The US Defense Advanced Research Projects Agency's (DARPA) 2023 Electronic Resurgence Initiative 2.0 has inspired Taiwan to develop its electronic design automation tools for heterogeneous...
A Reuters report quoted three people familiar with the fact that more and more Chinese IC design houses are having their chips packaged in Malaysia, worrying that the US...
Taiwan-based IC backend firms, including Winstek Semiconductor (formerly STATS ChipPAC Taiwan), are positioning themselves to take advantage of robust demand for high-end packaging...
In the race for dominance in high-bandwidth memory (HBM), SK Hynix and Micron have already established the direction for the next generation of HBM packaging technology. However,...
Memory prices have shown a robust upward trend since bottoming out in the second quarter of 2023. While November saw NAND flash prices rebound to early 2023 levels, DRAM and NAND...
Amkor Technology has announced plans to construct an advanced packaging and test facility in Peoria, Arizona. Amkor expects to invest around US$2 billion and employ approximately...
Samsung Electronics is not only investing actively in the R&D and capacity expansion of high-bandwidth memory (HBM) technology, but also looking to broaden its market reach through...
BIWIN Storage Technology Co., Ltd. (referred to as BIWIN) focuses on the research and development, packaging and testing, and manufacturing of memory chips. It is recognized as a...
Samsung Electronics executives have recently disclosed their 2024 semiconductor strategy, named "GDP" (Gate-All-Around, DRAM, and Packaging), at an investors forum, aiming to tap...
India's efforts to build a semiconductor manufacturing ecosystem have seen numerous companies enter the semiconductor packaging segment. One of them, Kaynes SemiCon, has revealed...
CMOS image sensor (CIS) packaging house Tong Hsing Electronic expects modest sequential shipment growth in the fourth quarter of 2023, as communication module and car sales momentum...
With the surging demand for advanced semiconductors powering generative AI and end-user device AI, Samsung Electronics is reportedly set to launch its 3D packaging technology in 2024,...
Chang Wah Technology (CWTC), Niching Industrial, Topco Scientific, and Wahlee Industrial, among others, have observed an increase in demand for IC packaging materials and are generally...
As the material handling in each production process of semiconductor factories is moving toward intelligent transportation, Taiwanese equipment manufacturers have evolved from mature...
The shipment volume of smartphones in China has been continuously decreasing for ten consecutive quarters. The latest reports from various research institutions, including TechInsights,...
