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Tuesday 4 July 2023
Robust advanced chip demand to boost Taiwan supply chain, says ASEH
Taiwan's industry supply chain remains competitive in the advanced chip market, which is expected to be undersupplied over the next three to five years, according to Tien Wu, COO...
Monday 3 July 2023
China-based JCET expands advanced packaging business to take on ASE and TSMC
As the geopolitical tensions between the US and China are leading to reshaping the global supply chain landscape, China-based JCET is looking to grab a bigger pie of the rising Chinese...
Friday 30 June 2023
Taiwan companies seek opportunities in US network broadband infrastructure
Taiwan-based optical communications device makers and IC backend houses are looking to capitalize on opportunities presented by the expansion of network broadband infrastructure in...
Thursday 29 June 2023
IC backend industry supply chains in Eastern Europe, Southeast Asia expanding
As semiconductor firms such as IDM Intel and OSAT ASE Technology increase their local investments, packaging and testing supply chains are expanding in Eastern Europe and Southeast...
Wednesday 28 June 2023
ASEH sees growing strategic significance of semiconductors
As geopolitical tensions intensify, the strategic significance of semiconductors will increase over the next decade, according to Tien Wu, COO for ASE Technology Holding (ASEH).
Tuesday 27 June 2023
USI gearing up for EV demand boom
Universal Scientific Industrial (USI), a wholly-owned subsidiary of ASE Technology (ASEH), has disclosed that it is committed to integrating the production of powertrain systems,...
Monday 26 June 2023
Demand recovery for large-size displays benefiting peripheral IC supply chain
Large-size displays such as TVs have seen demand recover earlier than smaller ones for handset, notebook and other consumer electrics devices after becoming the first to enter inventory...
Friday 16 June 2023
AMD backend partners gearing up for new processors
TSMC, ASE Technology and Tongfu Microelectronics (TFME), as well as test interface specialists WinWay Technology and Chunghwa Precision Test Tech (CHPT) are all gearing up for shipments...
Tuesday 13 June 2023
Taiwan OSATs see slight recovery in capacity utilization
Taiwanese OSATs such as ASE Technology, Powertech Technology (PTI), and King Yuan Electronics (KYEC) have experienced modest increases in capacity utilization, with their second-...
Monday 12 June 2023
SoIC technology enhances TSMC cooperation with OSAT players
TSMC's 3D Fabric advanced packaging and testing plant, AP6, has officially started operation. Advanced packaging and testing providers have indicated that the 3D Chiplet and System-on-Integrated-Chip...
Friday 9 June 2023
OSATs eyeing chiplet opportunities
ASE Technology and other OSATs capable of providing advanced packaging technology are all gearing up for a boom in demand for chiplets.
Friday 2 June 2023
ASE intros FOCoS-Bridge for AI and HPC chips
Advanced Semiconductor Engineering (ASE) has announced its latest fan-out-chip-on-substrate-bridge (FOCoS-Bridge) technology innovation, which involved qualifying a large 70x78mm...
Tuesday 30 May 2023
Advanced packaging demand for AI and HPC processors to rise
TSMC's CoWoS, ASE Technology's FOCoS, and other advanced packaging technologies are expected to draw an influx of orders for AI and HPC processors, according to industry sources.
Wednesday 24 May 2023
IC backend houses to deepen deployments in Southeast Asia
Taiwan-based OSATs such as ASE Technology, and IC test interface specialists including Chunghwa Precision Test Tech (CHPT) and WinWay Technology, have all expanded their operations...
Monday 22 May 2023
ASE lands Broadcom orders for silicon photonics-based networking chips
Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have officially joined the supply chain of silicon photonics high-speed networking chips...
2024 eXtended Reality Korea
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