Taipei, Thursday, June 20, 2013 13:30 (GMT+8)
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Taipei
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Winbond TS16949-certified, AEC-Q100-qualified serial flash memory
Photo: Company [Mar 2, 2012]
Winbond has announced that the firm will provide its TS16949-certified AEC-Q100-qualified serial flash memory devices - featuring densities from two megabits to 256 megabits - to global equipment makers in the automotive-electronics market.

Winbond's 90nm AEC-Q100 qualified automotive grades SpiFlash memories are available now in densities up to 128Mb. Industrial Grade Plus is also available for less stringent automotive applications. A 58nm family of SpiFlash starting with densities up to 256Mb will be introduced later in 2012, as will Winbond's 90nm parallel NOR flash memories, also up to 256Mb.
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20-Jun-2013 markets closed

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Trends in China IC design industry in 2013
Trends in China LED chip and packaging sector
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