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Thursday 18 January 2024
IC backend houses expect demand to revive in 2H24
IC backend houses anticipate a resurgence in demand during the latter part of 2024 after a disappointing 2023.
Friday 5 January 2024
Market cap performance of TSMC, Intel, UMC, and ASE show GenAI influence
Generative AI was behind Nvidia's 240% surge in market cap in 2023, and the effect also trickled down to foundry manufacturers and packaging & testing service providers in the...
Wednesday 3 January 2024
IC backend firms put focus on AI chips, CPO
Semiconductor demand is improving gradually, with IC packaging and testing houses expressing optimism about market prospects for 2024 and focusing on AI chips and Co-Packaged Optics...
Wednesday 27 December 2023
ASE to acquire facilities from subsidiary for packaging capacity expansion
OSAT Advanced Semiconductor Engineering (ASE) will acquire facilities from its fully-owned subsidiary ASE Test to boost packaging capacity, according to the former's parent company,...
Thursday 21 December 2023
ASEH on track to grow in 2024, driven by advanced packaging
OSAT ASE Technology Holdings (ASEH) is on track to increase sales in 2024 as a result of strong demand for advanced packaging and a recovery in demand from consumer device applications,...
Monday 18 December 2023
Taiwan-based chip companies expanding in Malaysia
Amid the ongoing geopolitical tensions that hit the global chip supply chain, Taiwan-based semiconductor equipment and material suppliers are accelerating their investments in Mala...
Wednesday 13 December 2023
ASE, KYEC look to AI chips for 2024 growth
OSATs may see inventory adjustments last into the first half of 2024, longer than other semiconductor sectors, but demand for AI chips will fuel their growth next year, according...
Tuesday 7 November 2023
ASE, TSMC eyeing SiPh
Major Taiwanese semiconductor firms, such as TSMC and ASE Technology, have been working on silicon photonics (SiPh), which could propel Taiwan to the forefront of the sector.
Thursday 2 November 2023
Heterogeneous integration and system-level integration seen as 'next step' in advanced packaging era
With TSMC's CoWoS and the 2.5D advanced packaging from OSAT companies becoming a hot topic due to capacity shortages, advanced packaging solutions are seen as the next big thing.
Wednesday 1 November 2023
UMC launches 3D IC project in collaboration with partners
United Microelectronics (UMC) has launched a wafer-to-wafer (W2W) 3D IC project with partners including Advanced Semiconductor Engineering, Cadence, Faraday Technology, and Winbond...
Tuesday 24 October 2023
Chinese SiC players rising rapidly, likely to change global market landscape
In the near future, Chinese players in the silicon carbide (SiC) sector will have the opportunity to break the current shortage of mainstream 6-inch wafers and usher in a new landscape...
Wednesday 18 October 2023
USI sees supply-side challenges facing future cars
Future cars have emerged as a major global technology trend, but chip shortages and other supply-side issues may hinder progress, according to Universal Scientific Industrial (USI),...
Friday 13 October 2023
Android smartphone makers begin to restock their chip inventories
Android smartphone makers have recently resumed stockpiling, primarily of old-generation chips from first-tier SoC suppliers such as MediaTek, according to industry sources.
Thursday 12 October 2023
Backend firms upbeat about demand for new PS5
Backend companies are positive about demand for Sony's new slimmed-down PlayStation 5 (PS5), which will hit the shelves in mid-November, according to industry sources.
Thursday 12 October 2023
OSATs to see AI chip demand fuel growth in 2024
Although major Taiwan-based OSATs experienced a decline in total revenue for 2023 through September, market sources state that they are gearing up for an anticipated rise in demand...
Research Report Database
Summary of Tech Supply Chain News!
Taiwan foundry industry revenues to slip in 1Q24 before rising in 2Q24, says DIGITIMES Research
Research Insight: Intel obtains subsidies but faces challenges
South Korea-based makers lead transparent display as China-based competitors ramp up Inkjet investments, according to DIGITIMES Research