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NEWS TAGGED PACKAGING
Friday 19 January 2024
Backend houses bullish about advanced packaging demand
Long-term prospects are bright for advanced packaging technology, thanks to robust demand for AI and HPC chips, according to sources at backend houses.
Thursday 18 January 2024
Advanced packaging continues to boost high-end material demand
According to sources at IC packaging material distributors, advanced packaging and heterogeneous integration are driving demand for high-end materials.
Wednesday 10 January 2024
TSMC continues expanding CoWoS packaging capacity
TSMC continues to expand its CoWoS packaging capacity despite recent market rumors suggesting Nvidia has scaled back its orders with the foundry for 2024, according to industry sou...
Wednesday 3 January 2024
Chinese chip firms' valuations outperform local market in 2023; equipment shines
China's semiconductor firms in the IC packaging & testing, equipment, foundry, and IC design industries performed much better than their IDM, materials, optoelectronics, and memory...
Tuesday 2 January 2024
Dutch chip equipment supplier BE Semiconductor Industries sees soaring 2023 valuation driven by advanced packaging
Marking the beginning of 2024, DIGITIMES Asia compiled the list of the top 100 semiconductor companies based on their market values in dollar terms at the end of 2023. The median...
Friday 29 December 2023
Everlight expects compound semiconductor packaging and testing, automotive businesses to grow in 2024
Everlight Electronics expects its compound semiconductor packaging and testing business to enjoy robust growth in 2024, according to the LED packaging house. It expects related orders...
Wednesday 27 December 2023
ASE to acquire facilities from subsidiary for packaging capacity expansion
OSAT Advanced Semiconductor Engineering (ASE) will acquire facilities from its fully-owned subsidiary ASE Test to boost packaging capacity, according to the former's parent company,...
Tuesday 26 December 2023
Innolux to launch semiconductor advanced packaging mass-production 2H24
Industry sources indicate that Taiwan-based panel maker Innolux has received orders occupying the entire capacity of its first-phase chip-first advanced fan-out panel level packaging...
Monday 25 December 2023
Taiwanese FCCL, communication antenna suppliers optimistic about 2024 shipment prospects
Taiwan's flexible copper clad laminate (FCCL) supplier Taiflex Scientific, and microwave RF communication substrate and PCB maker New Era Electronics, are both optimistic about the...
Thursday 21 December 2023
Chinese packaging and testing providers venture into SEA amidst geopolitical tensions
Over the past two years, due to the pandemic's impact on supply chains and instability factors like the Russia-Ukraine war and US-China tensions, chipmakers have taken actions to...
Wednesday 20 December 2023
Winbond, PTI team up for 2.5/3D packaging
Winbond Electronics, a Taiwan-based memory chipmaker, has signed a letter of intent to collaborate with OSAT Powertech Technology (PTI) to jointly develop 2.5D and 3D advanced packaging,...
Wednesday 20 December 2023
Taiwan's NSTC offers grants for local heterogeneous integration and advanced packaging EDA tools
The US Defense Advanced Research Projects Agency's (DARPA) 2023 Electronic Resurgence Initiative 2.0 has inspired Taiwan to develop its electronic design automation tools for heterogeneous...
Tuesday 19 December 2023
Why would China send GPUs to Malaysia for advanced packaging?
A Reuters report quoted three people familiar with the fact that more and more Chinese IC design houses are having their chips packaged in Malaysia, worrying that the US...
Tuesday 19 December 2023
Strong high-end packaging demand to buoy Winstek in 2024
Taiwan-based IC backend firms, including Winstek Semiconductor (formerly STATS ChipPAC Taiwan), are positioning themselves to take advantage of robust demand for high-end packaging...
Wednesday 13 December 2023
GenAI drives HBM packaging innovation: SK Hynix and Micron forge ahead, Samsung seeks new path
In the race for dominance in high-bandwidth memory (HBM), SK Hynix and Micron have already established the direction for the next generation of HBM packaging technology. However,...
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