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News tagged STATS ChipPAC
  • Last update: Friday 7 November 2014 [79 news items]

STATS ChipPAC intros new 3D eWLB PoP solutions

Mar 7, 11:35

STATS ChipPAC, a semiconductor test and advanced packaging service provider, has announced its next-generation three dimensional (3D) embedded wafer-level ball grid array (eWLB) package-on-package...

STATS ChipPAC Taiwan revenues pushed up by orders from TSMC, says report

Newswatch - Feb 14, 15:25

Testing house STATS ChipPAC Taiwan Semiconductor, a subsidiary of Singapore-based STATS ChipPAC, saw its January revenues rise 9% sequentially buoyed by a pull-in of orders for logic...

STATS ChipPAC to shut Thailand plant

Feb 1, 14:34

STATS ChipPAC has announced that the company will not resume assembly operations in its Thailand plant due to extensive equipment and facility damage beyond economic restoration....

Taiwan IC testing houses to post single-digit sales drop in 1Q12

Jan 17, 01:05

Taiwan-based IC testing specialists including King Yuan Electronics (KYEC) and Ardentec are likely to see their first-quarter revenues decrease 5-10% sequentially affected by clients'...

STATS ChipPAC breaks ground for new factory

Jan 6, 01:20

STATS ChipPAC on January 5 hold a groundbreaking ceremony for its new factory in Singapore, according to the chip test and packaging service provider. The new 197,000-square foot...

STATS ChipPAC Taiwan to post sales growth in 1Q12 on short lead-time orders, says report

Newswatch - Jan 5, 14:00

Revenues at STATS ChipPAC Taiwan Semiconductor are expected to register slight sequential growth in the first quarter of 2012, thanks to a pull-in of testing orders for logic ICs...

STATS ChipPAC says Thailand factory to resume partial operations in 1Q12

Dec 8, 01:15

STATS ChipPac's operations in Thailand, which have been stopped since October 17 due to recent flooding in the country, are expected to resume partially in the first quarter of 2012,...

Focus on small, cost-effective packages: Q&A with STATS ChipPAC CEO Tan Lay Koon

Nov 21, 13:48

Despite uncertainties in the semiconductor industry outlook, packaging and testing firm STATS ChipPAC will continue investing in advanced IC packages for space-critical designs that...

STATS ChipPAC CEO Tan Lay Koon

STATS ChipPAC completes expansion of 300mm wafer bump and WLCSP operation in Taiwan

Nov 17, 14:13

STATS ChipPAC has completed the expansion of its 300mm wafer bump and wafer-level chip-scale packaging (WLCSP) in Taiwan, according to the chip packaging and test service provider.

STATS ChipPAC to open new wafer-level packaging plant in Taiwan, says paper

Newswatch - Nov 14, 16:40

STATS ChipPAC is scheduled to hold an inauguration ceremony for a 12-inch wafer bumping and wafer-level packaging plant in Hsinchu County, northern Taiwan, Thursday (November 17),...

Thai flooding affects IC backend units of multiple suppliers, says IHS

Nov 4, 11:26

Numerous semiconductor suppliers headquartered around the world maintain assembly and test operations in Thailand, and many of these facilities have been affected by recent flooding...

STATS ChipPAC intros new fan-out WLP offering

Oct 6, 11:19

STATS ChipPAC has announced that its next-generation fan-out type wafer level packaging (FO-WLP) offers the technology to support a broad range of semiconductor markets including...

IC testers KYEC, SCT suffer large sequential decrease in 2Q11 profits

Aug 24, 01:00

King Yuan Electronics (KYEC) and STATS ChipPAC Taiwan Semiconductor (SCT), providers of IC testing services, saw net profits for the second quarter of 2011 drop 52.0% and 31.0% seq...

Packaging and testing growth to slow in 3Q11

Aug 17, 10:53

The global semiconductor packaging and testing industry is likely to see less than 5% growth sequentially in the third quarter of 2011, affected by the transition from gold to copper...

Copper pillar to be mainstream FC packaging technology in 2012

Jun 3, 15:43

IC packagers Advanced Semiconductor Engineering (ASE), Amkor Technology, Siliconware Precision Industries (SPIL) and STATS ChipPAC have all started developing a new flip-chip (FC)...

STATS ChipPAC reaches milestone of over 300 million copper wirebond units shipped

May 4, 13:45

STATS ChipPAC has shipped over 300 million semiconductor packages with copper wirebond interconnect, according to the company. Its previous milestone with shipments of more than 100...

STATS ChipPAC expands TSV offering

Apr 19, 10:38

STATS ChipPAC has expanded its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities, according to the company.

STATS ChipPAC profits surge in 2010

Jan 28, 11:07

STATS ChipPAC, a Singapore-based provider of semiconductor testing and assembly services, has announced net profits soared to US$108 million in 2010 from US$10.1 million in 2009....

STATS ChipPAC expands WLP offering with 12-inch manufacturing in Taiwan

Jan 18, 12:00

STATS ChipPAC has announced the expansion of its wafer-level package (WLP) offering with new 300mm manufacturing capabilities in Taiwan. The 300mm WLP operation is located in Hsinchu...

STATS ChipPAC, Intersil qualify copper wire interconnect for analog and mixed-signal devices

Dec 16, 01:00

STATS ChipPAC and Intersil have qualified the use of copper wire interconnect solutions on a number of high-end analog and mixed-signal devices which are in volume production, STATS...

STATS ChipPAC sees over 50% growth in flip chip business

Dec 14, 12:00

STATS ChipPAC has seen its flip chip business grow more than 50% in 2010 compared to 2009, according to the company, adding that shipments of flip chip packages have surpassed 250...

Ardentec denies merger with STATS ChipPAC

Stockwatch - Dec 3, 12:35

Wafer probing service provider Ardentec has denied a Chinese-language Economic Daily News (EDN) report indicating STATS ChipPAC has approached it to discuss a merger, according...

STATS ChipPAC increasing copper-wire bonding output

Dec 2, 01:05

Singapore-based STATS ChipPAC has cumulatively packaged 100 million chips based on copper-wire bonding process since it started using the process in November 2009, and expects to...

MediaTek reportedly negotiating new prices with UMC and backend service providers

Nov 29, 12:29

MediaTek is reportedly negotiating with United Microelectronics Corporation (UMC) as well as backend service providers including Advanced Semiconductor Engineering (ASE) and Siliconware...

STATS ChipPAC opens new plant for 300mm eWLB wafer manufacturing

Sep 15, 15:33

STATS ChipPAC on September 15 celebrated the opening of a new manufacturing facility to process 300mm wafers using embedded wafer-level BGA (eWLB) technology. The Singapore-based...

STATS ChipPAC intros 300mm embedded WLB wafer manufacturing

Apr 13, 12:00

STATS ChipPAC has expanded the embedded wafer-level ball-grid array (eWLB) technology to reconstituted 300mm wafers, according to the company. By adding capacity through 300mm wafer...

TSMC to raise orders to testing partners, says paper

Newswatch - Dec 15, 16:20

Taiwan Semiconductor Manufacturing Company (TSMC) plans to no longer add new capacity for wafer testing, and increase its outsourcing to backend partners Ardentec and STATS ChipPAC...

STATS ChipPAC moves copper wire bonding process to volume production

Nov 25, 11:23

STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).

SPIL says 2010 capex to double

Oct 29, 11:57

Siliconware Precision Industries (SPIL) has set its capex budget for 2010 at NT$10 billion (US$307.7 million), doubling from NT$5.3 billion allocated for 2009, according to company...

SPIL chairman Bough Lin

ASE ramping copper wire bonding output

Oct 1, 14:18

Advanced Semiconductor Engineering (ASE) has been ramping up its output utilizing a copper wire bonding process, with shipments of such ICs reaching over 50 million units in the past...

Top backend houses to see revenues grow in 3Q09

Aug 3, 12:14

Amkor Technology is expected to see the strongest revenue growth among top packaging and testing houses in th third quarter, followed by Advanced Semiconductor Engineering (ASE),...

STATS ChipPAC sales up 45% in 2Q09; swings to profit

Jul 30, 11:30

STATS ChipPAC saw its net sales grow 45% sequentially in the second quarter of 2009, and managed to swing back to profitability, according to the company. The Singapore-based chip...

STATS ChipPAC expanding capacity for wafer-level packaging

Jun 17, 14:35

STATS ChipPAC has announced it is expanding capacity for full turnkey wafer-level packaging in its Singapore operation. The IC packaging and testing service provider said it is on...

STATS ChipPAC delivers low-cost flip-chip technology

May 20, 12:25

STATS ChipPAC, a Singapore-based semiconductor packaging and testing service provider, has announced a new flip-chip (FC) technology that it says offers cost savings over standard...

STATS ChipPAC reports losses for 1Q09 due to continued contraction in demand

Apr 30, 11:48

STATS ChipPAC has posted its second straight quarterly loss in the first quarter of 2009, joining fellow packaging and testing house Advanced Semiconductor Engineering (ASE). Its...

79 items [2/3]
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