Winbond cautious for 2005; 0.11-micron on 8-inch wafers faces bottlenecks

Josephine Lien and Hans Wu, Taipei; Jack Lu, DIGITIMES Asia Tuesday 1 February 2005 0

Winbond Electronics is not optimistic about the company’s key market segments in 2005, and the company stated that its DRAM production using 0.11-micron technology on 8-inch wafers is less efficient compared to production on 12-inch wafers.

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