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Driver IC backend supply to tighten, says Chipbond chairman

Ingrid Lee, Hsinchu; Jessie Shen, DIGITIMES Asia 0

Fei-Jain Wu, chairman of driver-IC backend house Chipbond Technology, has predicted that demand for wafer probe testing will exceed supply in March 2010. Wu also believes a similar scenario may take place in the chip-on-film (COF) segment, a mainstream...

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