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News tagged copper
  • Last update: Monday 18 August 2014 [151 news items]

Co-Tech to see improved sales of copper foils in 3Q14

Aug 18, 16:03

Co-Tech Copper Foil expects its sales to improve in the third quarter of 2014 due a rebound of copper foils from the notebook sector, according to the company.

Copper foil prices to remain low amid oversupply

Jul 3, 14:38

Copper foil suppliers are unlikely to hike their quotes for the time being due to oversupply in the market despite stabilizing copper prices, according to industry sources.

Copper foil maker Co-Tech shifting focus to copper oxide, thin copper foil

Mar 27, 15:59

Co-Tech Copper Foil will shift its focus to produce new products, including copper oxide and thin copper foil for lithium batteries, to shore up its profitability, according to company...

Co-Tech to step into production of copper oxide

Mar 5, 21:51

Copper foil manufacturer Co-Tech will start producing copper oxide in the second quarter of 2014, with a monthly capacity of 200-300 tons, according to the company.

SPIL to grow sales of silver wire-bonding packaging in 2014

Feb 12, 11:49

Chip packager Siliconware Precision Industries (SPIL) expects the development of its silver wire-bonding packaging business to bear fruit in 2014.

Copper foil prices to continue dropping in 1Q14

Dec 12, 14:26

Quotes for copper foil are likely to continue to drop in the first quarter of 2014 due to oversupply caused by capacity ramps by China-based suppliers, according to industry source...

ASE, Infineon team up for assembly of auto products

Nov 7, 15:42

Advanced Semiconductor Engineering (ASE) has announced a joint development and product agreement for assembly services of automotive products with Infineon Technologies. The collaboration...

Copper foil supplier Co-Tech posts shipment rise in August, says report

Newswatch - Sep 3, 14:28

Co-Tech Copper Foil, which supplies copper foil used to manufacture CCLs and PCBs, saw its August shipments rise by about 300 tons sequentially buoying company revenues for the month,...

Copper foil market likely to face oversupply in 2014

Aug 23, 11:22

Capacity expansions at China-based copper foil suppliers might cause an oversupply in the market in 2014, according to market sources.

Copper foil maker Co-Tech posts flat performance in July

Aug 7, 15:06

Copper foil maker Co-Tech Copper Foil has reported revenues of NT$279 million (US$9.32 million) for July, up 2.8% sequentially but down 33.7% on year. For the first seven months,...

Copper foil maker Co-Tech cautious about 2H13

Aug 2, 10:00

Co-Tech Copper Foil, which supplies copper foil used to manufacture CCLs and PCBs, now expects its sales ratio between the first and second halves of 2013 to be 50:50. The firm previously...

Copper foil maker Co-Tech reports sequential revenue decline for June

Jul 9, 16:13

Co-Tech Copper Foil has reported consolidated revenues of NT$270 million (US$8.9 million) for June, down 37.6% sequentially but up 17.4% on year. For the first half of 2013, revenues...

Co-Tech strives to maintain price stability

Jul 2, 20:26

Co-Tech Copper Foil, which supplies copper foil used to manufacture CCLs and PCBs, is striving to keep its quotes stable in the third quarter of 2013 amid falling copper prices and...

ASE lands pull-in of copper wirebonding orders

Jun 27, 14:40

IC backend service company Advanced Semiconductor Engineering (ASE) has seen its Europe- and US-based fabless clients adopting copper wire to package their products since the beginning...

Copper foil maker Co-Tech May sales rise

Newswatch - Jun 10, 12:01

Consolidated revenues at Taiwan-based Co-Tech Copper Foil registered a 23.34% sequential rise in May 2013 hitting the highest monthly level in one year.

PCB makers likely to ask for CCL price cuts on copper price falls

Apr 24, 15:47

Taiwan-based rigid and flexible PCB makers have reduced CCL (copper-clad laminate) procurement temporarily due to expected price drops arising from continual decreases in international...

Copper foil maker Co-Tech March revenues hit 9-month low

Apr 8, 15:49

Taiwan-based Co-Tech Copper Foil saw its March revenues slip 12.3% on month and 33.7% on year to a 9-month low at NT$321 million (US$10.72 million). For the first quarter of 2013,...

Co-Tech looks for return to profitability in 2H13

Mar 14, 22:21

Co-Tech Copper Foil, which supplies copper foil used to manufacture CCLs and PCBs, expects to return to profitability during the second half of 2013.

Greatek looks to improved profitability on copper wire bonding lines

Mar 13, 13:51

Logic IC packaging firm Greatek Electronics has revealed that copper wire bonding packaging lines are currently contributing more than 50% to its total revenues, which will further...

ASE, SPIL to stop ramping copper wirebonding capacity

Jan 31, 11:03

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both stated that they will stop ramping up capacity for copper wire-bonding. Instead, raising...

UMC rolls out thick-plated copper process for PWM ICs

Jan 17, 10:28

United Microelectronics (UMC) has developed a thick-plated copper process, in collaboration with packaging house Chipbond Technology, for power management IC applications.

Copper foil prices up in January

Jan 16, 14:52

Quotes for copper foil have stayed at US$2.80/kg recently compared to US$2.50/kg in the fourth quarter of 2012, thanks to limited capacity ramps by makers, according to industry so...

CCL maker EMC to expand capacity at China plant

Jan 3, 21:13

Copper clad-laminate (CCL) maker Elite Material (EMC) has unveiled plans to invest CNY160 million (US$25.7 million) to expand capacity at its plant in Zhongshan (Guangdong province,...

Demand for copper wirebonding machines to slide 50% sequentially in 4Q12

Sep 12, 01:40

Demand for copper wirebonding machines from IC backend service companies is expected to decline 50% in the fourth quarter of 2012 as compared to purchases in the third quarter, according...

Demand for copper wirebonding packaging to peak in 2014

Sep 6, 13:36

Demand for copper wirebonding packaging will remain strong over the next two years, with the packaging technology to account for 85% of the global wirebonding market in 2014, according...

Taiwan copper wirebonding production value to rise

Sep 3, 12:11

The production value of Taiwan's copper wirebonding segment is expected to rise along with demand over the next three years, according to sources at equipment suppliers.

Co-Tech becomes first Taiwan-based maker of FCCL-use copper foil

Aug 15, 01:00

Co-Tech Copper Foil has extended production of electrolytic copper foil to thin foil for use in FCCLs (flexible copper-clad laminates), becoming the first Taiwan-based maker of such...

Copper foil prices rebound

Aug 7, 01:20

Having fallen over recent months, prices for copper foil stopped falling in August to reflect a rebound in copper prices, according to Taiwan-based Co-Tech Copper Foil.

ASE, SPIL make progress in transition to copper wire bonding

Jul 31, 16:12

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have made progress toward the transition from gold to copper wire bonding, and have also stepped...

Greatek remains focused on shift to copper wire bonding

Jun 29, 01:20

IC backend service provider Greatek Electronics, which focuses on the consumer electronics market, has said the firm will continue shifting copper wire bonding from gold bonding in...

First-tier motherboard makers drop 7 series motherboard prices

Mar 22, 01:00

First-tier motherboard makers have recently dropped their Intel 7 series motherboard prices to compete for market share, although Intel has not yet officially announced the chipset,...

7 series motherboard

Co-Tech hikes copper foil prices

Dec 14, 16:50

Taiwan-based copper foil maker Co-Tech Copper Foil has decided to raise quotes for its products by US$0.2-0.3/kg in December as compared to the levels in November, according to the...

Copper pillar bump penetration of FC packaging to rise

Nov 29, 12:25

Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...

Focus on small, cost-effective packages: Q&A with STATS ChipPAC CEO Tan Lay Koon

Nov 21, 13:48

Despite uncertainties in the semiconductor industry outlook, packaging and testing firm STATS ChipPAC will continue investing in advanced IC packages for space-critical designs that...

STATS ChipPAC CEO Tan Lay Koon

CCL supplier Doosan ramps China plant

Nov 11, 01:10

Korea-based Doosan, a producer of copper clad laminates (CCL), has begun small-volume production at its new plant in Changshu, China. Monthly capacity at the facility is scheduled...

151 items [1/5]
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