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Industry migration to 3D ICs to take place in 2015-16

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Wednesday 5 September 2012 0

The industry's gradual migration toward 3D ICs with through-silicon vias (TSV) is unlikely to happen until 2015 or 2016, according to sources at semiconductor companies. Volume production of 3D ICs was previously estimated to take place in 2014, the...

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