Taipei, Thursday, July 24, 2014 14:45 (GMT+8)
mostly cloudy
Taipei
32°C
Applied Producer InVia dielectric deposition system
Photo: Company [Mar 31, 2010]
Applied Producer InVia dielectric deposition system

Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system.

Using a proprietary CVD process, the InVia system delivers an innovative method for depositing the critical oxide liner film layer in high aspect ratio (HAR) through-silicon via (TSV) structures.

Implemented on Applied's Producer GT platform, the InVia system has much higher throughput than batch furnaces, with the capability to process up to eight times more wafers per hour at less than half the cost, especially when depositing very thick liners for high performance applications, the company said.

DIGITIMES Research Tracker Services
2014 global mobile application processor market forecast