Last update: Thursday 18 April 2013 [24 news items]
ChipMOS sees orders for NAND flash, driver ICs pick up
Apr 18, 21:18
ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs and memory chips, has seen orders for NAND flash memory and small-size panel driver ICs pick...
Chipbond 12-inch gold bumping lines to operate at full capacity in September
Sep 11, 16:33
LCD driver IC packaging and testing firm Chipbond Technology will see its 12-inch gold bumping lines operate at full capacity in September thanks to orders from Renesas Electronics,...
Chipbond 3Q12 sales driven by demand for small-size panel driver ICs
Aug 21, 01:15
Consolidated revenues at Chipbond Technology are set to increase 5-10% sequentially in the third quarter of 2012, driven by strong demand for its 12-inch bumping services used for...
Chipbond gold bumping capacity booked for iPhones, says report
Newswatch - Jun 29, 12:37
Chipbond Technology reportedly has cut into the supply chain for Apple's iPhone 5 through providing backend services for the LCD driver ICs used in the upcoming iPhones with retina...
Chipbond lands 8-inch gold bumping orders from Samsung, says paper
Newswatch - Jun 4, 14:23
LCD driver IC packaging and testing specialist Chipbond Technology reportedly has landed orders for 8-inch gold bumping from Samsung Electronics with shipments to begin in the third...
Chipbond, ChipMOS develop alternative to gold bumping
Jan 3, 11:53
Chipbond Technology and ChipMOS Technologies have both adopted Cu/Ni/Au bumps for LCD driver IC packaging to significantly reduce gold use, according to the companies. The method...
Chipbond responds to reports of price reductions
Stockwatch - Oct 4, 13:58
Chipbond Technology, a major Taiwan-based LCD driver IC packaging and testing house, has issued a filing with the Taiwan Stock Exchange (TSE) declining to comment on media reports...
Aug 19, 16:17
LCD driver IC packaging and testing house ChipMOS Technologies expects revenues to stay flat or decrease by single digits sequentially in the third quarter of 2011. Gross margin on...
Chipbond gearing up to expand capacity for 12-inch wafers
Mar 3, 15:05
With more LCD driver IC firms moving from 8-inch wafers to 12-inch, backend service provider Chipbond Technology is set to expand capacity for 12-inch wafers in 2011, according to...
ChipMOS to sell idle, non-core assets for US$11.6 million
Feb 24, 16:32
Packaging and testing house ChipMOS Technologies (Bermuda) has announced that subsidiary ChipMOS Taiwan will receive approximately US$11.6 million in the sale of its idle, non-core...
Chipbond responds to media reports on 1Q11 sales
Stockwatch - Jan 20, 15:28
Chipbond Technology has posted a filing with the Taiwan Stock Exchange (TSE) stating it has not issued revenues guidance for the first quarter of 2011.
Taiwan-based LCD driver IC designers to adopt 12-inch processes soon
Nov 12, 01:25
LCD driver IC design houses will transition into 12-inch processes at the end of 2010 to the first quarter of 2011. Chipbond Technology is currently the only backend chip packager...
ChipMOS to expand into 12-inch gold bumping
Oct 5, 14:14
Packaging and testing house ChipMOS Technologies (Bermuda) has revealed plans to add a new, 12-inch gold bumping production line in Taiwan with the installation set to complete by...
Chipbond posts strong 2Q10 results; gives cautious outlook
Aug 9, 16:12
Packaging and testing house Chipbond Technology has reported better-than-expected revenue and profit results for the second quarter of 2010, reflecting strong market demand for LCD...

UAT tripling wafer bumping capacity
Jul 13, 11:52
Wafer-bumping service provider Unisem Advanced Technologies (UAT) has doubled the floor space of its plant in Ipoh, Malaysia, with a capacity to be three times its current level,...
Apr 23, 15:37
LCD driver IC packaging house Chipbond Technology has announced net profits of NT$398 million (US$13 million) or NT$1.20 per share, for the first quarter of 2010, compared with losses...
Chipbond completes merger with peer IST
Stockwatch - Apr 1, 15:21
LCD driver IC packaging house Chipbond Technology announced on April 1 the completion of its merger with International Semiconductor Technology (IST), with Chipbond being the surviving...
STATS ChipPAC moves copper wire bonding process to volume production
Nov 25, 11:23
STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).
One too many LCD driver IC backend service providers in Taiwan, says Chipbond
Nov 19, 14:22
Taiwan-based Chipbond Technology has commented that reducing the number of the local LCD driver IC packaging and testing houses to three through acquisitions or mergers will help...
Chipbond and IST urge relaxation of driver-IC backend restrictions in China
Aug 14, 16:04
Chipbond Technology and International Semiconductor Technology (IST) have called for Taiwan to relax restrictions on LCD driver IC packaging and testing production in China. They...
Chipbond gearing up 12-inch wafer bumping output: Q&A with chairman Fei-Jain Wu
Jun 30, 17:03
Gold bumping service provider, Chipbond Technology, which also offers COF/COG (chip-on-film/chip-on glass) turnkey services, has identified outsourcing of LCD driver-IC bumping and...

Driver IC backend suppliers May sales up on improved utilization
Newswatch - Jun 9, 16:41
Taiwan-based LCD driver IC backend service providers Chipbond Technology and International Semiconductor Technology (IST) both enjoyed double-digit sequential growths in revenues...

Driver IC packaging firms to reach full utilization by end of 2Q09
Apr 8, 16:33
Taiwan-based LCD driver IC packaging and testing houses are expected to see their fabs running at full capacity by the end of the second quarter, as more Japan-based IDMs have begun...
Chipbond and IST prepare further price raise for gold bumping in 3Q08
May 29, 01:00
Chipbond Technology and International Semiconductor Technology (IST) are preparing to increase gold bumping quotes for the second consecutive quarter in the third quarter in order...
ACX sees earnings up over 60% sequentially in 1Q13
Bits + chips | 6h 51min ago
Ilitek to post revenues of over NT$900 million in May
Bits + chips | 7h 5min ago
Sharp to produce 3 types of IGZO LCD panels for notebooks
Displays | 7h 17min ago
3M announces new development of quantum dot enhancement film
Displays | 8h 3min ago
NLT demonstrates latest display technologies, including projective capacitive touch panel technology
Displays | 8h 29min ago
AGC to release new self-adhesive glass for optical bonding used in electronic products
Displays | 8h 41min ago
eMagin enters electronic viewfinder market with OLED microdisplay
Displays | 8h 45min ago
New Vision Display exhibits PMVA color display based on Corning Willow Glass
Displays | 8h 46min ago
Lextar expected to see 2Q13 gross margin rise to 13-14%
LED | 8h 49min ago
Samsung to launch complete line up of notebooks in 2H13
IT + CE | 9h 31min ago
Taiwan panel industry output value worth US$7.86 billion in 1Q13, says IEK
Displays | 10h 31min ago
Sharp announces new Ultra HD TVs
Before Going to Press | 7h 17min ago
Nanjing Z-Com developing 4G small cells for China market
Before Going to Press | 7h 25min ago
Shipment proportions of 8- and 10-megapixel lens modules on the rise, say Taiwan makers
Before Going to Press | 7h 46min ago
Telecom operators in China expected to stop placing orders for 3.5-inch smartphones by July 2013
Before Going to Press | 7h 56min ago
Taiwan connector makers worried about competition from China-based makers
Before Going to Press | 8h 7min ago
Taiwan FPCB makers to face renewed competition from rivals in Japan
Before Going to Press | 8h 8min ago
China-based ARM-architecture IC designers to attend 2013 Computex Taipei
Before Going to Press | 8h 9min ago
Taiwan market: Sony to launch Xperia Tablet Z
Before Going to Press | 8h 41min ago
Monitor panel pricing expected to remain stable in May
Before Going to Press | 9h 44min ago
CSOT successfully produces 32-inch Oxide TFT LCD module
Before Going to Press | 9h 44min ago
Windows 8 expected to take up 5-8% of global tablet shipments in 2013, say Taiwan makers
Before Going to Press | 10h 40min ago
- AMD falls to 4th rank MPU supplier in 2012, says IC Insights
- Revenues for drivers in LED general lighting applications to triple, says IMS Research
- Supply chain to begin volume shipments of new Xbox console orders in 3Q13
- MediaTek 2Q13 sales likely to beat guidance
- Digitimes Research: Taiwan LCD driver IC shipments rise 22% in 1Q13
- Taiwan panel makers lower pricing for Ultra HD TV panels
- Innolux expected to ship 1 million TOD units in 2013
- China market: Third-party e-payment services generate CNY1.2 trillion in 1Q13 total trade value, says Analysys
- China market: Online advertising valued at CNY18 billion in 1Q13, says Analysys
- Touch screen IC, LED driver IC suppliers to post strong performance in May
- AUO publishes 65-inch Full HD OLED panel technology paper at SID Display Week
- Taiwan networking device makers see decreasing profit-to-R&D spending ratio
- Win Semi expects to post double-digit revenue growth in 2013
- LED maker Epistar expects more revenues from lighting applications in 3Q13
- TSMC presence in advance process market remains strong
- Chicony seeks growth from non-notebook product lines
- Taiwan makers expected to benefit from Lenovo targeting smartphones in 2013
- LED firms to lower prices through improved technology
- Commentary: High-end LED lighting in demand
- Digitimes Research: Europe solar trade tariffs may slow down market growth
- BenQ Materials expects performance to improve in 2Q13
- TV panel pricing expected to further drop in May, says WitsView
- Demand for large-size driver ICs to boom in 2H13, say backend firms
- TPK expected to see decline in touch screen notebook market share during 2Q13
- Taiwan attracts January-April foreign direct investment of over US$1.5 billion
- Releases
- White papers
- Bulletin
- EverFocus launches ECOR960 X1 16CH with better image quality and more affordable price
- Leadtek to Show Total Cloud Solutions at Computex Taipei 2013
- Clientron to exhibit its latest Zero/Thin Client and POS solutions along with the full product line at Computex Taipei 2013
- DIGIEVER partnership with EverFocus for better professional network surveillance solutions
- Advantech Introduces New 18" and 21" Widescreen Multitouch Panel PCs
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Chilisin introduces Thin-film chip inductor 0201 size
- Chilisin at 2012 electronics Munich A5/159 & 260
- Chilisin sunken-type molded power inductor for MXM Graphic application
21-May-2013 markets closed
| Last | Change |
| TAIEX (TSE) | 8383.05 | +6.00 | +0.07% |

| TSE electronic | 316.85 | +0.06 | +0.02% |

| GTSM (OTC) | 120.38 | +0.64 | +0.53% |

| OTC electronic | 144.61 | +0.55 | +0.38% |

- Weak eurozone growth hits euro (May 15) - The Financial Times
- German factory orders rise for second month (May 7) - Bloomberg
- Eurozone retail sales fall for second consecutive month (May 6) - BBC News
- China economy to stay commodity-oriented, says JPMorgan (April 16) - Bloomberg
- S Korea in US$15.3 billion stimulus bid to spur economic growth (April 16) - BBC News
- Gold hit by sharpest tumble in 30 years (April 16) - CNN
- FBI probes Boston 'terror' blasts (April 16) - BBC News
- China GDP growth slows to 7.7% (April 14) - Wall Street Journal

Opportunity lies for MEMS energy harvesting: Q&A with Holst Centre general manager Bert Gyselinckx
Digitimes recently interviewed Bert Gyselinckx, general manager of the Holst Centre in Eindhoven, to...

Returning with stronger competitiveness: Q&A with Lu Li-Cheng, Chaintech chairman
Chaintech, a motherboard/graphics card maker, which quit the market once and returned recently, has...

MEMS-enabled energy harvesting: Q&A with MIG executive director Karen Lightman
Digitimes recently spoke with Karen Lightman, the executive director of MEMS Industry Group (MIG),...

Complete mobile platform solutions: Q&A with Broadcom executive VP Robert Rango
In a relentless competition against rivals including Qualcomm, Nvidia and Media in the smartphone chipset...
- Smartphone and tablet industry: The view from Taiwan - May 2012
Taiwan-based companies have a long and successful history of involvement in the supply chain for mobile devices, which for the purposes of this article consist...
- Taiwan motherboard industry overview - May 2012
The year 2011 saw the motherboard industry reverse its trend of declining shipments year-on-year, to post a slight 0.2% growth. This upturn in fortunes was expected...
- Notebook market overview - Jun 2011
The notebook industry in 2010 experienced several major events that significantly changed the industry's ecosystem for the year and the industry is also believed...
- LCD TV overview - Jun 2011
Growth of the global LCD TV market was not as strong as expected in 2010 as the market continued to feel the aftershocks of the economic recession that had hit...
- Trends and shipment forecast for 2H 2012 tablet market
Digitimes Research remains conservative about the prospects for the period, with half-year shipments projected to reach 49.18 million units and whole-year shipments being revised downward to 88.69 million units.
- Trends in the China video market
In addition to strong potential video content demand in China, the market has developed rapidly due to government intervention and delays in establishing copyright protections.
- Trends in Asia LED chip manufacturing industry
Asia is playing an ever more important role in upstream LED chip manufacturing. The region accounted for 80% of MOCVD demand in 2011 and will account for 90% in 2012, largely because Taiwan, Japan, South Korea and China are the major global centers for LED chip production.


















