Taipei, Thursday, April 24, 2014 20:22 (GMT+8)
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TSMC chairman Morris Chang shows 300mm wafer technology at SemiTech
Photo: Vyacheslav Sobolev, DigiTimes [May 4, 2006]

TSMC chairman Morris Chang shows a 300mm wafer with copper pad and bumping, made by TSMC, to Taiwan's Premier Su Tseng-chang at SemiTech Taipei 2006

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