PCB makers likely to ask for CCL price cuts on copper price falls

Apr 24, 15:47

Taiwan-based rigid and flexible PCB makers have reduced CCL (copper-clad laminate) procurement temporarily due to expected price drops arising from continual decreases in international...

Copper foil maker Co-Tech March revenues hit 9-month low

Apr 8, 15:49

Taiwan-based Co-Tech Copper Foil saw its March revenues slip 12.3% on month and 33.7% on year to a 9-month low at NT$321 million (US$10.72 million). For the first quarter of 2013,...

Co-Tech looks for return to profitability in 2H13

Mar 14, 22:21

Co-Tech Copper Foil, which supplies copper foil used to manufacture CCLs and PCBs, expects to return to profitability during the second half of 2013.

Greatek looks to improved profitability on copper wire bonding lines

Mar 13, 13:51

Logic IC packaging firm Greatek Electronics has revealed that copper wire bonding packaging lines are currently contributing more than 50% to its total revenues, which will further...

ASE, SPIL to stop ramping copper wirebonding capacity

Jan 31, 11:03

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both stated that they will stop ramping up capacity for copper wire-bonding. Instead, raising...

UMC rolls out thick-plated copper process for PWM ICs

Jan 17, 10:28

United Microelectronics (UMC) has developed a thick-plated copper process, in collaboration with packaging house Chipbond Technology, for power management IC applications.

Copper foil prices up in January

Jan 16, 14:52

Quotes for copper foil have stayed at US$2.80/kg recently compared to US$2.50/kg in the fourth quarter of 2012, thanks to limited capacity ramps by makers, according to industry so...

CCL maker EMC to expand capacity at China plant

Jan 3, 21:13

Copper clad-laminate (CCL) maker Elite Material (EMC) has unveiled plans to invest CNY160 million (US$25.7 million) to expand capacity at its plant in Zhongshan (Guangdong province,...

Demand for copper wirebonding machines to slide 50% sequentially in 4Q12

Sep 12, 01:40

Demand for copper wirebonding machines from IC backend service companies is expected to decline 50% in the fourth quarter of 2012 as compared to purchases in the third quarter, according...

Demand for copper wirebonding packaging to peak in 2014

Sep 6, 13:36

Demand for copper wirebonding packaging will remain strong over the next two years, with the packaging technology to account for 85% of the global wirebonding market in 2014, according...

Taiwan copper wirebonding production value to rise

Sep 3, 12:11

The production value of Taiwan's copper wirebonding segment is expected to rise along with demand over the next three years, according to sources at equipment suppliers.

Co-Tech becomes first Taiwan-based maker of FCCL-use copper foil

Aug 15, 01:00

Co-Tech Copper Foil has extended production of electrolytic copper foil to thin foil for use in FCCLs (flexible copper-clad laminates), becoming the first Taiwan-based maker of such...

Copper foil prices rebound

Aug 7, 01:20

Having fallen over recent months, prices for copper foil stopped falling in August to reflect a rebound in copper prices, according to Taiwan-based Co-Tech Copper Foil.

ASE, SPIL make progress in transition to copper wire bonding

Jul 31, 16:12

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have made progress toward the transition from gold to copper wire bonding, and have also stepped...

Greatek remains focused on shift to copper wire bonding

Jun 29, 01:20

IC backend service provider Greatek Electronics, which focuses on the consumer electronics market, has said the firm will continue shifting copper wire bonding from gold bonding in...

Co-Tech hikes copper foil prices

Dec 14, 16:50

Taiwan-based copper foil maker Co-Tech Copper Foil has decided to raise quotes for its products by US$0.2-0.3/kg in December as compared to the levels in November, according to the...

Copper pillar bump penetration of FC packaging to rise

Nov 29, 12:25

Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...

CCL supplier Doosan ramps China plant

Nov 11, 01:10

Korea-based Doosan, a producer of copper clad laminates (CCL), has begun small-volume production at its new plant in Changshu, China. Monthly capacity at the facility is scheduled...

ShineMore gearing up for niche-market CCLs

Nov 4, 15:25

ShineMore Technology Materials, a maker of copper clad laminates (CCL), has revealed plans to grow the ratio of niche-market products in company revenues to 50% in 2012 from 27% estimated...

Copper foil firms cutting back production

Oct 14, 01:30

Copper foil manufacturers have moved to scale back their output by 30-40% as orders plummet to low levels, according to industry sources. The previous cutback took place in 2008,...

Copper foil makers cut quotes for October; may press down CCL prices

Sep 28, 11:55

In line with declining global copper prices, quotes for copper foils from Taiwan makers will drop by 3% on average sequentially in October, the third month in a row that the makers...

FCCL maker Thinflex looks to improving utilization rates

Sep 9, 14:35

Taiwan-based Thinflex, a supplier of flexible copper clad laminates (FCCLs), expects utilization rates at its plants in China and Taiwan will rebound to 70% in the third quarter of...

Proportion of copper wire bonding to rise to over 20% in 2011, says SEMI

Sep 7, 16:36

Due to rising gold prices, replacement of conventional processes based on gold wire with copper-wire bonding processes is increasing. The proportion of total wire bonding volume for...

Packaging and testing growth to slow in 3Q11

Aug 17, 10:53

The global semiconductor packaging and testing industry is likely to see less than 5% growth sequentially in the third quarter of 2011, affected by the transition from gold to copper...

ASE and SPIL look to continued growth in copper wire bonding business in 3Q11

Aug 15, 15:15

IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL), both expect their sales generated from copper wire bonding to increase...

Co-Tech to ramp up capacity for flexible PCBs

Aug 12, 13:56

Co-Tech Copper Foil has revealed plans to add an additional capacity of 150 metric tons of copper foil by the end of 2011. The new capacity will be allocated for the production of...

CCL supplier ShineMore applies for OTC listing

Jul 21, 12:05

Copper clad laminate (CCL) maker ShineMore Technology Materials has submitted an application to list on Taiwan's over-the-counter (OTC) market, according to the company. It is currently...

Quotes for copper foils, fiber glass fabrics to stay flat in July

Jul 4, 15:02

Quotes for copper foils and fiber glass fabrics, key raw materials for the production of PCBs, are expected to remain unchanged in July after a slide of 3-5% on average in June although...

PTI developing advanced packaging technologies

Jul 1, 01:10

Packaging and testing firm Powertech Technology (PTI) expects the development of new technologies including wafer-level packaging, 3D IC packaging and copper pillar bumping to bear...

Major Taiwan IC backend firms developing copper pillar bumping

Jun 27, 13:54

Major IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and memory packaging and testing specialist Powertech Technology (PTI), have...

Copper pillar to be mainstream FC packaging technology in 2012

Jun 3, 15:43

IC packagers Advanced Semiconductor Engineering (ASE), Amkor Technology, Siliconware Precision Industries (SPIL) and STATS ChipPAC have all started developing a new flip-chip (FC)...

PCB material prices fall 3-5% in June

Jun 2, 13:49

Quotes for copper foils and fiber glass fabrics, key raw materials for the production of PCBs, have slid by 3-5% on average in June 2011 amid weakening demand and falling global commodity...

Taiwan makers cut CCL prices along with international copper price drops

May 24, 13:37

Taiwan-based CCL (copper-clad laminate) makers have lowered their quotes by 10% on average recently because of dropping international copper prices and bleak order prospects, according...