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News tagged packaging
  • Last update: Tuesday 7 April 2015 [426 news items]

SMIC, JCET form JV for 12-inch bumping and testing

Feb 21, 14:26

Semiconductor Manufacturing International (SMIC) and Jiangsu Changjiang Electronics Technology (JCET), an IC assembly and test services provider in China, have established a joint...

SPIL to grow sales of silver wire-bonding packaging in 2014

Feb 12, 11:49

Chip packager Siliconware Precision Industries (SPIL) expects the development of its silver wire-bonding packaging business to bear fruit in 2014.

Amkor, STATS ChipPAC and ASE to share backend orders for Apple A8 chip, say sources

Jan 27, 14:55

Amkor Technology and STATS ChipPAC have each obtained 40% of the total packaging orders placed by Apple for its next-generation A8 processor, with the remaining 20% will be taken...

Asia Tech Image steps into COB packaging of smartphone CCMs, says paper

Newswatch - Jan 17, 10:32

Contact image sensor (CIS) module supplier Asia Tech Image has extended operation to COB (chip on board) packaging of smartphone compact camera modules (CCMs) and will start shipments...

Semiconductor packaging materials market to approach US$21 billion by 2017, says SEMI

Jan 14, 14:00

The market for semiconductor packaging materials, including thermal interface materials, is expected to maintain its US$20 billion value through 2017 despite shifts away from the...

Packaging material distributor Niching to set up nano silver paste production lines

Dec 26, 16:20

Taiwan-based IC packaging material distributor Niching Industrial has spent NT$125 million (US$4.16 million) for the purchase of a building in preparation for setting up nano silver...

PTI to grow sales of logic IC backend service biz in 2014

Dec 26, 10:29

Memory-IC packaging and testing specialist Powertech Technology (PTI) is expected to enjoy significant growth in sales of its logic IC backend service business in 2014, thanks to...

PTI chairman DK Tsai expresses optimism about company logic IC backend service business

ChipMOS to nearly halve capex for 2014

Dec 19, 22:04

Packaging and testing firm ChipMOS Technologies plans to allocate NT$1.8 billion (US$60.2 million) for its capex in 2014, down from NT$3.5 billion in 2013.

ASE starts moving production equipment at offending factories to other plants, say sources

Dec 16, 21:33

Advanced Semiconductor Engineering (ASE) has begun to move some of the production equipment installed at its K5, K7 and K11 factories to other plants, in order to mitigate the impact...

Amkor, Globalfoundries and Open-Silicon partner to develop SoC on 2.5D interposer

Nov 25, 10:21

Amkor Technology, Globalfoundries and Open-Silicon have jointly announced the successful demonstration of a functional SoC featuring two 28nm logic chips with embedded ARM processors,...

Chip carrier packaging grows on widespread adoption of QFN package, says IC Insights

Sep 4, 12:32

Advanced packaging of semiconductor chips has emerged as a key enabler in many of today's electronic system products. While much attention with regard to IC packaging is on 3D stacking...

SEMICON Taiwan 2013: 3D-IC, 450mm and advanced packaging in the spotlight

Sep 4, 11:08

The 18th annual SEMICON Taiwan trade show has kicked off and will run through Friday at the Taipei World Trade Center Nangang Exhibition Hall, highlighting seven theme pavilions including...

TSMC

STATS ChipPAC delivers ultra thin PoP solutions with eWLB packaging

Aug 20, 11:44

STATS ChipPAC has announced it has reduced package-on-package (PoP) height with its ultra thin embedded wafer level ball grid array (eWLB) technology. The eWLB-based PoP solutions...

Taiwan 3Q13 IC backend production value to register slight growth, says IEK

Aug 16, 16:13

The production value of Taiwan's IC packaging and testing industry sectors will register sequential growth of 4.6% and 4.3%, respectively, in the third quarter of 2013, according...

Tong Hsing looks to strong sales in 3Q13

Aug 12, 18:09

Tong Hsing Electronic Industries expects its sales in the third quarter of 2013 to grow at the same pace or higher than the 8% it posted in the previous quarter, powered by ever growing...

Amkor completes acquisition of Toshiba packaging unit in Malaysia

Aug 1, 14:50

IC assembly and test service provider Amkor Technology has completed its acquisition of Toshiba's semiconductor packaging operation in Malaysia, according to the two companies.

Nichia faces competition for LED packaging from Taiwan-, China-, South Korea-based makers

Jul 23, 14:42

Japan-based Nichia has gained a leading market status in EMC (epoxy molding compound)-based LED chip packaging, but some Taiwan-, China- and South Korea-based LED packagers have been...

PTI enjoys rising shipments for mobile DRAM

Jul 15, 21:07

Packaging and testing firm Powertech Technology (PTI) has enjoyed growth in its shipments for mobile DRAM chips to Elpida Memory since the second half of 2012, according to market...

Some LED chip makers extend to packaging

Jul 10, 11:11

Some of Taiwan-based LED chip makers have extended to packaging, offering solutions that EMS players can directly turn into lighting products, according to industry sources.

High-end packaging next battlefield for IC assembly and test services providers, says Amkor executive

Jul 9, 15:53

Robust growth in smartphone usage is encouraging semiconductor assembly and test services providers to head towards related packaging technologies. Amkor Technology is already among...

Kevin Yu, Amkor sales director for Greater China

Edison Opto expanding LED packaging capacity

Jul 8, 10:23

Edison Opto is expanding its monthly LED packaging capacity from 150 million PLCC (plastic leaded chip carrier) small- to medium-power devices and 10 million high-power devices at...

LED packaging houses face rising technological challenge

Jun 17, 10:33

South Korea-based TV makers hope to further reduce the cost of direct-lit LED TVs by using fewer LED chips in backlight modules, hence the firms hope LED packaging houses can increase...

Demand for large-size driver ICs to boom in 2H13, say backend firms

May 21, 14:47

Packaging and testing firms Chipbond Technology and ChipMOS Technologies both expect orders for large-size LCD driver ICs to pull in during the second half of 2013 on booming demand...

Touchscreen IC suppliers to see May sales increase

May 10, 11:25

Touchscreen controller IC suppliers Elan Microelectronics and Egalax-Empia Technology (EETI) are expected to post significant growth in May sales driven by demand from the PC sector,...

Supply for high-end IC packaging to fall short in 2H13, says SPIL chair

May 2, 14:49

Supply for high-end IC packaging is likely to fall short of demand during the second half of 2013, according to Bough Lin, chairman for Siliconware Precision Industries (SPIL). SPIL...

SPIL chairman Bough Lin

Backend firms see DRAM market recovery

Apr 23, 16:16

Memory packaging and testing specialists Powertech Technology (PTI), Walton Advanced Engineering and Formosa Advanced Technologies (FATC) are expected to benefit from a recovery in...

ASE, SPIL 2Q13 sales outlook optimistic

Apr 18, 22:10

Market watchers are more optimistic about the IC packaging and testing business in the second quarter of 2013, judging from a rosy outlook provided by TSMC for the quarter. Sales...

Backend to outperform IC sector, says ASE chair

Apr 15, 23:37

The packaging and testing sector is set to outperform the overall industry in 2013, said Jason Chang, chairman for Advanced Semiconductor Engineering (ASE), during a recent company...

Demand for COB packaging used in high-power LED lighting to grow fast, says Lextar

Apr 2, 20:53

As high-power LED lighting for commercial purposes is significantly on the rise, demand for COB (chip on board) packaging of high-power LED chips used in lighting will grow fast in...

Intel to keep LGA as mainstream packaging until 1H15, say Taiwan motherboard makers

Mar 22, 10:53

Intel's latest roadmap for desktop platform development indicates that LGA will be maintained as the mainstream packaging for processors, accounting for 95% of all packaging, at least...

Packaging material supplier Chang Wah to post double-digit revenue growth in 2Q13

Mar 20, 14:19

Packaging material supplier Chang Wah Electromaterials is expected to post a double-digit growth in revenues in the second quarter of 2013, powered by increasing orders for flip chip...

Greatek looks to improved profitability on copper wire bonding lines

Mar 13, 13:51

Logic IC packaging firm Greatek Electronics has revealed that copper wire bonding packaging lines are currently contributing more than 50% to its total revenues, which will further...

Altera, Xilinx to switch from TSMC CoWoS process to PoP packaging for next-generation chips, says paper

Newswatch - Mar 4, 12:18

Altera and Xilinx both have decided to adopt PoP (package on package) packaging technology for its next-generation chips, instead of using chip-on-wafer-on-substrate (CoWoS) process...

Scientech deepens development of 3D IC, wafer-level packaging equipment

Jan 31, 16:04

Taiwan-based semiconductor equipment distributor Scientech has deepened its development of 3D IC packaging and wafer-level packaging equipment, expecting some of its equipment to...

IC backend firms to suffer setback in January-February, says SPIL chair

Jan 31, 12:15

IC packaging and testing companies will suffer setbacks in revenues during January and February because of inventory adjustments at clients, as well as fewer working days due to the...

SPIL chairman Bough Lin
426 items [2/13]
  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

2015 China IC design market forecast
2015 China smartphone panel trend forecast

17-Apr-2015 markets closed

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OTC electronic188.79-2.03-1.06% 

Analysis of China revised domestic semiconductor industry goals
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