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News tagged Cadence
  • Last update: Tuesday 2 December 2014 [15 news items]

HiSilicon expands adoption of Cadence tools and IP for advanced-node FinFET designs

Dec 2, 14:38

Cadence Design Systems announced on December 1 that HiSilicon Technologies has signed an agreement to significantly expand its use of the Cadence digital and custom/analog flows for...

VIA licenses Cadence Tensilica HiFi audio/voice DSP

Oct 23, 11:08

Cadence Design Systems has announced that VIA Technologies has selected the Cadence Tensilica HiFi audio/voice digital signal processor for a system-on-chip design for set-top boxes,...

ARM buys mobile display IC cores from Cadence

Sep 4, 15:02

Processor IP licensor ARM and Cadence Design Systems, an EDA tool company, have signed an agreement for the sale and transfer of Cadence PANTA display controller cores to ARM, according...

Blue-collar processing: Q&A with Tensilica founder Chris Rowen

Jun 28, 16:12

Based in Santa Clara, Tensilica has been around the semiconductor industry for around 15 years, providing customers with what it calls configurable dataplane processors (DPUs). The...

Chris Rowen, chief technology officer and founder of Tensilica<br>

20nm process to take off in 2013, says Cadence executive

Apr 19, 15:15

The semiconductor industry will accelerate towards the adoption of 28nm process in 2012, and begin its transition to the next technology node in 2013, according to Chi-Ping Hsu, a...

Globalfoundries tapes out 20nm test chip

Aug 30, 16:40

Globalfoundries has announced that it successfully taped out a 20nm test chip using flows from EDA partners Cadence Design Systems, Magma Design Automation, Mentor Graphics and Synopsys...

Samsung Foundry tapes out 20nm

Jul 13, 01:00

Samsung Electronics has announced that its foundry business, Samsung Foundry, successfully taped-out a test chip based on its 20nm process with high-k metal gate (HKMG) technology...

TSMC delivers interoperable EDA formats for advanced process technologies

Apr 8, 10:40

Taiwan Semiconductor Manufacturing Company (TSMC) has made available several unified and interoperable electronic design automation (EDA) technology files for its 65nm, 40nm and 28nm...

EDA providers reshuffle management in Asia Pacific

Newswatch - Jul 13, 14:48

Another electronic design automation (EDA) provider is reshuffling its Asia-Pacific operations, following recent regional head changes at Cadence Design Systems and Synopsys, according...

Global Unichip to have former Cadence Asia Pacific president head China operations

Jun 30, 12:07

Taiwan-based IC design service provider Global Unichip has decided to appoint Lung Chu, the former Asia Pacific president for EDS company Cadence Design Systems, as its China president...

chu

Global Unichip beefing up presence in China, Japan and South Korea

Jun 4, 12:18

Taiwan IC design service provider Global Unichip will strengthen its deployments in China, South Korea, Japan, Europe and Israel in 2009, according to company CEO KC Shih. Market...

Lung Chu

SiS joins power forward initiative to assist in delivering power-efficient computing platforms

Mar 13, 13:58

Silicon Integrated System (SiS) has announced its joining of the Power Forward Initiative (PFI) and plans to offer common power format (CPF) design solutions for its chipset, motherboard,...

China IC design industry should strengthen R&D amid economic downturn, says Cadence executive

Jan 12, 15:59

China's IC design houses should strengthen their R&D in order to gain competitiveness within their home market against foreign rivals, when developed markets such as Europe and...

Cadence Asia president Lung Chu

MEMS to bring in NT$50 billion, says president of Cadence Asia Lung Chu

Dec 24, 15:59

MEMS is expected to bring in sales worth NT$50 billion (US$1.5 billion) as long as MEMS components can be produced on a large scale, according to Lung Chu, president of Asia Pacific...

Commentary: Low price strategy limits growth potential of players in China's IC design industry, says president of Cadence Asia

Jul 16, 11:25

Facing emerging competitors from China, IC design companies in Taiwan constantly enhance their products and operation to keep the advantageous position in the IC design field, according...

Lung Chu, the president of Asia Pacific Field Operations, Corporate Vice President in Cadence.
Realtime news
  • NAND flash contract prices see modest drop in 1H December, says DRAMeXchange

    Bits + chips | 9h 12min ago

  • Global storage market to reach US$38 billion in 2014, says Western Digital

    IT + CE | 9h 13min ago

  • SMIC builds Qualcomm Snapdragon 410 chips using 28nm

    Bits + chips | 9h 16min ago

  • Globalfoundries and Cadence deliver first SoC enablement solution featuring ARM Cortex-A17 processor in 28nm-SLP process

    Bits + chips | 9h 17min ago

  • Taiwan science parks January-October total revenues up 3.61% on year, says MOST

    Bits + chips | 9h 19min ago

  • Unitech expands HDI-board capacity

    Bits + chips | 9h 20min ago

  • PV equipment book-to-bill ratio stays below parity in 3Q14, says SEMI

    Bits + chips | 9h 35min ago

  • Xiaomi smartphone finding it difficult to step out of China

    Before Going to Press | 9h 46min ago

  • Notebook orders from Russia decreasing, says Taiwan ODMs

    Before Going to Press | 9h 47min ago

  • ACES Electronics invests in NTGEC to tap China automotive connector market

    Before Going to Press | 9h 48min ago

  • Japan smartphone panel makers bring price competitive pressure on China and Taiwan makers

    Before Going to Press | 9h 49min ago

  • SMIC builds Qualcomm Snapdragon 410 chips using 28nm

    Before Going to Press | 9h 49min ago

  • Some China PV module makers replace Taiwan-made solar cells with Southeast Asia-made models

    Before Going to Press | 9h 49min ago

  • LED light bulb prices fall in Europe, China markets

    Before Going to Press | 9h 51min ago

  • NAND flash contract prices see modest drop in 1H December, says DRAMeXchange

    Before Going to Press | 9h 52min ago

  • Global Ultra HD TV penetration to rise to 14.2%, says WitsView

    Before Going to Press | 9h 52min ago

  • Demand for 8-inch fab equipment rises

    Before Going to Press | 9h 53min ago

  • PV equipment book-to-bill ratio stays below parity in 3Q14, says SEMI

    Before Going to Press | 9h 53min ago

  • Taiwan market: LG launches 42- to 55-inch smart digital signage

    Before Going to Press | 9h 54min ago

  • Digitimes Research: Top-3 China based server vendors may ship 2 million units in 2015

    Before Going to Press | 9h 54min ago

  • Taiwan market: FET expects 4G user base to exceed 1.0 million at end of 2014, says president

    Before Going to Press | 9h 55min ago

  • US final anti-dumping, anti-subsidization taxation excludes solar-grade wafers

    Before Going to Press | 9h 55min ago

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Wireless broadband developments in Southeast Asia markets
Trends and forecasts for the China FPD industry, 2014-2017

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DIGITIMES Translation Services
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • Greater China touch panel shipment forecast through 2015

    This Special Report provides forecasts through 2015 for Greater China touch panel shipments with breakdowns based on technology (glass, film, resistive), application (smartphone, NB and tablet) and by firm.

  • 2014 global tablet demand forecast

    This report analyzes the main players, their strategies and shipments forecasts for 2014, as well as other factors contributing to either growth or decline in various segments within the tablet market, with a particular focus on Apple, Google, Samsung, and Microsoft, along with whitebox vendors.