Taipei, Thursday, April 24, 2014 02:23 (GMT+8)
light rain
Taipei
21°C
VIA COMe-8X92 system-on-module solution
Photo: Company [Mar 30, 2012]

VIA Technologies has announced two latest additions to the VIA Modular Solutions portfolio, the VIA COMe-8X92 and the VIA QSM-8Q90. The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles allowing customers to rapidly develop new and exciting devices.

Measuring 95x95mm, the VIA COMe-8X92 is based on the industry standard Computer-on-Module (COM) Express Compact form factor, developed and maintained by the PCI Industrial Computer Manufacturers Group (PICMG). The VIA COMe-8X92 module combines a 1.2GHz VIA Nano X2 E-series dual-core processor and the VIA VX900H media system processor (MSP) providing a ruggedized solution targeted at industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, industrial automation and digital signage.

The VIA COMe-8X92 module also offers support for the latest connectivity standards including 18/24-bit single-channel LVDS, VGA, Display Port and HDMI with onboard I/O includes two SATA II ports, one GigaLAN port, one USB client port (shared with one of four USB 2.0 ports), four USB 2.0 ports, SDIO, expansion buses for one PCIe X4 and one PCIe x1 and the VIA Labs VL800 USB 3.0 host controller which offers support for four USB 3.0 ports. System memory support includes one slot for up to 4GB of SODIMM DDR3 RAM.

2014 China smartphone market and industry
DIGITIMES Marketing Services
2014 global smartphone market forecast