Corning supplies LGE with Gorilla glass for new ultra-slim premium mobile PC
Press release, staff reporter, DIGITIMES [Tuesday 16 March 2010]
CORNING, N.Y., March 15, 2010 - Corning Incorporated (NYSE:GLW) announced today that Corning's Gorilla glass has been designed into the LG X300, a newly released premium mobile PC. This lightweight device packs portable computing technology into an ultra-slim form. It measures just 17.5 millimeters (mm) thick and weighs roughly 2 pounds, giving users convenient portability. Corning's Gorilla glass enables the unique edge-to-edge cover design and allows the device to remain thin and lightweight.
Harrison Park, general manager, PC Division, LG Electronics said, "Slim, lightweight mobile PCs will be the main trend this year. By using Corning's Gorilla glass, we were able to design a thinner device with a durable and strong display."
"Laptop makers are challenged with designing thinner and lighter devices and Corning's Gorilla glass is helping them succeed," said Jim Steiner, senior vice president, Corning Specialty Materials. "The unique properties of Gorilla glass allow for reduced thickness and weight without compromising durability."
Gorilla glass is an environmentally friendly protective window used in high-end display devices including cellular phones, laptop and tablet computers, and mobile devices. With a variety of available thicknesses, ranging from 0.5mm up to 2.0mm, Gorilla glass offers a lightweight and durable design that compliments the needs of premium devices such as the LG X300. This aluminosilicate glass is produced with Corning's proprietary fusion-draw process, which enables the production of uniform thin sheets with a pristine surface and is also adaptable to scalable sheet sizes for optimal throughput. During finishing, Gorilla glass undergoes a chemical strengthening process that gives it the unique properties which make it especially suited for use as a durable, scratch-resistant liquid crystal display (LCD) cover. These benefits allow Corning customers to optimize their device design and fabrication efficiencies.