline in prices of chips used in personal computers, and forecast revenue for the current quarter well below market estimates.
- 27 Mar 2015:
- 12 Jan 2015:Toshiba will decide during the next business year from April on where to build an additional memory chip plant and will consider overseas locations for the facility, according to company CEO Hisao Tanaka.
- 10 Nov 2014:According to industry sources, Apple has decided to discontinue its use of triple-level cell (TLC) NAND, since the company believes that the functional defects plaguing the 64GB iPhone 6 and the 128GB iPhone 6+ stem from a problem in the controller IC of the TLC NAND flash. The controller IC in question is reportedly made by SSD maker Anobit, which was sold to Apple in 2011.
- 5 Nov 2014:Reports of possible 128GB iPhone 6 Plus recall are false, crashing bug is very rare (Nov 4) - 9to5Mac.comUsers in Apple's support forums have recently highlighted a rare issue that causes iPhones to crash, specifically for users with a large amount of apps installed.
- 4 Nov 2014:As numerous reports of low read performance of the Samsung SSD 840 and 840 EVO using TLC NAND flash have surfaced on the Internet, a problem in the controller IC is considered to be the more likely cause of the defects.
- 12 May 2014:
- 26 Feb 2014:Toshiba develops device controller for embedded NAND flash memory module compliant with JEDEC UFS Ver.2.0 standard (February 25) - Company releaseToshiba has developed what it claims is the world's fastest device controller for embedded NAND flash memory modules compliant with the Universal Flash Storage (UFS) Ver.2.0 and UFS Unified Memory Extension (UME) Ver.1.0 standards defined by JEDEC Solid State Technology Association (JEDEC).
- 17 Feb 2014:Samsung Electronics Co said a memory chip plant being built in China will start operations as planned in the first half of 2014 and the company will remain flexible about further investment in the factory.
- 27 Nov 2013:The dynamics of the solid-state state drive market are shifting, and for Abhi Talwalkar it's been a disappointing shift in 2013.
- 26 Aug 2013:Solid-state drive adoption will continue to grow and it will be more than 10 years before it is ultimately replaced by a new memory technology, experts said.
- 3 Jul 2013:The two companies have reached an agreement to share patents for chipmaking technologies.
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