Orbotech Ultra Fusion 600 delivers advanced performance with high speed for IC substrates down to 5μm
Press release [Thursday 24 October 2013]
Orbotech Ltd., a leading global provider of yield-enhancing and production solutions for printed circuit boards (PCBs) and IC substrates, announced the introduction of Ultra Fusion 600 designed for the high speed inspection of IC substrates down to 5μm.
"We are working closely with our customers to develop the digital-based tools that enable them to push the boundaries of technology innovation, while reducing cost", said Mr. Richard Klapholz, President of the PCB Division at Orbotech Ltd. "This new model in our Ultra Fusion product line represents the most advanced inspection performance available in the market with the throughput required for mass production of packaging components."
Featuring Orbotech's powerful Multi-Image Technology with specially designed capabilities for advanced IC substrates, Ultra Fusion 600 achieves the highest levels of inspection accuracy and operational efficiency for successful production of today's challenging designs. The system utilizes an innovative optical head to accommodate the requirements of semi-additive process (SAP/MSAP) and flip-chip structures. With patented, LED based 3-D illumination, Ultra Fusion 600 ensures full uniformity light coverage over all objects on the surface of the IC substrate, providing greater inspection clarity than possible with conventional 2-D lighting solutions. The system's micro defect detection identifies fine and critical shallow shorts. To overcome the limitations of a standard, off-the-shelf lens, Ultra Fusion 600 utilizes a custom-developed lens which enables variable resolution. Dynamic focus ensures superior image quality on warped panels in high magnification. The system has the full flexibility to inspect all IC Substrates types, from the most advanced FC-BGA to typical CSP applications, and optimizes throughput according to each job's line/space features.
Orbotech Ultra Fusion 600
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