If you define mixed signal as being where more than 30% of a die is doing analog or RF work, we are seeing a dramatic rise in mixed-signal designs. Over the next year, it has been said that mixed-signal designs will account for about 70%-80% of designs on all process nodes down to 22nm (according to Mentor Graphics). These analog parts of the designs include functions like multiple clocks in application processors; or HDMI, USB and SerDes in I/O circuits. These types of functionality are taking up an increasing part of the die and changing the rules of the game. It used to be that digital would first go to volume production on a manufacturing node and when the node matures, analog would follow. Now analog had to go to volume at the same time as digital. There is no choice when they are all on the same die.