Samsung Electro-Mechanics (Semco) is poised to strengthen its position in the semiconductor industry with the construction of a new plant at its Sejong manufacturing base in South...

TSMC has made changes to its new fab projects in Taiwan, including the suspension of a planned advanced packaging fab in the Hsinchu Science Park (HSP) Tongluo site, according to...

Contrel Technology, an LCD equipment specialist, has received orders for microLED and panel-level packaging from Taiwan's top-two panel makers, AUO and Innolux, which will drive revenue...

TSMC has become the primary revenue backer of the Southern Taiwan Science Park (STSP), as it is for the Hsinchu Science Park (HSP), which is nearly saturated with land, according...

China's JCET Group, a provider of IC backend manufacturing and technology services, reported revenue climbed 30.8% sequentially to CNY8.26 billion (US$1.13 billion).

Winbond Electronics, a specialty DRAM and flash memory maker, has expressed optimism about its business and market prospects for next year, noting the resolution of the majority of...

Intel is optimistic that for the first time in two years, fourth-quarter 2023 revenue will return to positive year-over-year growth, and that the PC market, which accounts for the...

AI chips and co-packaged optics (CPO) will stimulate demand for advanced packaging in 2024, during which the semiconductor industry is expected to rebound.

Substrate-based packaging for chiplet designs is gaining favor among AI HPC customers, according to sources at OSATs.

Faraday Technology, a Taiwan-based provider of fabless ASIC services and silicon IP, expects to post a revenue decrease of 4-6% sequentially in the fourth quarter of 2023.

High-speed data transmission has come into the spotlight along with cloud-based AI accelerator chips as one of the most vital capabilities in the electronics industry, and silicon...

AI will drive demand for PC, handset, and other terminal device replacements, according to sources at chipmakers.

Chinese OSATs such as JCET are expanding their capacity in the city of Jiangyin on China's east coast, according to industry sources. Their expansion focuses on advanced packaging.

United Microelectronics (UMC) has certified Ansys' multiphysics solutions to simulate the foundry's latest 3D-IC WoW stacked technology, which will improve the power, efficiency,...

Robust demand for CoWoS and other advanced packaging will positively contribute to C Sun Manufacturing's sales operations in the second half of this year, according to the semiconductor...