Western Digital has restarted talks with Japan's Kioxia in a deal that could unite two technology storage providers, according to people familiar with the matter.

Toshiba Electronic Devices & Storage will construct a new 300-milimeter wafer fabrication facility for power semiconductors at its main discrete semiconductor production base, Kaga Toshiba Electronics, in Ishikawa Prefecture. Construction will take place in two phases, allowing the pace of investment to be optimized against market trends, with the production start of Phase 1 scheduled for within fiscal 2024. When Phase 1 reaches full capacity, Toshiba's power semiconductor production capacity will be 2.5 times that of fiscal 2021.

SK Hynix plans to turn Intel's NAND memory and storage business into a stand-alone US company that will be owned by the South Korean chipmaker.

Intel and SK Hynix have moved closer to completing their memory and storage business transaction after securing EU approval.

SK hynix will launch consumer solid state drives here for the first time, the company said Monday, as the remote working trend boosted demand for personal storage devices.

Yangtze Memory Technologies, China's top memory chipmaker, will roll out its first-ever storage products lineup in the second half of 2020.

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HP was awarded $439 million in damages against Quanta Storage and its US subsidiary after a federal judge tripled a jury's 2019 award for damages caused by a widespread scheme to inflate the price of optical disk drives.

Western Digital continues to assess the impact of this event and expects the incident to result in a reduction of WD's flash wafer availability of approximately 6 exabytes, the majority of which is expected to be contained in the first quarter of fiscal year 2020, namely the period from July 2019 until September.

Due to appear in May, the 3D XPoint and storage combo is aimed at the thin laptop market.

Intel intends to expand its partnership with Beijing-backed Tsinghua Unigroup by providing NAND flash memory chips as soon as this year, according to industry sources.

Huawei had had a difficult time when it installed different NAND flash chips into its strategic Smartphone called P10 during first half of 2017. Into a same product, it installed eMMC and UFS standard storage device. Unexpectedly level of dissatisfaction from consumers who purchased P10 equipped with eMMC increased heavily. Industries believe that Huawei made a bad move by failing to obtain NAND flash memories.

Jayapalan has 20 years of experience in the semiconductor industry. Most recently, he served as vice president, enterprise and client compute solutions marketing at Western Digital.

Cisco has announced its intent to acquire Springpath, a Sunnyvale-based leader in hyperconvergence software. Springpath has developed a distributed file system purpose-built for hyperconvergence that enables server-based storage systems. The acquisition will allow Cisco to continue to deliver next-generation data center innovation to its customers.

Hewlett Packard Enterprise said it would buy data storage provider Nimble Storage Inc for $1.09 billion in cash, to expand its presence in the fast-growing flash storage business.

A non-volatile memory technology based on carbon nanotubes that's poised for commercialization in 2018 is expected to be more disruptive to enterprise storage, servers and consumer electronics than flash memory, according to a new report from BCC Research.

In a regulatory filing with the Financial Supervisory Service, SK Hynix said, "We are looking into various options, including setting up a joint venture with Seagate Technology, to strengthen the mid and long-term competitiveness of our nonvolatile storage flash chips. But no decision has yet been made."

Tsinghua Unigroup Chairman Zhao Weiguo will be president of a new holding company for XMC called Yangtze River Storage Technology Co., people familiar with the matter said. Tsinghua Unigroup will own more than 50% of Yangtze River Storage, with other stakes held by the national chip fund and a fund backed by the Wuhan city government, they said.

Seagate Technology, a maker of disk drives for computer storage, expanded plans to cut jobs to 14 percent of the workforce, seeking to reduce costs to weather a prolonged slump in demand.

The iPhone 7 might introduce a new starting point for built-in storage while also improving RAM.

JEDEC Solid State Technology Association has announced the publication of several key updates to the Universal Flash Storage (UFS) family of standards. These include JESD220C UFS version 2.1, JESD223C UFSHCI version 2.1, JESD220-1A UFS UME version 1.1 and JESD223-1A UFSHCI UME version 1.1.

Flash DIMM technology developer Netlist has signed a five-year joint development deal with global memory leader Samsung to produce non-volatile DIMMs, giving it a lifeline from years of litigation hell against Diablo Technologies over memory channel storage IP.

SanDisk and HP have announced a long-term partnership to collaborate on a new technology within the Storage Class Memory (SCM) category. The partnership will center around HP's Memristor technology and expertise and SanDisk's non-volatile ReRAM memory technology and manufacturing and design expertise to create new enterprise-wide solutions for Memory-driven Computing.

Altera has developed a storage reference design based on its Arria 10 SoCs, which doubles the life of NAND flash and can increase the number of program-erase cycles by up to 7X compared to current NAND flash implementations.

Hard-disk drive storage provider Seagate on Monday lowered its revenue and margin guidance ahead of the release of its fourth quarter earnings report later this month.

A new low-power, high-speed memory technology on the horizon could replace solid-state drives, hard drives and DRAM in PCs, and bring higher levels of storage capacity to mobile devices and wearables.

Microchip Technology through its Silicon Storage Technology (SST) subsidiary and Globalfoundries have announced the full qualification and availability of SST's 55nm embedded SuperFlash non-volatile memory (NVM) on Globalfoundries' 55nm Low Power Extended (LPx)/ RF enabled platform.

Toshiba has developed what it claims is the world's fastest device controller for embedded NAND flash memory modules compliant with the Universal Flash Storage (UFS) Ver.2.0 and UFS Unified Memory Extension (UME) Ver.1.0 standards defined by JEDEC Solid State Technology Association (JEDEC).

JEDEC has announced the publication of Universal Flash Storage (UFS) version 2.0, which offers performance and power saving features over the prior version of the standard.

The M500 SSD utilizes Micron's 20nm multilevel cell (MLC) NAND flash to achieve terabyte-class capacity and enable a new level of SSD price competitiveness; the 960GB Crucial M500 SSD will be initially priced under US$600.

The Lenovo ThinkPad X1 Carbon weighs in at less than three pounds, has an exterior made of extremely lightweight carbon fiber material, boasts optional embedded 3G connectivity for anywhere, anytime Internet access, and relies on a 256GB2 SanDisk X100 SSD for incredibly responsive, small form factor storage.

SamMobile has supposedly acquired leak specifications for the next Nexus smartphone from Samsung codenamed "Superior." Also labeled as the GT-I9260, it will feature a dual-core ARM A9-based SoC clocked at 1.5 GHZ, 16GB of internal storage, a microSD card slot for extra storage, an 8MP rear-facing camera with flash, a 1.9MP front-facing camera with HD video recording, and a 4.65-inch HD Super AMOLED screen.

Infineon Technologies has selected Spansion's FL-serial flash memory to provide a high-performance, quad I/O SPI data storage solution for its Hexagon Development Kit System. The Hexagon kit, a modular, expandable platform built around the XMC4000 microcontroller, provides engineers a fast method to prototype industrial applications such as motor control, industrial automation or any kind of power conversion like solar inverters.