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News tagged wire bonding
  • Last update: Tuesday 7 April 2015 [25 news items]

SEMI reports 2014 semiconductor materials sales of US$44.3 billion

Apr 7, 13:59

The global semiconductor materials market increased 3% in 2014 compared to 2013, while worldwide semiconductor revenues increased 10%, according to SEMI. Revenues of US$44.3 billion...

SPIL to grow sales of silver wire-bonding packaging in 2014

Feb 12, 11:49

Chip packager Siliconware Precision Industries (SPIL) expects the development of its silver wire-bonding packaging business to bear fruit in 2014.

Greatek looks to improved profitability on copper wire bonding lines

Mar 13, 13:51

Logic IC packaging firm Greatek Electronics has revealed that copper wire bonding packaging lines are currently contributing more than 50% to its total revenues, which will further...

Demand for copper wirebonding packaging to peak in 2014

Sep 6, 13:36

Demand for copper wirebonding packaging will remain strong over the next two years, with the packaging technology to account for 85% of the global wirebonding market in 2014, according...

ASE, SPIL make progress in transition to copper wire bonding

Jul 31, 16:12

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have made progress toward the transition from gold to copper wire bonding, and have also stepped...

Greatek remains focused on shift to copper wire bonding

Jun 29, 01:20

IC backend service provider Greatek Electronics, which focuses on the consumer electronics market, has said the firm will continue shifting copper wire bonding from gold bonding in...

Proportion of copper wire bonding to rise to over 20% in 2011, says SEMI

Sep 7, 16:36

Due to rising gold prices, replacement of conventional processes based on gold wire with copper-wire bonding processes is increasing. The proportion of total wire bonding volume for...

ASE and SPIL look to continued growth in copper wire bonding business in 3Q11

Aug 15, 15:15

IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL), both expect their sales generated from copper wire bonding to increase...

ASE sees 7-9% growth in 2Q11 shipments; copper wire bonding sales rising

May 2, 14:01

Chip packager Advanced Semiconductor Engineering (ASE) expects shipments to increase 7-9% sequentially in the second quarter of 2011, with a higher gross margin, company CFO Joseph...

SPIL sees boost in copper wirebonding orders, says paper

Newswatch - Mar 4, 15:41

With more fabless IC firms adopting copper wire to package their products for cost reasons, packaging and testing house Siliconware Precision Industries (SPIL) has seen a substantial...

SPIL 4Q10 gross margin up on higher copper wire bonding sales

Jan 27, 01:00

Siliconware Precision Industries (SPIL) saw its gross margin increase to reach 14.3% in the fourth quarter of 2010, up 0.1pp sequentially and beating market estimates. The chip packager...

SPIL chairman Bough Lin

ASE slowing copper wire bonding expansion, says paper

Newswatch - Sep 23, 16:25

Advanced Semiconductor Engineering (ASE) is slowing down the expansion of its copper wirebonding capacity due to low market visibility, according to a Chinese-language Economic...

SPIL announces equipment purchase

Stockwatch - Aug 3, 14:43

Siliconware Precision Industries (SPIL) has announced an equipment purchase worth NT$574.62 million (US$18 million) from Verigy, which mainly supplies automated test equipment.

SPIL to raise 2010 capex budget for copper wire bonding equipment procurement

Jun 17, 10:30

Chip packaging house Siliconware Precision Industries (SPIL) will raise 2010 capex budget by at least 30% from US$450 million to about US$585 million due to increased procurement...

ASE raises 2010 capex

Jun 15, 11:52

Advanced Semiconductor Engineering (ASE) has decided to boost its 2010 capex to US$600-700 million from US$450-500 million it earlier planned, said company COO Tien Wu at a recent...

Backend supplier UTAC says sales of copper wirebonding process growing

May 18, 11:48

United Test and Assembly Center (UTAC) has seen sales generated from copper wire bonding account for 20% of its total revenues, according to company CEO Lee Joon Chung. Apart from...

Greatek and TICP to step into copper-wire bonding in 2Q10

Feb 11, 14:58

With Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) aggressively ramping production on copper-wire bond processes, second-tier Taiwan-based IC...

STATS ChipPAC moves copper wire bonding process to volume production

Nov 25, 11:23

STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).

ASE and SPIL revenues hit 2-year high in October

Nov 10, 13:46

IC packaging and testing house Advanced Semiconductor Engineering (ASE) saw revenues in October 2009 reach a two-year high at NT$4.9 billion (US$152 million), while rival Siliconware...

ASE, SPIL speeding up copper wire bonding expansion

Nov 2, 16:34

Advanced Semiconductor Engineering (ASE) plans to add an additional 2,000 copper wirebonders by the end of 2010, while Siliconware Precision Industries (SPIL) will add 200-300 copper...

ASE and SPIL deny headhunting rumors

Oct 16, 12:23

Taiwan-based chip packaging houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both come out to deny a Citi Investment Research report...

SPIL 2Q09 sales up more than 50%

Jul 8, 15:53

Siliconware Precision Industries (SPIL) has announced unaudited revenues for second-quarter 2009 grew 53.6% sequentially to NT$14.14 billion (US$431.24 million), beating market watchers'...

ASE, SPIL optimistic about 3Q09

Jun 2, 16:10

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industry (SPIL) have fully utilized all wire bonders, with the former using 60-70% and the latter 70-80% of their...

STATS ChipPAC delivers low-cost flip-chip technology

May 20, 12:25

STATS ChipPAC, a Singapore-based semiconductor packaging and testing service provider, has announced a new flip-chip (FC) technology that it says offers cost savings over standard...

NPC to relocate wirebond capacity to China

Jul 29, 11:38

Having already identified flip-chip (FC) substrates as a key sales driver in 2008, Nan Ya Printed Circuit Board (NPC) plans to relocate its low-margin production to China in order...

Realtime news
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    Bits + chips | 4h 3min ago

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    IT + CE - Newswatch | 4h 4min ago

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    IT + CE - Newswatch | 4h 5min ago

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    Bits + chips | 5h 44min ago

  • UMC holds technology forum in Japan

    Bits + chips | 6h 3min ago

  • Sharp to launch smartphones in Indonesia, says report

    Mobile + telecom | 6h 5min ago

  • Semi-equipment component maker Calitech applies for OTC listing

    Before Going to Press | 4h 13min ago

  • Sony launches flagship Xperia Z3+ smartphone

    Before Going to Press | 4h 14min ago

  • Panasonic to add BLU production lines at plants in Mexico and Brazil

    Before Going to Press | 4h 15min ago

  • HTC to block media from attending shareholders meeting

    Before Going to Press | 4h 16min ago

  • Taiwan becomes major revenue contributor to Google

    Before Going to Press | 4h 18min ago

  • GIS expects 2Q15 revenues to fall 15-20% sequentially

    Before Going to Press | 6h 17min ago

  • CSOT starts producing 55-inch Full HD TV panels at 2nd 8.5G factory

    Before Going to Press | 6h 20min ago

  • LCD monitor panel prices in May fall sequentially, says WitsView

    Before Going to Press | 6h 22min ago

  • GIS to list on TSE

    Before Going to Press | 6h 28min ago

  • Solar cell maker TSEC to be listed on TSE in 3Q15

    Before Going to Press | 6h 29min ago

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2015 China smartphone panel trend forecast

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