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News tagged gold bumping
  • Last update: Thursday 18 April 2013 [24 news items]

ChipMOS sees orders for NAND flash, driver ICs pick up

Apr 18, 21:18

ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs and memory chips, has seen orders for NAND flash memory and small-size panel driver ICs pick...

Chipbond 12-inch gold bumping lines to operate at full capacity in September

Sep 11, 16:33

LCD driver IC packaging and testing firm Chipbond Technology will see its 12-inch gold bumping lines operate at full capacity in September thanks to orders from Renesas Electronics,...

Chipbond 3Q12 sales driven by demand for small-size panel driver ICs

Aug 21, 01:15

Consolidated revenues at Chipbond Technology are set to increase 5-10% sequentially in the third quarter of 2012, driven by strong demand for its 12-inch bumping services used for...

Chipbond gold bumping capacity booked for iPhones, says report

Newswatch - Jun 29, 12:37

Chipbond Technology reportedly has cut into the supply chain for Apple's iPhone 5 through providing backend services for the LCD driver ICs used in the upcoming iPhones with retina...

Chipbond lands 8-inch gold bumping orders from Samsung, says paper

Newswatch - Jun 4, 14:23

LCD driver IC packaging and testing specialist Chipbond Technology reportedly has landed orders for 8-inch gold bumping from Samsung Electronics with shipments to begin in the third...

Chipbond, ChipMOS develop alternative to gold bumping

Jan 3, 11:53

Chipbond Technology and ChipMOS Technologies have both adopted Cu/Ni/Au bumps for LCD driver IC packaging to significantly reduce gold use, according to the companies. The method...

Chipbond responds to reports of price reductions

Stockwatch - Oct 4, 13:58

Chipbond Technology, a major Taiwan-based LCD driver IC packaging and testing house, has issued a filing with the Taiwan Stock Exchange (TSE) declining to comment on media reports...

ChipMOS expects weak 3Q11

Aug 19, 16:17

LCD driver IC packaging and testing house ChipMOS Technologies expects revenues to stay flat or decrease by single digits sequentially in the third quarter of 2011. Gross margin on...

Chipbond gearing up to expand capacity for 12-inch wafers

Mar 3, 15:05

With more LCD driver IC firms moving from 8-inch wafers to 12-inch, backend service provider Chipbond Technology is set to expand capacity for 12-inch wafers in 2011, according to...

ChipMOS to sell idle, non-core assets for US$11.6 million

Feb 24, 16:32

Packaging and testing house ChipMOS Technologies (Bermuda) has announced that subsidiary ChipMOS Taiwan will receive approximately US$11.6 million in the sale of its idle, non-core...

Chipbond responds to media reports on 1Q11 sales

Stockwatch - Jan 20, 15:28

Chipbond Technology has posted a filing with the Taiwan Stock Exchange (TSE) stating it has not issued revenues guidance for the first quarter of 2011.

Taiwan-based LCD driver IC designers to adopt 12-inch processes soon

Nov 12, 01:25

LCD driver IC design houses will transition into 12-inch processes at the end of 2010 to the first quarter of 2011. Chipbond Technology is currently the only backend chip packager...

ChipMOS to expand into 12-inch gold bumping

Oct 5, 14:14

Packaging and testing house ChipMOS Technologies (Bermuda) has revealed plans to add a new, 12-inch gold bumping production line in Taiwan with the installation set to complete by...

Chipbond posts strong 2Q10 results; gives cautious outlook

Aug 9, 16:12

Packaging and testing house Chipbond Technology has reported better-than-expected revenue and profit results for the second quarter of 2010, reflecting strong market demand for LCD...

Chipbond chairman Fei-Jain Wu

UAT tripling wafer bumping capacity

Jul 13, 11:52

Wafer-bumping service provider Unisem Advanced Technologies (UAT) has doubled the floor space of its plant in Ipoh, Malaysia, with a capacity to be three times its current level,...

Chipbond sees profits in 1Q10

Apr 23, 15:37

LCD driver IC packaging house Chipbond Technology has announced net profits of NT$398 million (US$13 million) or NT$1.20 per share, for the first quarter of 2010, compared with losses...

Chipbond completes merger with peer IST

Stockwatch - Apr 1, 15:21

LCD driver IC packaging house Chipbond Technology announced on April 1 the completion of its merger with International Semiconductor Technology (IST), with Chipbond being the surviving...

STATS ChipPAC moves copper wire bonding process to volume production

Nov 25, 11:23

STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).

One too many LCD driver IC backend service providers in Taiwan, says Chipbond

Nov 19, 14:22

Taiwan-based Chipbond Technology has commented that reducing the number of the local LCD driver IC packaging and testing houses to three through acquisitions or mergers will help...

Chipbond and IST urge relaxation of driver-IC backend restrictions in China

Aug 14, 16:04

Chipbond Technology and International Semiconductor Technology (IST) have called for Taiwan to relax restrictions on LCD driver IC packaging and testing production in China. They...

Chipbond gearing up 12-inch wafer bumping output: Q&A with chairman Fei-Jain Wu

Jun 30, 17:03

Gold bumping service provider, Chipbond Technology, which also offers COF/COG (chip-on-film/chip-on glass) turnkey services, has identified outsourcing of LCD driver-IC bumping and...

Chipbond chairman Fei-Jain Wu

Driver IC backend suppliers May sales up on improved utilization

Newswatch - Jun 9, 16:41

Taiwan-based LCD driver IC backend service providers Chipbond Technology and International Semiconductor Technology (IST) both enjoyed double-digit sequential growths in revenues...

Chipbond production line

Driver IC packaging firms to reach full utilization by end of 2Q09

Apr 8, 16:33

Taiwan-based LCD driver IC packaging and testing houses are expected to see their fabs running at full capacity by the end of the second quarter, as more Japan-based IDMs have begun...

Chipbond and IST prepare further price raise for gold bumping in 3Q08

May 29, 01:00

Chipbond Technology and International Semiconductor Technology (IST) are preparing to increase gold bumping quotes for the second consecutive quarter in the third quarter in order...

Wireless broadband developments in Southeast Asia markets
Trends and forecasts for the China FPD industry, 2014-2017

22-Dec-2014 markets closed

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TD-LTE market developments and forecast, 2014-2016
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