CONNECT WITH US

Altera, TSMC develop 3D IC test vehicle

Press release, March 22; Jessie Shen, DIGITIMES Asia 0

Altera and TSMC have announced the joint development of what they claim is the world's first heterogeneous 3D IC test vehicle using TSMC's chip-on-wafer-on-substrate (CoWoS) integration process.

The article requires paid subscription. Subscribe Now