Taipei, Friday, May 26, 2017 11:30 (GMT+8)
mostly cloudy
Taipei
27°C
Gigabyte announces Intel H55/H57-based motherboards with USB 3.0
Press release, January 11; Joseph Tsai, DIGITIMES [Monday 11 January 2010]

Gigabyte Technology has announced its latest H55/H57 series motherboards, based on Intel's H55 and H57 chipset with support of USB 3.0 and DisplayPort.

The motherboards also include Gigabyte's Ultra Durable 3 design that features functions such as Smart6 PC management tools, Dynamic Energy Saver 2 utilities for power saving and DualBIOS.

Gigabyte's GA-H55M-USB3 and GA-H57M-USB3 motherboards support the latest SuperSpeed USB 3.0 technology through an onboard NEC uPD720200 host controller.

With transfer rates up to 5Gbps, users are able to experience an almost 10 times improvement over USB 2.0. In addition, the technology is backwards compatible with the USB 2.0 specification. The onboard NEC SuperSpeed USB 3.0 technology also provides new power management features, said Gigabyte.

The Gigabyte's GA-H55M-USB3 and GA-H57M-USB3 motherboards feature a 3x USB power boost, delivering greater compatibility and extra power for USB devices. Gigabyte's exclusive USB power design is also able to regulate output over the full voltage range, which greatly enhances USB device compatibility. In addition, dedicated lower resistance fuses ensure lower voltage drops, and provide more stable and plentiful power delivery, the company highlighted.

Gigabyte GA-H57M-USB3 motherboard

Gigabyte GA-H57M-USB3 motherboard
Photo: Company

Realtime news
  • Taiwan market: Smartphone shipments decline sharply in April

    Mobile + telecom | 5min ago

  • E Ink phasing out LCD module production

    Displays | 7min ago

  • TSMC set to move 7nm to volume production in 2018

    Bits + chips | May 25, 22:14

  • Macroblock 2017 EPS to reach NT$8

    Bits + chips | May 25, 22:13

  • LG Display may stop production of Full HD OLED TV panels by end of 2017

    Before Going to Press | May 25, 22:04

  • China market: Sharp to resume marketing of smartphones

    Before Going to Press | May 25, 22:03

  • US ITC to start global safeguards investigation of imported solar cells, PV modules

    Before Going to Press | May 25, 22:02

  • Taiwan Star Cellualr procures equipment from Nokia Networks Taiwan

    Before Going to Press | May 25, 22:01

  • MSI to hold Gaming Night at Computex Taipei 2017

    Before Going to Press | May 25, 22:00

  • MediaTek to enter mass production of 12nm mobile chips in end-2017

    Before Going to Press | May 25, 22:00

  • NCC fines TWM NT$2.4 million

    Before Going to Press | May 25, 21:59

  • China market: 1Q17 TV shipments slip 14% on year, says Sigmaintell

    Before Going to Press | May 25, 21:58

  • CHPT to provide solutions for special-purpose PCBs

    Before Going to Press | May 25, 21:56

  • E Ink Holdings nets NT$0.14 per share for 1Q17

    Before Going to Press | May 25, 21:56

  • TSMC to start equipment move-in at Nanjing fab in September

    Before Going to Press | May 25, 21:43

  • Techman Robot aims to ship 1,000 collaborative robots in 2017

    Before Going to Press | May 25, 21:42

Pause
 | 
View more
Innodisk
Trends and forecasts for the China FPD industry, 2014-2017
The transition to 4k TV - UHD TV market forecast, 2014-2017
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.