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Thursday 21 March 2024
ASE expands VIPack advanced packaging solutions for AI device apps
Advanced Semiconductor Engineering (ASE), a member of ASE Technology Holding, has announced the expansion of its advanced interconnect technology on the VIPack platform. This development...
Thursday 21 March 2024
India reportedly expresses reservation about HCL-Foxconn OSAT project
Although India approved three chip projects under its flagship incentive policy, the Indian government reportedly has some reservations about the packaging and testing facility project...
Thursday 21 March 2024
Nvidia's Jensen Huang takes diplomatic rain check on Samsung's wafers
Huang showcased his diplomatic flair at Nvida's AI developers' conference.
Thursday 21 March 2024
Why IDMs are increasing their GaN production capacity
Market experts have noted a trend towards IDM dominance in the GaN semiconductor market, exemplified by Infineon's acquisition of GaN Systems and major power semiconductor firms expanding...
Thursday 21 March 2024
Exclusive: Canadian silicon photonics firm Ranovus partners with MediaTek to seize AI opportunities
Ranovus, a Canadian silicon photonics scaleup company specializing in high-speed optical interconnect chips, announced on March 20, 2024, a groundbreaking partnership with MediaTek...
Thursday 21 March 2024
ASEH acquires land for new factory site in Mexico
Taiwanese OSAT ASE Technology Holding (ASEH) has acquired 37,220 square meters of land in Jalisco, Mexico.
Thursday 21 March 2024
Taiwan's President-Elect promises to make semiconductor ecosystem even stronger
Taiwan's President Elect Lai Ching-te promises to build a stronger and more prosperous semiconductor industry, with a bigger economic effect in Taiwan after taking office on May 20...
Thursday 21 March 2024
Nvidia CEO reiterates solid partnership with TSMC
One key takeaway from the ongoing GTC is that Nvidia's AI empire has taken shape with strong partnerships from TSMC and other Taiwanese makers, such as those major server ODMs.
Wednesday 20 March 2024
Intel grabs away US$8.5 billion CHIPS Act money and a US$11 billion loan
The Biden-Harris Administration announced that the US Department of Commerce and Intel Corporation have reached a non-binding preliminary Memorandum of Terms (PMT) to provide up to...
Wednesday 20 March 2024
SEMI expects record US$137 billion in 300mm fab equipment spending in 2027
Global 300mm fab equipment spending for front-end facilities is forecast to reach a record US$137 billion in 2027, after topping US$100 billion for the first time in 2025, driven...
Wednesday 20 March 2024
Semiconductor system-level integration opens SLT opportunities for Taiwanese EMS providers amid AI boom
While chip design giants like Nvidia, AMD, and Intel prioritize "system-level" integration, all the six major Taiwanese EMS providers – Foxconn, Wistron, Compal, Quanta, Inventec...
Wednesday 20 March 2024
TSMC Japan 3DIC R&D Center increases partners to meet AI chip solution demand
TSMC Japan 3DIC R&D Center, located at Tsukuba Shi of the Ibaraki Prefecture, is now developing solutions for enlarging AI chip substrates.
Wednesday 20 March 2024
Generative AI will bring in a decade-long golden age for Taiwanese supply chain, says DIGITIMES VP
DIGITIMES Vice President Eric Huan Huang says despite the potential for AI development to become overinflated, there are significant growth opportunities in the future for AI appli...
Wednesday 20 March 2024
Samsung grapples with surging procurement costs amid global inflation, geopolitical factors
Samsung Electronics witnessed a significant surge in the procurement costs of raw materials for IT products in 2023.
Wednesday 20 March 2024
Go or stay? ASML wades from geopolitics into domestic politics
Following media reports that the Netherlands-based lithography equipment leader ASML is harboring thoughts to move its operations abroad, the country's political climate, especially...