Taipei, Thursday, February 11, 2016 18:57 (GMT+8)
mostly cloudy
Taipei
18°C
Expectations for China's semiconductor industry during the 12th Five Year Plan
Nobunaga Chai, DIGITIMES Research, Taipei [Wednesday 3 August 2011]
Registration required (free) to purchase. Please sign in if you wish to continue.
During the 12th FYP period from 2011-2015, China's semiconductor industry policy will shift away from the pursuit of capacity and output value growth toward a focus on improving R&D capabilities and firms' global competitiveness. A policy of direct government investment will also be replaced by an emphasis on market mechanisms. This DIGITIMES Research Special Report provides comprehensive analyses of the government policies and industry dynamics that will shape China's related semiconductor industries over the next five years.
Abstract
Forecast for the number of China IC design firms during the 12th FYP period (number of firms)

During the 10th and 11th Five Year Plan (FYP) periods from 2001-2010, the China's government listed the semiconductor industry as one of the key industries to be supported.

Spurred on by State Council Rule 18 (2000), major China-based foundry firms such as SMIC, Hejian, Grace, and TSMC's Songjiang operations were founded during the 10th FYP period and began to rapidly expand capacity. The result was that output value for China's merchant foundry industry grew from CNY3.6 billion in 2001 to CNY22.1 billion in 2010, representing an annual compound growth rate of 21%. With this, China's IC manufacturing firms truly took off and entered a period of growth.

While the output value of China's semiconductor industry grew significantly during the 10th and 11th FYP periods, the industry's overall level of competitiveness remained weak. During the 12th FYP period from 2011-2015, China's semiconductor industry policy will shift the emphasis for development away from the pursuit of capacity and output value growth, towards a focus on improving R&D capabilities for advanced technology and advanced capacity. The government's earlier method of pouring funds directly into the industry will also be replaced by an emphasis on strengthening the operations of market mechanisms, in order to foster a group of semiconductor firms with global market share and the capacity for technological innovation.

China's policies on semiconductor development during the 12th FYP period include the Outline of the 12th Five Year Plan for National Economic and Social Development, State Council Rule 32 (2010), the six major measures to develop the software and semiconductor industries, and State Council Rule 4 (2011).

Besides affirming the semiconductor industry as one link in efforts to build infrastructure for next generation IT within the strategy for seven new major strategic industries, these plans also confirmed that semiconductor firms that met the appropriate conditions would be eligible to receive government support; moreover, the government would work to strengthen the industry's capacity for independent technological innovation through a raft of measures to reform tax incentive policy, as well as to improve the function of financial markets.

This report also provides forecasts and analysis regarding the prospects for merchant foundry firms such as SMIC, Huahong NEC, Grace, Huali Microelectronics (HLMC), Jiangsu Changjiang (JCET), Nantong Fujitsu Microelectronics (NFME), Spreadtrum and HiSense, as well as for leading package testing and IC design firms, during the 12th FYP period.

The report concludes with projections and analyses on the prospects for the IC manufacturing and IC design industries in China under the influence of the new semiconductor industry polices of the 12th FYP during the 2011-2015 period.

Table of contents
Price: NT$48,000 (approx. US$1,685)

China smartphone touch-panel industry 2016 forecast

CHINA SMARTPHONE | Feb 6, 17:23

In 2016, China's smartphone panel capacity is expected to increase steadily, with BOE and Tianma expanding 6G capacity and GVO and Truly Optoelectronics increasing their share of handset panel production. This Digitimes Research Special Report analyzes the key...

2016 global AP demand forecast

RESEARCH EXTRAS | Jan 27, 18:12

This Digitimes Research Special Report explains the dynamics of the global AP market by analyzing key trends in the market including the shift to 4G, the market strategy of the key AP vendors and GPU providers and the role various applications have in influencing...

China smartphone market and industry - 4Q 2015

CHINA SMARTPHONE | Feb 5, 15:06

Looking forward to the first quarter of 2016, with both China-based makers and international brands aggressively spreading out their new products including all low, mid, and high cost models on the market in the fourth quarter of 2015, the market will have to...

China smartphone AP shipments - 4Q 2015

CHINA SMARTPHONE AP | Feb 5, 14:41

China's smartphone AP shipments grew 16.1% sequentially in the fourth quarter of 2015 mainly thanks to demand for inventory preparation from some vendors and year-end holidays.

Taiwan LCD TVs – 4Q 2015

TAIWAN DISPLAY SYSTEM | Feb 4, 14:40

Taiwan's LCD TV shipments reached 10.24 million units in the fourth quarter of 2015, increasing 12.0% on quarter but decreasing 5.8% on year.

Innodisk
Taiwan server shipment forecast and industry analysis, 2015
2015 global notebook demand forecast
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.