Taipei, Thursday, April 17, 2014 08:58 (GMT+8)
sunny
Taipei
25°C
Apple new iMac all-in-one PC
Photo: Company [Nov 2, 2012]

Apple has unveiled a new iMac. The machine features Intel's third-generation quad-core processors, Nvidia graphics and an new storage option called Fusion Drive.

The new iMac comes in an aluminum and glass enclosure with up to 40% less volume than its predecessor and an edge that measures just 5mm thin, Apple said.

The new iMac also features a reengineered display that reduces reflection by 75% while maintaining its color and contrast, according to the vendor. In the new design, the cover glass is fully laminated to the LCD and an anti-reflective coating is applied using a high-precision plasma deposition process. Every iMac display is individually color calibrated using a spectroradiometer.

The new iMac features third-generation quad-core Intel Core i5 processors that can be upgraded to Core i7. The latest Nvidia GeForce graphics processors deliver up to 60% faster performance for advanced gaming and graphics intensive apps, Apple said. Every new iMac now comes standard with 8GB of 1600MHz memory and a 1TB hard drive, and customers can choose to configure their iMac with up to 32GB of memory and a new 3TB hard drive, or 768GB of flash storage.

Fusion Drive is a new storage option that gives customers the performance of flash storage and the capacity of a hard drive. It combines 128GB of flash with a standard 1TB or 3TB hard drive to create a single storage volume that manages files.

Global tablet tracker
China FPD industry, 2013-2016
2014 global mobile application processor market forecast
  • Trends in the upstream LED equipment and materials industries, 2H13

    This report examines the outlook for upstream, which includes MOCVD equipment, rare earth materials and sapphire substrates, is also particularly significant as an indicator of trends in the LED industry as a whole over the next year.

  • TD-LTE market developments and forecast, 2014-2016

    TD-LTE has become the mainstream global choice for the construction of 4G asymmetric frequency spectrum networks. This Digitimes Research Special Report examines the current global status of TD-LTE, and forecasts developments in the TD-LTE supply chain in China and worldwide through 2016.

  • ASPs of TD-LTE chips to remain stable initially as suppliers are limited

    While a number of IC vendors have begun shipping chips supporting TD-LTE, including base band chips, radio frequency chips, APs, SoC solutions and soft modems, shipments of base band chips account for a majority share of total TD-LTE chip shipments currently, according to Digitimes Research.