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News tagged Chipbond
  • Last update: Wednesday 18 December 2013 [129 news items]

Chipbond sees flat growth in 1Q12 sales

Mar 13, 14:22

Chipbond Technology, which provides packaging and testing services for driver ICs used mainly in TV and handset panels, expects its consolidated revenues to register flat sequential...

Chipbond sales to rise 5% in 1Q12, says paper

Newswatch - Feb 10, 14:21

LCD driver IC packaging and testing specialist Chipbond Technology is expected to see its consolidated revenues increase as much as 5% sequentially in the first quarter of 2012, beating...

Some Taiwan LCD driver IC designers release orders to South Korea-, Japan-based packaging/testing firms

Jan 18, 01:05

Some Taiwan-based LCD driver IC design houses, in order to spread risks, have placed orders for 8-inch bumping packaging and testing services with South Korea- and Japan-based providers,...

Chipbond, ChipMOS develop alternative to gold bumping

Jan 3, 11:53

Chipbond Technology and ChipMOS Technologies have both adopted Cu/Ni/Au bumps for LCD driver IC packaging to significantly reduce gold use, according to the companies. The method...

LCD market to rebound in 2Q12, says Chipbond

Dec 22, 01:05

Chipbond Technology has expressed caution about the company's business outlook for the rest of 2011 and first-quarter 2012, as generally weak demand continues to plague the LCD panel...

Chipbond launches share buyback program

Stockwatch - Nov 3, 16:15

LCD driver IC packaging and testing house Chipbond Technology has announced plans to repurchase 10 million, or 1.68%, of the company's outstanding shares, at between NT$22 (US$0.73)...

Chipbond expects flat or slight growth in 4Q11 sales

Nov 3, 01:05

Chipbond Technology, which provides backend services to LCD driver IC suppliers such as Japan's Renesas Electronics, Taiwan-based Novatek Microelectronics and ILi Technology (Ilitek),...

Chipbond 3Q11 profit rises on forex gain

Oct 26, 10:00

Driver-IC packaging and testing house Chipbond Technology has announced financial figures for the third quarter of 2011 with net profits hiking almost 80% sequentially, as recent...

VIS, Chipbond post drops in 3Q11 revenues

Oct 11, 12:08

Vanguard International Semiconductor (VIS), a major LCD driver IC foundry service provider, and driver-IC packaging and testing specialist Chipbond Technology both saw their third-quarter...

Chipbond responds to reports of price reductions

Stockwatch - Oct 4, 13:58

Chipbond Technology, a major Taiwan-based LCD driver IC packaging and testing house, has issued a filing with the Taiwan Stock Exchange (TSE) declining to comment on media reports...

Chipbond 2Q11 profits halved

Aug 24, 17:07

LCD driver IC packaging and testing firm Chipbond Technology has reported net income of NT$254 million (US$8.7 million) on revenues of NT$3.445 billion for the second quarter of 2011...

Chipbond, ChipMOS expect flat revenues in 3Q11

Jul 26, 15:37

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies, in view of stagnant demand for LCD panels, expect their revenues for the third quarter of...

Chipbond conservative about 3Q11

Jul 13, 16:03

LCD driver IC packaging and testing firm Chipbond Technology has expressed uncertainty about the outlook for the third quarter due to low order visibility.

Improved demand for LCD panels to boost Chipbond 2Q11 performance

May 23, 15:55

The market of large-size LCD panels have been improving recently. LCD driver IC packaging and testing firm Chipbond Technology has stated the possibility of a better second quarter...

Chipbond remains cautious about 2Q11

Apr 8, 11:28

LCD driver IC packaging and testing firm Chipbond Technology has remained cautious about the outlook for the second quarter due to low order visibility. The company expects to report...

Demand for large-size driver IC sluggish

Mar 18, 15:15

Demand for LCD driver ICs used in PC monitors has not picked up as was originally expected, according to industry sources. Meanwhile, that for driver ICs from the LCD TV sector remains...

Chipbond gearing up to expand capacity for 12-inch wafers

Mar 3, 15:05

With more LCD driver IC firms moving from 8-inch wafers to 12-inch, backend service provider Chipbond Technology is set to expand capacity for 12-inch wafers in 2011, according to...

Chipbond, KYEC team up for power IC packaging and testing

Mar 3, 01:05

LCD driver-IC packaging and testing firm Chipbond Technology and King Yuan Electronics (KYEC), which specializes in chip probing and final test services, have signed a memorandum...

Chipbond to report strong EPS for 2011, says paper

Stockwatch - Feb 15, 12:03

Taiwan's Chipbond Technology is expected to enjoy substantial growth sequentially in revenues and profits in the first quarter of 2011, thanks to contributions from subsidiary Chipmore...

VIS January revenues up 12% on order rebound

Feb 10, 15:42

With LCD driver IC clients having completed inventory adjustments, specialty IC foundry Vanguard International Semiconductor (VIS) saw revenues increase 12.3% sequentially to NT$1.41...

Chipbond responds to media reports on 1Q11 sales

Stockwatch - Jan 20, 15:28

Chipbond Technology has posted a filing with the Taiwan Stock Exchange (TSE) stating it has not issued revenues guidance for the first quarter of 2011.

Chipbond expects sales to start recovering in December

Dec 16, 01:05

Chipbond Technology, a major Taiwan-based LCD driver IC packaging and testing house, expects December 2010 revenues to grow sequentially after having seen on-month drops over the...

Taiwan-based LCD driver IC designers to adopt 12-inch processes soon

Nov 12, 01:25

LCD driver IC design houses will transition into 12-inch processes at the end of 2010 to the first quarter of 2011. Chipbond Technology is currently the only backend chip packager...

Chipbond expects 10-15% sequential drop in 4Q10 revenues

Nov 11, 01:10

Panel driver IC packaging/testing house Chipbond Technology expects revenues for the fourth quarter of 2010 to fall 10-15%, according to the company. Chipbond's revenues of NT$1.085...

Chipbond cautious about 4Q10

Nov 4, 01:50

Chipbond Technology believes its October 2010 sales may have dropped sequentially. The driver-IC packaging and testing firm also estimated total orders for November may be similar...

Chipbond 3Q10 sales hit record, but miss guidance

Oct 27, 14:32

LCD driver-IC packaging and testing firm Chipbond Technology has announced revenues for the third quarter of 2010 of NT$3.697 billion (US$121 million), which topped its previous record...

Chipbond likely to miss revenue guidance for 3Q10

Sep 24, 01:05

Chipbond Technology will likely see revenues for the third quarter of 2010 remain flat on quarter, missing its guidance of 5-10% growth, according to market watchers. The driver-IC...

Demand rebound for large-size panels to move back from August to October, says Chipbond chairman

Sep 1, 15:38

A demand rebound for large-size LCD panels will take place in the first two weeks of October instead of August as previously expected, Fei-Jain Wu, chairman of driver-IC packaging...

Chipbond posts strong 2Q10 results; gives cautious outlook

Aug 9, 16:12

Packaging and testing house Chipbond Technology has reported better-than-expected revenue and profit results for the second quarter of 2010, reflecting strong market demand for LCD...

Chipbond chairman Fei-Jain Wu

Chipbond expected to post strong profit growth for 2Q10

Newswatch - Aug 3, 14:13

Chipbond Technology is likely to report that second-quarter net profits more than doubled sequentially to NT$800 million (US$25 million), thanks to higher revenues and gross margin,...

Chipbond sees moderate growth in 3Q10

Jul 21, 11:37

LCD driver IC packaging and testing house Chipbond Technology expects July revenues to slightly decrease from June, but overall demand will pick up again in August and September....

Chipbond 2Q10 revenues beat guidance

Jul 12, 16:45

Major Taiwan-based driver IC packaging and testing house Chipbond Technology saw revenues soar 83.5% sequentially in the second quarter of 2010. The significant rise was higher than...

Renesas raises outsourcing to Taiwan partners, says paper

Newswatch - Jul 2, 16:39

Renesas Electronics has raised its orders to Powerchip Technology for its LCD driver ICs, and also grown its outsourcing to backend partner Chipbond Technology, according to a recent...

Chipbond to buy new testers; 2010 capex to reach NT$2 billion

Jun 29, 11:44

Chipbond Technology has announced it plans to spend NT$2 billion (US$62 million) in capex this year, an upward revision from its originally-planned NT$1.5 billion. The LCD driver-IC...

Chipbond chairman Fei-Jain Wu

Chipbond looks to 10% sequential revenue growth in 3Q10

Newswatch - Jun 28, 17:03

LCD driver-IC packaging and testing house Chipbond Technology expects revenues for the third quarter of 2010 to grow by 10% on quarter, chairman Fei-Jain Wu said at the company's...

129 items [2/4]
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