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Indium Corporation technology experts to present at IPC Southeast Asia High Reliability Conference

Press release [Friday 8 August 2014]

Indium Corporation's Sze Pei Lim, technical manager - Southeast Asia; and Sehar Samiappan, area technical manager, will present at the IPC Southeast Asia High Reliability Conference on August 20 in Penang, Malaysia.

Sze Pei will present Alloy and Process Optimization for Low-Ag Solders, which reviews the critical challenges associated with SAC305 solder alloy, including high processing temperatures, high cost and price volatility, and poor resistance to mechanical shock. She will also discuss how doped low-Ag alloys can be used as a drop-in replacement to SAC305 with cost and reliability advantages.

Sehar will present Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues. This presentation discusses an experiment that studied the effect of reflow profiling on the electrical reliability of no-clean flux residues that can be measured using IPC J-STD-004[1] surface insulation resistance (SIR) testing. Both a halogen-free (ROL0) and a halogen-containing (ROL1) Pb-free no-clean solder paste, exposed to various reflow profiles, were used.

The IPC Southeast Asia High Reliability Conference is a one-day event featuring practical methodologies that can be deployed today. Industry experts representing every market sector will discuss solder technology, cleaning, test, and inspection strategies. For more information, visit http://www.ipc.org/.

Sze Pei manages Indium Corporation's technical teams throughout the Asia-Pacific region. She joined Indium Corporation in 2007. She earned her bachelor's degree in Chemistry from the National University of Singapore, and has 17 years of experience in the SMT and PCB assembly industries.

Sehar provides field technical support to Indium Corporation's customers. He conducts process evaluations, product trainings, designs of experiments (DOEs), and helps diagnose productivity issues in the factories. Sehar is an electrical engineer with over 18 years of experience, mainly in the areas of process, failure analysis, and production. He earned his bachelor's degree in electrical and computer engineering from the University of Texas and is an SMTA-certified process engineer and has earned his Six Sigma Green Belt.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit http://www.indium.com/ or email abrown@indium.com


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