Samples of eight Benand products in two capacities, 4Gb and 8Gb, are now available with mass production slated for March 2012.
The ECC has been embedded in the host processor and corrected 1 bit per 512 bytes. However, advances in memory process technology require enhanced error correction; more than 4 bit correction per 512 bytes for NAND flash fabricated with 32nm process. For NAND flash memory without ECC fabricated with 32nm and beyond, the controller in the host processor must be changed to secure the required level of correction.
Benand removes the burden of ECC from the host processor while minimizing protocol changes and allowing host processors to support leading-edge process NAND flash memory in a timely manner. Benand embeds an ECC with an error correction of 4 bit per 512 bytes onto Toshiba's 32nm process SLC NAND flash memory. Package and pin configuration compatibility are assured with general SLC NAND flash, allowing easy replacement of existing products.
Toshiba plans to expand the Benand lineup to include 24nm process NAND flash memory products after summer 2012. Adding SLC embedded NAND flash memory expands the company's line-ups and offers customers more choices, and will support Toshiba's advances in memory business.
- GIGABYTE Launches the BRIX Ultra Compact PC Kit
- AEWIN Introduces Newest Multiplayer Gaming System SGA-5010
- Carry Technology Highlights Thunderbolt and Wi-Fi Card Reader Series
- Imagination says third party IP becoming a key driving force for silicon vendors
- EverFocus launches ECOR960 X1 16CH with better image quality and more affordable price
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Chilisin introduces Thin-film chip inductor 0201 size
- Chilisin at 2012 electronics Munich A5/159 & 260
- Chilisin sunken-type molded power inductor for MXM Graphic application
Digitimes recently interviewed Bert Gyselinckx, general manager of the Holst Centre in Eindhoven, to...
Chaintech, a motherboard/graphics card maker, which quit the market once and returned recently, has...
Digitimes recently spoke with Karen Lightman, the executive director of MEMS Industry Group (MIG),...
In a relentless competition against rivals including Qualcomm, Nvidia and Media in the smartphone chipset...
- Smartphone and tablet industry: The view from Taiwan - May 2012
Taiwan-based companies have a long and successful history of involvement in the supply chain for mobile devices, which for the purposes of this article consist...
- Taiwan motherboard industry overview - May 2012
The year 2011 saw the motherboard industry reverse its trend of declining shipments year-on-year, to post a slight 0.2% growth. This upturn in fortunes was expected...
- Notebook market overview - Jun 2011
The notebook industry in 2010 experienced several major events that significantly changed the industry's ecosystem for the year and the industry is also believed...
- LCD TV overview - Jun 2011
Growth of the global LCD TV market was not as strong as expected in 2010 as the market continued to feel the aftershocks of the economic recession that had hit...