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Qualcomm, MediaTek mull fan-out packaging for flagship handset APs

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Wednesday 21 April 2021 0

Qualcomm and MediaTek are both considering adopting fan-out PoP in the production of their flagship smartphone application processors, following in the footsteps of Apple utilizing TSMC's InFO_PoP technology to package its iPhone chips, according to...

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