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News tagged packaging
  • Last update: Wednesday 8 February 2017 [485 news items]

Cadence launches complete IC packaging design and analysis solutions for fan-out WLCSP

Mar 16, 11:03

Cadence Design Systems has announced the availability of foundry-proven IC packaging design and analysis solutions for advanced fan-out wafer-level chip scale packaging (WLCSP) and...

New Kinpo to start trial production at Brazil NAND flash plant in May

Mar 14, 14:33

Taiwan-based New Kinpo Group expects construction of a NAND flash packaging factory in Brazil to complete by the end of March with trial production to begin in May, according to the...

Xintec February revenues rise 30% on month

Mar 14, 11:38

Taiwan-based Xintec, an affiliate of Taiwan Semiconductor Manufacturing Company (TSMC) specializing in packaging services for CMOS image sensors as well as MEMS and fingerprint sensors,...

MLS to extend packaging from LEDs to ICs, says president

Mar 1, 15:52

The largest China-based LED packaging service provider MLS will extend business operations to IC packaging and testing services, according to company president Lawrence Lin.

MLS president Lawrence Lin

SPIL to deal out cash dividend per share of NT$3.80 for 2015

Feb 25, 13:58

IC packager Siliconware Precision Industries (SPIL) has decided to distribute a cash dividend per share of NT$3.80 (US$0.11) for 2015, according to a resolution passed by the company's...

Digitimes Research: IC manufacturers to cross into packaging industry

Feb 19, 15:38

With IT products such as smartphone and Internet of Things (IoT) devices being designed with considerations of high performance, low cost, low power consumption and small form factor,...

ASE, SPIL set to report robust profits for 2015

Jan 20, 14:44

Advanced Semiconductor Engineering (ASE) is expected to see its 2015 profits hit the second-highest level in the company's history, while fellow packaging and testing company Siliconware...

ChipMOS to expand production capacity for LCD driver ICs

Dec 24, 15:15

Packaging and testing company ChipMOS Technologies is expected to expand production capacity for LCD driver ICs during 2016 as the company is positive about Ultra HD TV demand, according...

Advanced semiconductor packaging drives materials consumption through 2019, says SEMI

Dec 15, 15:54

The US$18 billion semiconductor packaging materials will undergo steady single-digit unit volume growth for many material segments through 2019, including laminate substrates, IC...

TSMC to provide backend InFO packaging technology for Apple chips, says report

Newswatch - Dec 11, 10:48

TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016. Apple will be among the first wave of...

TSMC raises holdings in affiliate Xintec

Stockwatch - Nov 27, 10:06

Taiwan Semiconductor Manufacturing Company (TSMC) has hiked its holdings in affiliate Xintec to more than 51%, as a result of the addition of two new subsidiaries to TSMC, Xintec...

Commentary: Taiwan IC backend firms facing challenge from fast expanding China competitors

Nov 26, 16:23

A recent media report indicating that China-based Jiangsu Changjing Electronics Technology (JCET) has landed SiP (system-in-package) module orders from Apple could serve as a warning...

ASE to expand workforce at Chungli facility

Nov 26, 10:22

Advanced Semiconductor Engineering (ASE) will expand the workforce at its manufacturing site in Chungli, northern Taiwan to 15,000 from the current 9,000, as sales generated from...

ChipMOS to expand business in China

Nov 2, 10:39

Acknowledging robust demand from China-based panel makers including BOE Technology and China Star Optoelectronics Technology (CSOT), LCD driver IC backend houses such as ChipMOS Technologies...

Cadence offers design tools for TSMC InFO packaging

Sep 23, 15:58

Cadence Design Systems has announced that its Allegro system-in-package (SiP) and physical verification system (PVS) implementation technologies have been enabled for TSMC's integrated...

SPIL looks to effective results of SiP packaging development with Foxconn

Sep 2, 11:22

Siliconware Precision Industries (SPIL) expects its strategic partnership with Foxconn Electronics for developing SiP (system-in-package) packaging technology to begin bearing fruit...

SPIL chairman Bough Lin

SPIL 2Q15 revenues meet low-end guidance

Jul 6, 21:57

Packaging and testing house Silicon Precision Industries (SPIL) saw its second-quarter revenues increase 2.1% sequentially to NT$21.24 billion (US$686.6 million), which met the low-end...

SPIL chairman Bough Lin expects business to hit bottom in June-July

PTI set to post revenue growth in 3Q15

Jul 3, 14:43

Memory packaging and testing house Powertech Technology (PTI) is set to enjoy revenue growth sequentially in the third quarter of 2015, thanks to a pick-up in demand for memory chips,...

IC backend set for tepid growth in 2H15, says ASE COO

Jun 24, 12:28

The global IC packaging and testing industry has been working through excessive inventory for almost two quarters, but is set for tepid growth in the second half of the year, according...

Niching May sales rise 18%

Jun 10, 10:46

Semiconductor packaging material and equipment distributor Niching Industrial has reported consolidated revenues of NT$95 million (US$3.1 million) for May 2015, up 18% on month but...

Computex 2015: ASE to showcase SiP solutions

Jun 1, 15:49

Advanced Semiconductor Engineering (ASE) has announced it will be showcasing system-in-package (SiP) solutions for consumer applications at the Computex Taipei 2015. These SiP applications...

Packaging material supplier Chang Wah to distribute cash dividend of NT$3.50 for 2014

May 14, 16:45

Packaging material and equipment supplier Chang Wah Electromaterials (CWE) has decided to deal out a cash dividend per share of NT$3.50 (US$0.11) for 2014.

SPIL to see sales rebound in May, says paper

May 13, 21:25

IC packaging and testing company Siliconware Precision Industries (SPIL), which saw its revenues decrease 6.6% sequentially in April, is expected to see its May revenues rebound,...

TSMC InFO-WLP technology to generate significant revenues starting 2016

May 5, 22:25

Taiwan Semiconductor Manufacturing Company's (TSMC) backend integrated fan-out (InFO) wafer-level packaging (WLP) technology will start contributing significantly to the IC foundry's...

Altera, TSMC develop UBM-free WLCSP packaging

Apr 7, 21:30

Altera and TSMC have produced an UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology for Altera's MAX 10 FPGA products, according to the comp...

SEMI reports 2014 semiconductor materials sales of US$44.3 billion

Apr 7, 13:59

The global semiconductor materials market increased 3% in 2014 compared to 2013, while worldwide semiconductor revenues increased 10%, according to SEMI. Revenues of US$44.3 billion...

Xintec to list on Taiwan OTC on March 30

Mar 25, 21:53

Image sensor packaging house Xintec will be listed on the Taiwan over-the-counter (OTC) stock market at a tentative price of NT$42 (US$1.34) per share on March 30, according to the...

Xintec 12-inch wafer-level CSP ready for volume production in 2H15, says chairman

Mar 17, 20:01

Image sensor packaging house Xintec will have its 12-inch wafer-level chip-scale package (WL-CSP) line ready for volume production in the second half of 2015, according to company...

Xintec chairman Robert Kuan

National Instrument transforms Taiwan office to independent company

Mar 13, 15:59

National Instrument has announced it has transformed its branch office in Taiwan to become an independent company starting March and expects the company to achieve 20-40% on-year...

TSMC to offer InFO-WLP technology for 16nm chips, eyeing Apple orders

Feb 4, 13:45

Taiwan Semiconductor Manufacturing Company (TSMC) will have its backend integrated fan-out (InFO) wafer-level packaging (WLP) technology ready for 16nm chips, eyeing orders for Apple's...

SPIL gearing up for fan-out WLP

Jan 29, 19:39

Siliconware Precision Industries' (SPIL) fan-out type wafer level packaging (WLP) will be ready for mass production in 2016, company chairman Bough Lin said during a January 28 investors...

Chipbond, ChipMOS 1Q15 sales to drop 5-10%

Jan 19, 10:36

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies are both expected to see their first-quarter 2015 sales decrease 5-10% sequentially, compared...

UTAC said to set up 12-inch wafer-level packaging line in Taiwan

Dec 23, 15:13

United Test and Assembly Center (UTAC), a Singapore-based assembly and test company, will continue its investment in Taiwan in 2015 by setting up a 12-inch wafer-level packaging line,...

Micron, PTI partner for assembly and packaging services in China

Stockwatch - Dec 3, 22:10

Micron Technology and Powertech Technology (PTI) have entered into a series of agreements forming the basis of a long-term strategic relationship for assembly and packaging services...

Over 100 China-based LED packaging houses to be forced out of competition in 2014

Dec 2, 22:10

Profitability for LED products is shrinking due to continual price drops along with increasing competition, and more than 100 relatively small China-based LED packaging service providers...

485 items [2/14]
Realtime news
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    Before Going to Press | Feb 21, 20:36

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    Before Going to Press | Feb 21, 20:35

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    Before Going to Press | Feb 21, 19:46

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    Before Going to Press | Feb 21, 19:32

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    Before Going to Press | Feb 21, 19:00

  • Smart City Summit & Expo 2017 opens in Taipei

    Before Going to Press | Feb 21, 18:35

  • Viettel sets up joint venture in Myanmar, says report

    Before Going to Press | Feb 21, 18:30

  • Sony launches OLED TVs in parallel with LCD TVs, says reports

    Before Going to Press | Feb 21, 18:12

  • Server DRAM prices to continue growth in 2Q17, says DRAMeXchange

    Before Going to Press | Feb 21, 18:07

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  • Samsung+128GB+TSV+DDR4+RDIMM

    Samsung 128GB TSV DDR4 RDIMM

    Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules...

    Photo: Company, Dec 9.

  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

Innodisk
Global AP demand forecast, 2017-2020

21-Feb-2017 markets closed

 LastChange

TAIEX (TSE)9763.93+10.73+0.11% 

TSE electronic393.93+0.19+0.05% 

GTSM (OTC)133.79-0.29-0.22% 

OTC electronic186.19-0.14-0.08% 

Analysis of China revised domestic semiconductor industry goals
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