Chipbond 12-inch gold bumping lines to operate at full capacity in September

Sep 11, 16:33

LCD driver IC packaging and testing firm Chipbond Technology will see its 12-inch gold bumping lines operate at full capacity in September thanks to orders from Renesas Electronics,...

Chipbond 3Q12 sales driven by demand for small-size panel driver ICs

Aug 21, 01:15

Consolidated revenues at Chipbond Technology are set to increase 5-10% sequentially in the third quarter of 2012, driven by strong demand for its 12-inch bumping services used for...

Chipbond gold bumping capacity booked for iPhones, says report

Newswatch - Jun 29, 12:37

Chipbond Technology reportedly has cut into the supply chain for Apple's iPhone 5 through providing backend services for the LCD driver ICs used in the upcoming iPhones with retina...

Chipbond lands 8-inch gold bumping orders from Samsung, says paper

Newswatch - Jun 4, 14:23

LCD driver IC packaging and testing specialist Chipbond Technology reportedly has landed orders for 8-inch gold bumping from Samsung Electronics with shipments to begin in the third...

Chipbond, ChipMOS develop alternative to gold bumping

Jan 3, 11:53

Chipbond Technology and ChipMOS Technologies have both adopted Cu/Ni/Au bumps for LCD driver IC packaging to significantly reduce gold use, according to the companies. The method...

PTI developing advanced packaging technologies

Jul 1, 01:10

Packaging and testing firm Powertech Technology (PTI) expects the development of new technologies including wafer-level packaging, 3D IC packaging and copper pillar bumping to bear...

Major Taiwan IC backend firms developing copper pillar bumping

Jun 27, 13:54

Major IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and memory packaging and testing specialist Powertech Technology (PTI), have...

Shortage of iPad 2 bumping up gray import prices

Mar 14, 16:38

Prices for Apple's iPad 2 in Korea or Hong Kong, where the device has not yet been launched, are being marked at about US$700-1,000, close to double Apple's original price, as Apple...

Chipbond gearing up to expand capacity for 12-inch wafers

Mar 3, 15:05

With more LCD driver IC firms moving from 8-inch wafers to 12-inch, backend service provider Chipbond Technology is set to expand capacity for 12-inch wafers in 2011, according to...

Taiwan-based LCD driver IC designers to adopt 12-inch processes soon

Nov 12, 01:25

LCD driver IC design houses will transition into 12-inch processes at the end of 2010 to the first quarter of 2011. Chipbond Technology is currently the only backend chip packager...

ChipMOS to expand into 12-inch gold bumping

Oct 5, 14:14

Packaging and testing house ChipMOS Technologies (Bermuda) has revealed plans to add a new, 12-inch gold bumping production line in Taiwan with the installation set to complete by...

Solder material maker Shenmao plans 10% price rise

Aug 31, 15:20

Shenmao Technology plans to raise the prices of its solder bumping paste products by 10% to reflect the rising prices for solder, according to the company.

UAT tripling wafer bumping capacity

Jul 13, 11:52

Wafer-bumping service provider Unisem Advanced Technologies (UAT) has doubled the floor space of its plant in Ipoh, Malaysia, with a capacity to be three times its current level,...

Driver IC packager Chipbond at almost full capacity on strong demand ahead of holiday season

Jun 23, 11:00

Chipbond Technology has revealed it is currently running at near full capacity for COF (chip-on-film) and COG (chip-on-glass), and utilization for bumping has risen to 85-90%. Customers...

Solder material supplier Shenmao expects strong 2Q10

Mar 16, 15:49

Shenmao Technology, a solder bumping paste supplier, has said revenues for the second quarter are expected to hold level or grow from the first quarter. Revenues for the ongoing first...

Chipbond sees January 2010 sales up 24% on month

Feb 11, 16:26

Chipbond Technology has announced revenues for January 2010 grew 23.61% sequentially to NT$608 million (US$18.93 million). The LCD driver IC packaging and testing house projected...

Solder material supplier Shenmao enjoys sequential revenue growth in January

Feb 10, 14:01

Shenmao Technology, a solder bumping paste supplier, has announced consolidated revenues for January 2010 grew 8.27% sequentially and 132.06% on year to NT$534 million (US$17 million)...

Chipbond August 2009 revenues hit high

Newswatch - Sep 8, 14:39

Driver IC packaging and testing firm Chipbond Technology saw its monthly revenues hit a record of NT$640 million (US$19.5 million) in August, representing a 52.5% increase from NT$420...

Driver IC backend suppliers upbeat about 3Q09

Sep 2, 14:29

Chipbond Technology is performing better than previously expected in the third quarter of 2009, thanks to growing demand from IDM customers, according to the company. The driver IC...

Integrated handheld solutions driving demand for wafer-level packaging, says ASE

Apr 13, 16:00

Handheld devices incorporating functionality such as Bluetooth, FM radio, GPS and Wi-Fi have become the market driver for wafer-level packaging (WLP), Taiwan's Advanced Semiconductor...

Stable solder prices help increase Shenmao margin

Feb 10, 17:14

Solder prices have stayed around US$11,000 per ton for 3-4 months, helping increase electronic material supplier Shenmao Technology's gross margin. Shenmao expects to see better performance...

Shenmao profits jump on lower raw material costs

Aug 19, 16:15

After dealing with rising raw material costs and exchange loss in the first quarter, Shenmao Technology, the number-one bumping solder paste supplier in Taiwan, had 272% sequential...

Shenmao bumping paste prices up since March

May 28, 12:31

Shenmao Technology, a solder bumping paste supplier, started raising its average selling prices (ASPs) since March to reflect higher metal costs. The company has also decided not...