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News tagged bumping
  • Last update: Wednesday 25 October 2017 [50 news items]

SPIL posts EPS of NT$1.74 for 1Q-3Q17

Oct 25, 13:27

IC packaging specialist Siliconware Precision Industries (SPIL) saw its net profits for the first three quarters of 2017 decline 23.8% from a year earlier to NT$5.41 billion (US$178.7...

Chipbond posts record 3Q17 revenues

Oct 13, 10:52

Chipbond Technology's consolidated revenues climbed to a record high of about NT$5 billion (US$165.3 million) in the third quarter of 2017. Market watchers expect the company to post...

SJSemi, Qualcomm announce qualification of 10nm ultra-high density wafer bumping technology

Sep 18, 11:08

China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...

Chipbond, ChipMOS see rising orders for TDDI chips

Aug 25, 12:19

Backend houses Chipbond Technology and ChipMOS Technologies have seen orders for TDDI (touch with display driver integration) chips for use in 18:9 smartphone panels ramp up, which...

SPIL to invest US$25 million in China

Aug 15, 10:27

Siliconware Precision Industries (SPIL) has announced plans to invest indirectly a total of US$25 million in its newly-established wholly-owned subsidiary in China. Named Siliconware...

Chipbond reportedly to sell partial stake in China subsidiary to BOE

Jul 19, 21:19

Speculation has circulated in the industry that Taiwan-based Chipbond Technology plans to sell part of its stake in its China-based subsidiary Chipmore Technology to BOE Technology...

Chipbond, ChipMOS seeing robust gold bumping demand

Jul 19, 15:37

Backend houses Chipbond Technology and ChipMOS Technologies have both cut into the supply chains of US and Korea smartphone brands with their gold bumping services, and are set to...

Tongfu Microelectronics to set up advanced IC backend plant in Xiamen, says report

Jun 27, 21:05

China-based Tongfu Microelectronics has struck a deal with the Xiamen Haicang District government to set up a manufacturing base for advanced packaging and testing services locally...

PTI optimistic about memory-dominated packaging

Jun 2, 10:30

The era of memory-dominated packaging technology has arrived, and heterogeneous stacking with memory and logic devices has become a trend, according to DK Tsai, chairman and CEO for...

ChipMOS reportedly lands gold bumping orders for AMOLED driver ICs from Samsung

Newswatch - May 24, 10:51

ChipMOS Technologies reportedly has landed orders from Samsung Electronics for providing gold bumping services on 12-inch wafers fabricated to produce AMOLED driver ICs to be used...

ChipMOS expects revenue growth in 2Q17

May 12, 12:22

ChipMOS Technologies, a backend house targeting the LCD driver IC and memory chip sectors, expects rising sales generated from the LCD driver IC and mixed-signal chip sectors in the...

SPIL posts profit drop in 1Q17

Apr 27, 11:10

IC packager Siliconware Precision Industries (SPIL) has reported net profits of NT$996 million (US$33.1 million) for the first quarter of 2017, down 64.8% sequentially and 37.9% on...

Greatek building high-end packaging capacity

Mar 28, 16:05

Logic IC packaging firm Greatek Electronics will start production for bumping and wafer-level CSP in July 2017 which will further buoy its sales performance for the year, according...

Chipbond grabs new gold bumping orders for power amplifiers, says report

Newswatch - Dec 26, 22:54

Packaging and testing house Chipbond Technology reportedly has landed new orders for gold bumping for power amplifier (PA) components from Japan- and US-based vendors, according to...

SJSemi, Qualcomm announce mass production of 14nm wafer bumping

Jul 28, 15:40

SJ Semiconductor (SJSemi) has begun mass production of 14nm wafer bumping for Qualcomm, the companies have jointly announced. Mass production of 14nm wafer bumping in China is part...

SMIC, China National Fund and Qualcomm sign letter of intent to invest in SJsemi

Sep 17, 11:21

Semiconductor Manufacturing International (SMIC) announced on September 16 that the company has signed a letter of intent with China Integrated Circuit Industry Investment Fund (CICIIF)...

Chipbond to boost sales from non-driver ICs, says report

Stockwatch - Jul 29, 11:10

Chipbond Technology, which provides backend services mainly for LCD driver ICs, will see significant growth in sales from its non-driver IC product line in the second half of 2015,...

TI to open 300mm wafer bumping facility in Chengdu

Nov 10, 10:25

Texas Instruments has announced it will expand its manufacturing capacity in Chengdu, China, with a 300mm wafer bumping facility. The addition of this manufacturing process in Chengdu...

PTI to acquire Nepes in Singapore

May 2, 10:44

Powertec Technology (PTI) announced on April 29 that it has entered into a share purchase agreement with Nepes to acquire Nepes Pte Ltd (NPL) in Singapore.

China IC backend service companies migrating to advanced processes

Mar 13, 16:08

More IC testing and packaging companies in China are expected to migrate to advanced processes following Semiconductor Manufacturing International Corporation (SMIC) and Jiangsu Changjiang...

SMIC, JCET form JV for 12-inch bumping and testing

Feb 21, 14:26

Semiconductor Manufacturing International (SMIC) and Jiangsu Changjiang Electronics Technology (JCET), an IC assembly and test services provider in China, have established a joint...

SPIL looks to strong performance in 4Q13 and 1Q14

Dec 31, 14:21

Siliconware Precision Industries (SPIL) is expected to perform better than expected in the fourth quarter of 2013 and the first quarter of 2014 as the IC backend service firm has...

IC backend service firms to ramp up bumping, WL-CSP capacities in 2014, say sources

Dec 31, 11:26

Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and Amkor Technology will continue to commit heavy investments for ramping their high-end backend...

TSMC adjusting capacity to meet rising orders for bumping services

Dec 16, 22:55

TSMC expects its in-house capacity for wafer bumping services will fail to satisfy customer demand, and plans to outsource more orders for 8-inch wafers for use in the manufacture...

ASE likely to lose orders as plants might shut down over toxic leaks

Dec 13, 10:23

One or more factories of Taiwan-based Advanced Semiconductor Engineering (ASE), the world's largest IC packaging house, might receive a government order to suspend operations for...

TSMC builds up bumping capacity

Dec 12, 14:30

Taiwan Semiconductor Manufacturing Company (TSMC) has built up its bumping capacity to 150,000 12-inch wafers a month with total shipments amounting to over five million units, according...

Chipbond 12-inch gold bumping lines to operate at full capacity in September

Sep 11, 16:33

LCD driver IC packaging and testing firm Chipbond Technology will see its 12-inch gold bumping lines operate at full capacity in September thanks to orders from Renesas Electronics,...

Chipbond 3Q12 sales driven by demand for small-size panel driver ICs

Aug 21, 01:15

Consolidated revenues at Chipbond Technology are set to increase 5-10% sequentially in the third quarter of 2012, driven by strong demand for its 12-inch bumping services used for...

Chipbond gold bumping capacity booked for iPhones, says report

Newswatch - Jun 29, 12:37

Chipbond Technology reportedly has cut into the supply chain for Apple's iPhone 5 through providing backend services for the LCD driver ICs used in the upcoming iPhones with retina...

Chipbond lands 8-inch gold bumping orders from Samsung, says paper

Newswatch - Jun 4, 14:23

LCD driver IC packaging and testing specialist Chipbond Technology reportedly has landed orders for 8-inch gold bumping from Samsung Electronics with shipments to begin in the third...

Chipbond, ChipMOS develop alternative to gold bumping

Jan 3, 11:53

Chipbond Technology and ChipMOS Technologies have both adopted Cu/Ni/Au bumps for LCD driver IC packaging to significantly reduce gold use, according to the companies. The method...

PTI developing advanced packaging technologies

Jul 1, 01:10

Packaging and testing firm Powertech Technology (PTI) expects the development of new technologies including wafer-level packaging, 3D IC packaging and copper pillar bumping to bear...

Major Taiwan IC backend firms developing copper pillar bumping

Jun 27, 13:54

Major IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and memory packaging and testing specialist Powertech Technology (PTI), have...

Shortage of iPad 2 bumping up gray import prices

Mar 14, 16:38

Prices for Apple's iPad 2 in Korea or Hong Kong, where the device has not yet been launched, are being marked at about US$700-1,000, close to double Apple's original price, as Apple...

Chipbond gearing up to expand capacity for 12-inch wafers

Mar 3, 15:05

With more LCD driver IC firms moving from 8-inch wafers to 12-inch, backend service provider Chipbond Technology is set to expand capacity for 12-inch wafers in 2011, according to...

50 items [1/2]
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