Infineon reportedly is mulling investing in the US for the production of silicon carbide (SiC) devices in line with the Inflation Reduction Act (IRA) requirements, according to industry...
Applied Materials has announced its intention to establish a collaborative engineering center in Bangalore, India that will focus on the development and commercialization of semiconductor...
Taiwan-Asia Semiconductor (TASC) has stepped up the development of its gallium nitride-on-silicon, silicon carbide and other wide bandgap (WBG) semiconductor technologies, targeting...
Silicon wafer supplier GlobalWafers expects its growth momentum to slow down in the second quarter of 2023, after seeing its revenue hit a record high in the first quarter, according...
Qualcomm promoted the concept of "hybrid AI" at COMPUTEX 2023, emphasizing that both machine learning and generative AI require the joint cooperation of edge and cloud AI to realize...
Six-inch SiC wafers are seeing demand growth and decline at the same time. On the one hand, there is the need to upgrade four-inch to six-inch wafers. On the other hand, customers...
The low-level demand for ICT and consumer electronics has significantly impacted the outlook of four-inch and five-inch silicon wafers. Some semiconductor companies even said the...
Intel announced the release of Tunnel Falls, a 12-qubit silicon chip, fabricated on 300mm wafers in Intel's D1 fabrication facility in Oregon, US. According to Intel, Tunnel Falls...
Intel released its quantum research spin qubit chip for researchers to directly control the hardware and acquire more practical knowledge about the quantum chip as Intel persues quantum...
AMD has introduced the Ryzen PRO 7040 series of mobile processors for high-end Windows 11 business laptops and mobile workstations, as well as the Ryzen PRO 7000 series of desktop...
Apple has introduced the new Mac Studio and Mac Pro with Mac Studio featuring the M2 Max and the new M2 Ultra, delivering a boost in performance and enhanced connectivity in its compact...
Nidec and Renesas Electronics have agreed to collaborate on the development of semiconductor solutions for a next-generation e-axle (X-in-1 system) that combines an electric vehicle...
Advanced Semiconductor Engineering (ASE) has announced its latest fan-out-chip-on-substrate-bridge (FOCoS-Bridge) technology innovation, which involved qualifying a large 70x78mm...
Ayar Labs has completed Series C1 funding, raising an additional US$25 million to bring its total Series C funding to US$155 million, according to the US-based silicon photonics chip...