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News tagged CSP
  • Last update: Tuesday 20 May 2014 [19 news items]

SPIL setting up FC CSP capacity in eastern China

May 20, 12:01

Siliconware Precision Industries (SPIL), in view of fast growing demand for ICs used in smartphones, is setting up FC (flip chip) CSP (chip scale package) capacity at its two factories...

IC substrate makers to ramp up FC CSP substrates in 2014

Dec 30, 23:10

IC substrate makers Kinsus Interconnect Technology, Unimicron Technology and Nanya PCB all plan to ramp up their production capacity for flip-chip chip scale package (FC CSP) substrates...

NPC 2013 capex to focus on FC CSP substrates, says president

Jun 18, 21:45

Nan Ya PCB (NPC) will invest most of its targeted capex of NT$2 billion (US$67 million) on FC CSP (chip scale package) substrates in 2013, acknowledging brisk demand coming from the...

Kinsus to perform strongly in 1Q13 on steady demand for FC CSP substrates

Jan 7, 12:08

Kinsus Interconnect Technology will perform relatively strongly in the first quarter of 2013, buoyed by shipments of FC CSP (flip-chip chip-scale package) substrates to clients including...

FC CSP substrate supply may be affected by explosion at Nippon Shokubai

Oct 4, 01:20

The supply of a chemical raw materials for producing ink used in the production of FC CSP (flip chip-chip scale package) substrates may be affected after a recent explosion and fire...

Kinsus looks to increasing shipments of FC CSP substrates in 4Q12

Sep 20, 13:59

Kinsus Interconnect Technology has entered the supply chain of Apple's iPhone 5 and is expected to see robust shipments of its FC CSP (chip scale package) substrates for Qualcomm's...

Kinsus ramping up FC CSP substrate shipments for Apple A5 CPUs, says paper

Newswatch - Oct 4, 12:28

Shipments of flip-chip chip-scale package (FC CSP) substrates for Apple's A5 processors from Taiwan-based Kinsus Interconnect Technology are expected to top one million units a month...

Unimicron lands orders from TI and Apple, says paper

Newswatch - Sep 9, 11:54

Unimicron Technology will soon begin to ship its FC CSP (flip-chip chip-scale-packaging) substrates to Texas Instruments (TI) for the production of ARM-based OMAP3 CPU lineups, according...

Kinsus lands FC CSP substrate orders from Intel, says paper

Newswatch - May 17, 14:12

IC substrate maker Kinsus Interconnect Technology has landed orders for FC CSP (flip-chip chip-scale packaging) substrates from Intel, according to a Chinese-language Commercial...

Kinsus to commence operation of China plant

Sep 28, 01:00

Taiwan-based IC substrate maker Kinsus Interconnect Technology revealed that construction of a new plant in Suzhou, China is near completion, and production will kick off in the fourth...

Kinsus looks to strong demand for FC CSP and base station substrates in 3Q10

Jul 28, 11:57

IC substrate maker Kinsus Interconnect Technology expects its revenues to grow 5-10% sequentially in the third quarter with flip-chip chip-scale packaging (FC CSP) and base station...

NPC expects strong revenues from FC CSP substrates in 2010

Oct 26, 10:22

Nan Ya Printed Circuit Board (NPC) may see its revenues from flip-chip chip scale packaging (FC CSP) substrates double in 2010 because of significant demand from the handset segment,...

NPC FC CSPs

Kinsus FC CSP substrate utilization rate up on orders from Qualcomm

Aug 18, 14:37

Taiwan-based IC substrate maker Kinsus Interconnect Technology has seen its capacity utilization for flip-chip chip scale packaging (FC CSP) substrates rise to more than 80% and the...

IC substrate maker Kinsus says high-margin products to sustain growth for 2H09

Jun 17, 16:26

Kinsus Interconnect Technology is expected to manage sequential revenue growth from July through December 2009, driven by growing sales of its high-margin product lines, according...

Kinsus chairman

Kinsus expects strong substrate shipment growth in March due to China 3G deployment

Mar 20, 17:11

IC substrate maker Kinsus Interconnect Technology estimates that March revenues will top NT$700 million (US$20.74 million) because China handset makers have expanded deployment of...

Kinsus BT-based FC and FC CSP substrate shipments to increase in 2009

Feb 20, 14:18

Kinsus Interconnect Technology has reported January sales of NT$433 million (US$12.45 million), down 21% on month. The company expects sales to increase to NT$500-550 million in February...

fc csp

IC substrate maker Kinsus to see sales decline but will remain profitable in January

Jan 19, 15:36

Investors estimate Kinsus Interconnect Technology's January sales to be only around NT$500 million (US$14.93 million) due to sagging market demand. However, the company said it expects...

Netbooks and handsets to drive up PPT sales in 3Q08

Aug 6, 14:59

Seeing its July sales sustain an upward trend, Phoenix Precision Technology (PPT) has delivered an optimistic outlook for the third quarter, with flip-chip (FC) and chip-scale packaging...

Memory market shows signs of a rebound

Jun 6, 01:10

Demand in the memory market is showing signs of a rebound, with IC substrate supplier Kinsus Interconnect Technology and PCB maker Tripod Technology saying June-orders from the flash...

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