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TSMC showcases world's first 0.13-micron wafer
Photo: Cage Chao, DigiTimes [Mar 23, 2006]

The world's first 12-inch wafer fabbed using a 0.13-micron process, produced by Taiwan Semiconductor Manufacturing Company, is on display at the company's booth at Semicon China.

Categories: Bits + chips

Tags: IC manufacturing TSMC

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