Indium Corporation and Duksan Hi-Metal form strategic alliance for SACM solder balls
Press release [Friday 19 July 2013]
Indium Corporation and Duksan Hi-Metal Co., Ltd. announce a formal agreement to facilitate the global supply of an advanced alloy technology used to manufacture solder balls (spheres) for semiconductor packages. SACM, a novel alloy composition developed by Indium Corporation, provides the foremost reliability performance in terms of both drop-shock and thermal cycling.
Solder joint architectures that utilize both SACM solder paste and SACM solder balls realize the maximum value of this alloy technology. Duksan Hi-Metal, the second largest solder ball supplier in the industry, provides cost-effective manufacturing capability for SACM solder balls, coupled with world-class quality.
"We couldn't be any happier with our selection of Duksan Hi-Metals as our strategic partner to bring SACM balls to market," said Chris Bastecki, Indium Corporation's Associate Director of Electronics Assembly Materials. "The challenge of effectively and repeatedly incorporating the proprietary dopant into SACM solder balls is quite complex. The engineers at Duksan have demonstrated great skill and capability with their ability to scale the process up to a viable commercial process within a short period of time."
"We are very pleased to be able to offer our customers SACM technology," said Perry Kim, Director of Sales for Duksan. "Our customers are continuously challenged to improve reliability, avoid the need for board level underfills, and extend the use of semiconductor packages to larger die sizes. If we can enable our customers to realize these improvements through the cost-effective application of SACM solder balls, we are happy to help."
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
Duksan Hi-Metal Co., Ltd. was established in 1999 and manufactures solder balls for BGA and CSP assemblies. Headquartered in Korea, they have business relationships with customers in China, Japan, Taiwan, the Philippines, Singapore, and Europe. Duksan is ISO 14002:2000 certified.
For more information about Indium Corporation, visit http://www.indium.com/ or email email@example.com.
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