CONNECT WITH US

TSMC, Broadcom enhance CoWoS platform with 2X reticle size interposer

Jessie Shen, DIGITIMES, Taipei 0

TSMC announced on March 3 the foundry has collaborated with Broadcom on enhancing the chip-on-wafer-on-substrate (CoWoS) platform to support the industry's first and largest 2X reticle size interposer.

The article requires paid subscription. Subscribe Now