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TSMC enhances backend CoWoS technology

Julian Ho, Taipei; Jessie Shen, DIGITIMES Asia Friday 26 October 2018 0

Taiwan Semiconductor Manufacturing Company (TSMC) has made progress in enhancing its backend chip-on-wafer-on-substrate (CoWoS) technology to support diverse high-performance computing (HPC) applications. The pure-play foundry is expected to begin volume...

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