Kioxia and Western Digital's joint venture manufacturing facilities in Yokkaichi and Kitakami have been approved for up to JPY150 billion (US$1 billion) in government subsidies.

Siemens and ASE are developing a single platform from 2.5D and 3D packaging to fan-out wafer-level packaging (FOWLP) technologies.

Google and AMD will be among the first clients for TSMC's new SoIC chips, which use a new 3D technology to stack and link different types of chips in one package. The new chip packaging approach is meant to make the chipset smaller but more powerful and energy efficient.

As frontline workers and hospitals struggle to get access to enough medical equipment to deal with the rapid spread of coronavirus, a growing number of businesses are pushing what could be a promising fix: 3D-printed supplies.

The company held a ceremony at its Xian complex on March 10 to mark a product shipment following the completion of the first phase of investment. The new line will roll out 5th-generation V-NAND flashes of a 3D vertical structure with 90 or more layers.

Materialise, a Belgium-based pioneer in 3D printing, has designed a 3D printed door opener that makes it possible to open and close doors with your arm, removing the need for direct contact with door handles.

Cuttlefish have the ability to watch 3D movies and react to them much like they would if they saw the real thing out in the ocean.

Intel's upcoming 3D-stacked processor, codename Lakefield, has recently popped up in the 3DMark database. Chip detective TUM_APISAK managed to take a screenshot of the 3DMark entry.

Globalfoundries has taped-out an Arm-based 3D high-density test chip that will enable a new level of system performance and power efficiency for computing applications such as AI/ML and high-end consumer mobile and wireless solutions.

Samsung Electronics has begun mass producing 250-gigabyte (GB) SATA solid state drive (SSD) that integrates the company's sixth-generation (1xx-layer) 256-gigabit (Gb) three-bit V-NAND for global PC OEMs.

Sensor specialist AMS is teaming up with Chinese software maker Face++ to produce new 3D facial recognition features for smartphones, as the Austrian firm aims to reduce its dependency on Apple and boost its battered shares.

Shares in Lumentum Holdings soared 23% on Tuesday after the optical components maker said it shipped more than $200 million worth of 3D sensing lasers to a customer that two analysts identified as Apple Inc.

Google today unveiled its experimental effort to integrate augmented reality features into the mobile and desktop web using its Chrome browser. That way, web designers, media organizations, and other creative professionals could create virtual 3D objects, embed them into websites for viewing on desktop, and make them downloadable on mobile so users could place those objects into their real world surroundings.

The iPhone X is facing production delays due to problems in manufacturing the 3D sensors used for facial recognition, reports say.

Deloitte and HP are joining forces to give their digital manufacturing services and 3D printing services a little push. The partnership will see HP's 3D printers become part of the digital supply chain in more large-scale manufacturing environments.

Apple's progress in 3D sensing design and mass production is 1.5 to 2 years ahead of Qualcomm's, according to a new investor's note released today by KGI Securities analyst Ming-Chi Kuo.

It has been confirmed that SK Hynix started mass-producing 4th generation (72-layer) 3D NAND flash wafers and achieved ?？olden yield', which had been SK Hynix's biggest obstacle. Its solution product that uses its own controller and firmware passed certifications.

Western Digital has announced what the company claims is the world's first client solid state drives built with its 64-layer 3D NAND technology.

Apple's iPhone 8 smartphone will include a 3D-sensing module to enable augmented-reality applications, Rosenblatt Securities recently said. Rosenblatt Securities named Austria's AMS AG as a likely supplier of 3D sensors to Apple.

Intel has announced the first Optane-branded product using its new 3D XPoint memory: the catchily named Intel Optane SSD DC P4800X.

As major player Toshiba's flash memory business is up for sale, global chipmakers are weighing their chances of competing against Samsung, which has a runaway lead in 3D NAND flash technology.

There's a lot of pressure on Apple's next iPhone to deliver, both in product quality and sales.

Apple is developing a new camera with "3D sensing and modeling capabilities" that could "reinvent the user experience" to be included in a redesigned iPhone expected to launch later this year, according to new research from KGI Securities analyst Ming-Chi Kuo seen by Business Insider.

TetraVue, a company setting out to arm autonomous cars with ultra high-resolution 3D image-capturing smarts, announced it has raised $10 million from Robert Bosch Venture Capital, Nautilus Venture Partners, Samsung Catalyst Fund, and Foxconn.

Apple's widely expected 5.8-inch iPhone with an edge-to-edge OLED display will feature a front-facing 3D laser scanner for facial recognition, corroborating previous rumors, according to JPMorgan analyst Rod Hall.

SK Hynix, one of South Korea's leading manufacturers of memory semiconductors, plans to leapfrog rival Samsung Electronics to mass produce the most-advanced generation of NAND flash - chips that feature 72 layers of data-storing cells.

According to the company, the output of 3D NAND at its fabs has surpassed the output of 2D NAND in terms of bits. Meanwhile, the costs of the first-generation 3D NAND are in line with expectations and the company is gearing up to start high-volume production of its second-gen 3D NAND in the coming weeks.

According to the latest rumor from its home country of South Korea, Samsung is thinking about making the Galaxy S8 come with a pressure-sensitive display. If you're wondering what that means, just think Apple's 3D Touch on iPhones - that's basically it. The technology detects how hard you press on the screen, and this can be used by software to enable different functionality depending on the pressure level applied. The rumor is reportedly coming from multiple industry sources, as well as a senior executive at Samsung's component division.

Tech giant Samsung Electronics is gearing up to fully operate a production line for 3D NAND flash memory at its plant in Hwaseong City, Gyeonggi Province. Considering the one-month period to build the equipment and tools, it is expected that the facility will likely be in full operation around the end of 2016.

Orders for semiconductor-manufacturing equipment are picking up at seven major Japanese producers, underpinned by brisk demand for 3D memory and ravenous investment in chip miniaturization.

Toshiba is planning to start the manufacturing of the world's first 64-layer 3D NAND flash memory chips in the third quarter of 2016 with Samsung Electronics being expected to release the same type of products in the following quarter.

Applied Materials has announced its next-generation e-beam inspection system is delivering the highest resolution and image quality at the fastest throughput to leading foundry, logic, DRAM and 3D NAND customers as they move to advanced nodes.

Power component designer Sarda Technologies in the US is teaming up with Asian assembly firm UTAC to use its Heterogeneous Integrated Power Stage (HIPS) in UTAC's 3D SiP based on technology from German embedded board provider AT&S to improve the energy efficiency of data centers.

The announcement comes after Korean news media reported that Samsung is planning to invest around KRW25 trillion (US$21.2 billion)- some claimed KRW2.5 trillion - to beef up its production lines for 3D NAND flash memory in Hwaseong, Gyeonggi Province.

After announcing in 2014 it would bring an industrial 3D printer to market within two years, HP went mostly silent -- until now.

Micron announced that it is shipping 2 bit per cell flash memory (MLC) and three bit per cell (TLC) 3D flash memory and that the majority of its total NAND flash output will be on 3D NAND by the second half of 2016.

If Tsinghua Unigroup is unable to acquire the necessary IP to build 3D NAND, I believe the Chinese company will scrap its plan to build the new fab.