IBM and Rapidus, a newly formed chip maker backed by the Japanese government, on Tuesday announced a partnership that aims to manufacture the world's most advanced chips in Japan by the second half of the decade.

Sony Group on Thursday confirmed it is considering a plan to join with Taiwan Semiconductor Manufacturing Co. in building a chip factory in the western Japanese prefecture of Kumamoto.

Today at its inaugural Intel Innovation event, Intel returned to its developer roots, highlighting a renewed commitment to the community and a developer-first approach across software and hardware. Announcements spanning new products, developer tools and technologies underscore Intel's focus on empowering an open ecosystem, ensuring choice for developers to use the tools and environments they prefer, and building trust and partnership across cloud service providers, open source communities, startups and others.

Intel and the US Defense Advanced Research Projects Agency (DARPA) have announced a three-year partnership to advance the development of domestically manufactured structured ASIC platforms.

US President Joe Biden is set to sign an executive order as early as this month to accelerate efforts to build supply chains for chips and other strategically significant products that are less reliant on China, in partnership with the likes of Taiwan, Japan and South Korea.

Intel announced plans to discontinue its Kaby Lake-G processors, which pair the company's 8th-gen processing cores with long-time rival AMD's discrete Radeon RX Vega M graphics.

Lenovo and Intel outlined a multi-year collaboration pact revolving around high performance computing (HPC) and artificial intelligence.

Huawei is considering a partnership with Micromax to use their expertise in sales to bolster their business.

Intel has ended a partnership to share its latest 5G modem chips with China's second largest mobile chipmaker amid concerns that the technology transfer could cause problems in Washington, sources have told Nikkei Asian Review.

Infineon Technologies is strengthening its long-term partnership with Denso to bolster its automotive business. Underpinning this collaboration, the Japan-based company has bought an equity stake in Infineon in the range of a mid-double-digit million Euro amount.

Infineon Technologies and JD group have signed a strategic partnership agreement aimed at creating a smart IoT (Internet of Things) ecosystem.

Flipkart announces strategic partnership with Asus, will launch Zenfone Max Pro on April 23 Flipkart will now be the primary sales channel for Asus smartphones and under the three-year partnership, the company will announce the Asus Zenfone Max Pro.

Intel intends to expand its partnership with Beijing-backed Tsinghua Unigroup by providing NAND flash memory chips as soon as this year, according to industry sources.

Samsung Electronics has decided to cooperate with the Chinese government to develop next-generation technologies including artificial intelligence (AI). With China having been putting pressure on Samsung Electronics due to a rise in the price of memory chips supplied to Chinese smartphone makers, some market watchers say that the partnership can settle a series of conflicts between the two.

LG Display will supply flexible organic light emitting diodes (OLEDs) to Sony. They broadened the scope of cooperation from large OLED TVs to smartphones.

Imec has expanded its long-term joint research efforts with Western Digital. Under a new agreement, imec and Western Digital will collaborate in R&D of a broad range of advanced semiconductor technologies.

Imec and Analog Devices have entered into a strategic research partnership to develop the next generation of Internet of Things (IoT) devices.

Deloitte and HP are joining forces to give their digital manufacturing services and 3D printing services a little push. The partnership will see HP's 3D printers become part of the digital supply chain in more large-scale manufacturing environments.

Microsoft described Scorpio, the SoC inside its Xbox X One. Scorpio packs 7 billion transistors with 6 TFlops graphics performance in a 359-square millimeter chip made in a 16FF+ TSMC process. The chip, designed in partnership with AMD, also packs eight x86 cores running at 2.3 GHz and sharing 4 Mbytes L2 cache.

In a regulatory filing with the Financial Supervisory Service, SK Hynix said, "We are looking into various options, including setting up a joint venture with Seagate Technology, to strengthen the mid and long-term competitiveness of our nonvolatile storage flash chips. But no decision has yet been made."

TSMC now has all of Apple?？ foundry business but is seen behind Intel on the more advanced 10nm processors.

NTT DOCOMO and MediaTek have announced a joint effort to drive 5G technology development.

It has been found that Chinese companies in the LCD and semiconductor industries are trying to acquire Korean firms in partnership with Samsung Electronics and SK Hynix as well as technical engineers.

SanDisk and HP have announced a long-term partnership to collaborate on a new technology within the Storage Class Memory (SCM) category. The partnership will center around HP's Memristor technology and expertise and SanDisk's non-volatile ReRAM memory technology and manufacturing and design expertise to create new enterprise-wide solutions for Memory-driven Computing.

IBM's Internet of Things platform can now work with IoT processors designed by ARM, thanks to a new partnership between the two companies.

Toshiba and Microsoft have announced that the two companies have signed a memorandum of understanding (MOU) to jointly develop solutions for the Internet of Things (IoT).

Globalfoundries has announced a partnership with Invecas, a newly formed design services provider focused on accelerating customer introduction of new products on leading-edge semiconductor process technologies.

Hillcrest Labs and Bosch Sensortec have announced a partnership to launch a new sensor solution for head-mounted displays (HMDs).

ARM and SMIC have announced an agreement to offer the ARM Artisan physical IP platform for SMIC's 28nm poly SiON process to provide high-performance, high-density and low-power technologies for SoC designs.

eMemory and Semiconductor Manufacturing International (SMIC) plan to expand the deployment of their current collaboration on SMIC's eNVM platform development. The platform covers both one time programmable (OTP) and multiple times programmable (MTP) eNVM technologies, such as NeoBit, NeoFuse, NeoEE and NeoMTP, across a wide range of technology nodes ranging from 0.35-micron to 40nm.

MagnaChip Semiconductor has completed qualification of 0.18-micron EEPROM IP developed in partnership with eMemory Technology, a Taiwan-based non-volatile memory (NVM) IP provider.