Taipei, Tuesday, June 27, 2017 09:52 (GMT+8)
thunderstorms
Taipei
34°C
AMD announces new R-series CPUs and discrete AMD Radeon GPU bundle
Press release, August 21; Joseph Tsai, DIGITIMES [Wednesday 21 August 2013]

AMD has announced new CPU offerings for the AMD Embedded R-series high-performance computing platform, along with the introduction of a discrete GPU promotional program.

The new options include quad-core and dual-core CPUs scaling from 2.2GHz to 3.2GHz with TDP ranging from 17-35W for applications that require high performance x86 compute such as network attached storage (NAS). To address high-end visual needs for applications like digital gaming and signage that require high-performance x86 compute coupled with discrete graphics, AMD is introducing a new discrete GPU promotional program that provides customers with both a CPU and discrete GPU for savings of up to 20%.

The new AMD R-series CPUs offer up to 2.5X greater performance-per-dollar compared to Intel i3 processors, AMD claimed. The discrete graphics promotional program combines new AMD R-series CPUs with discrete AMD Radeon E6460 or E6760 graphics for driving up to six independent displays. These new options are designed to provide cost-effective solutions for maximum compute and graphics capabilities.

The new AMD Embedded R-series CPU options are currently available, with products from Advantech, Advantech-Innocore, Aewin, DFI, MSC Embedded, Quixant and other ODMs.

AMD Embedded R-series CPU specifications

CPU

Core

TDP

Frequency

Max boost frequency

RE464X

Quad-core

35W

2.3GHz

3.2GHz

RE272X

Dual-core

35W

2.7GHz

3.2GHz

RE264X

Dual-core

17W

2.2GHz

2.8GHz

Source: Company, compiled by Digitimes, August 2013

AMD Embedded R-series CPU

AMD Embedded R-series CPU
Photo: Company

Realtime news
  • SMIC mass producing 28nm HKMG chips

    Bits + chips | Jun 26, 20:45

  • China economy, society to fully embrace 5G

    Mobile + telecom | Jun 26, 20:36

  • Taiwan market: FET to enhance IoT deployment

    Mobile + telecom | Jun 26, 20:18

  • Acer CloudProfessor adopted in California

    Before Going to Press | 12h 29min ago

  • 4 workers die in accident at Unitech plant

    Before Going to Press | Jun 26, 20:57

  • Yield rates, OLED supply may be key in new iPhone shipments

    Before Going to Press | Jun 26, 20:41

  • CoolBitX Technology cooperates with KT to promote SLEKT

    Before Going to Press | Jun 26, 20:06

  • Supply of a-Si LCD to become tight in 2H17

    Before Going to Press | Jun 26, 18:58

  • Global investment in VR startup business in 1H17 exceeds that in 2016

    Before Going to Press | Jun 26, 18:57

  • China Big Fund commits investment of US$85 billion

    Before Going to Press | Jun 26, 18:50

  • Startups showcase results under Vive X program

    Before Going to Press | Jun 26, 18:49

  • Certification service provider IST expanding materials analysis solutions

    Before Going to Press | Jun 26, 18:45

  • HTC to set up Vive X incubation center in Israel

    Before Going to Press | Jun 26, 18:43

Pause
 | 
View more
WCIT
Intel strategies in the mobile device market
Analysis of China revised domestic semiconductor industry goals
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.