The development of the IoT industry in recent years from smartphones to wearable devices has accelerated the need for miniaturized components and advanced processing technologies. Through the integration of key manufacturing technologies, Chilisin has been able to dramatically improve inductor performance while downsizing. In the highly competitive environment today, the pursuit of miniaturization has become the trend to success.
HEI160808 mini molding choke demonstrates leading innovation
The miniaturization trend of components began with the evolution of smartphones. Increasing functions in smartphones are increasingly demanding higher battery usage and hence, larger battery size. Under such circumstances, aside from batteries, all other components within a smartphone are met with a downsizing requirement. In 2013, Chilisin successfully developed the HEI (High Efficiency Inductor) series molding power choke which received notable industry recognition and approval by large international smartphone makers due to its superior performance characteristics. This year, Chilisin is launching the new HEI160808 in 1.6 x 0.8 x 0.8mm dimensions, an even smaller version of the power choke. This new product has already entered into the mass production stage and has been adopted in some of this year's newly released smartphone models. Customer satisfaction and leading technological capability especially in the smartphone sector strongly reinforces Chilisin's competitive positioning and growth momentum in the coming year.
Newly-launched MTF100505 to challenge the limits of thin-film manufacturing process technology
In the second half of 2015, Chilisin expects to launch the molding thin-film inductor MTF 100505. This product uniquely utilizes tiny film sheets as coils inside a tiny molded case, a process made only possible via advanced thin-film technology in combination with molding technology. The end result is further downsizing from the previous HEI series molding power choke to achieve 1.0 x 0.5 x 0.5 mm dimensions, the smallest possible power inductor for use in smartphones. Chilisin's President Mr. Jack Chung has indicated the Company does not only seek to miniaturize components, but also to achieve a high standard of quality and more importantly to deliver superior performance characteristics in order to build long-term relationships with customers.
New highlights of high-frequency wire-wound inductors: CS0201 and CHQ0402
For smartphone high-frequency application, Chilisin is unveiling two newly developed miniaturized inductors. Firstly, the CS0201 series, produced using high-precision wire-winding technology, has already entered into mass production stage. On the other hand, the CHQ0402 series, produced using multilayer technology, will be ready for sampling at the start of the fourth quarter. Both of these products are among the smallest of their kind in the industry, so small that it is barely visible to the naked eye. Once again, these products demonstrate Chilisin's success towards product miniaturization in light of the IoT era.
Miniaturization trend and growing automotive segment to act as double-engine to drive future
Chilisin's innovation and technological leadership in the miniaturization trend lies in having four core process technologies, including thin-film, multilayer, molding and wire-winding production methods. Chilisin's favorable position in the mobile segment began with early-on efforts to penetrate high-end smartphone and other wearable device markets. Efforts to improve fundamental production technologies, build capacity, maintain close industry analysis and supplier relationships have well prepared Chilisin to deliver innovative products to the market on such a key timing and to secure its leading position on the market.
Concerns about the strength of the global economy has weighed on the market in the second half of the year as electronic and component makers worldwide struggle to sustain revenue growth. Despite a downbeat atmosphere, Chilisin delivered an impressive 25% YoY growth rate on revenue from January to July. Notably in July, revenue from overseas markets (ex-Greater China region) has, for the first time in Company history, surpassed revenue from the China market. Successful developments of large international customers have attributed to such a rapid growth for overseas divisions, where the revenue target for the full year has already been surpassed in three quarters. In terms of application segment, Chilisin is focusing largely on three of the five main segments, including mobile, automotive and networking to be the growth drivers into 2018. Developments in product innovation will continue to bring Chilisin's product offerings in line with Japanese competitors, with certain product sectors such as the molding power choke series surpassing Japanese peers. Newly established sales offices in the Eastern United States and Southeast Asia will be supporting the rapid growth rate of the Company. To end the note, Chilisin's President Mr. Jack Chung stated that under the moving puzzles of the industry, quality is the constant benchmark that must be upheld in order to guarantee success.
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