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ASE, SPIL optimistic about 3Q09

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Tuesday 2 June 2009 0

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industry (SPIL) have fully utilized all wire bonders, with the former using 60-70% and the latter 70-80% of their respective flip-chip (FC) IC packaging capacities, according to company...

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