Inventory adjustments at Compal Electronics' notebook customers have come to an end, according to Martin Wong, president of the Taiwan-based ODM. The company expects the second half...
Samsung Electronics has announced that its newest automotive processor, the Exynos Auto V920, will be used to power Hyundai Motor Company's next-generation in-vehicle infotainment...
Taiwan power component makers are expected to see increasing shipments for EV, industrial control and green energy applications in 2023, and particularly will play a more important...
IC design house Sunplus Technology has expressed caution about its business prospects for the second half of 2022, as customers request shipment deferrals amid inflation and other...
Samsung Electronics, SK Hynix and Micron Technology held a combined 94% share of the global DRAM market in 2021, with Samsung and SK Hynix collectively taking up 71.3% of the market,...
Denso and United Semiconductor Japan (USJC), a subsidiary of Taiwan-based United Microelectronics (UMC), have announced they will partner to manufacture automotive power semiconduc...
NAND flash device controller specialist Phison Electronics has had its solutions pass ISO 26262 automotive functional safety and development process certification, and is looking...
Memory and storage revenue has outpaced the rest of the semiconductor industry over the last two decades, according to Sanjay Mehrotra, president and CEO for Micron Technology, who...
Samsung Electronics has introduced three automotive chip solutions, the Exynos Auto T5123 for 5G connectivity, the Exynos Auto V7 for comprehensive in-vehicle infotainment systems...
Taiwan-based foundries and IC design houses are looking to expand their presence in the automotive electronics sector, where chip demand is set to grow robustly, according to industry...
Despite some ongoing shortages of microcontrollers and automakers having to temporarily close assembly lines this year, automotive MCU sales are forecast to surge 23% in the economic...
Micron Technology has unveiled memory and storage innovations across its portfolio based on its 176-layer NAND and 1α (1-alpha) DRAM technology, as well as what the company...
AMD at the ongoing Computex 2021 talked about its 3D chipset processor developed jointly with TSMC, which provides its 3D silicon stacking and advanced packaging technologies.
Memory chipmakers and related controller suppliers have stepped up their deployments in the automotive field, looking to grasp new business opportunities.
