Samsung Electronics is making an extra effort to capture the opportunities brought by artificial intelligence while cutting losses in its semiconductor business. It is said to be...
In the third quarter of 2023, SK Hynix saw its DRAM business get out of the red thanks to increased demand for high-bandwidth memory (HBM) and DDR5. However, its NAND Flash business...
Memory spot prices for DRAM and NAND continue to pick up despite seasonal demand for the fourth quarter almost reaching an end, according to sources from the memory supply chain.
In view of the rapid growth of the AI market demand, SK Hynix has been increasing investments in products with high gross margins, such as High Bandwidth Memory (HBM) and DDR5. SK...
A recent TechInsights analysis indicates that Yangtze Memory has developed advanced 3D NAND memory for consumer devices. The research firm characterizes the device's appearance in...
The memory market is still slow. Operating losses at SK Hynix continued in the third quarter of 2023, but the quarterly loss was reduced by 37.8%. Despite this, its DRAM division...
Memory chip manufacturers are preparing to beef up their offerings to meet rising demand triggered by generative AI being integrated into PCs and other terminal devices, according...
Samsung Electronics has recently released its new-generation memory solutions aimed at the generative AI and large language model (LLM) markets, including the fifth-generation high-band...
Yangtze Memory has developed 120-layer NAND flash memory as a "secret weapon" to circumvent US restrictions on the sales of 3D NAND with 128 layers or more to China, according to...
Samsung Electronics is currently dedicated to the R&D of 11nm level DRAM and ninth-generation 3D NAND Flash. The goal is to raise integration to the highest level in the industry,...
The PC application inventory adjustment has reached the end and is set to bounce back. Memory supply chain sources pointed out that recently, PC OEMs have been actively replenishing...
Phison Electronics, a specialist in NAND flash device controllers, is set to enter mass production of PCIe 5.0 retimer ICs in the first quarter of 2024, anticipating a surge in server...
Some predictions suggest that as DRAM technology development is gradually approaching a bottleneck, hybrid bonding technology may be introduced into future DRAM manufacturing processes...
As Samsung Electronics and other chipmakers substantially reduce their NAND flash wafer output, industry sources indicate that memory module manufacturers will have to compete on...
