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News tagged wirebond
  • Last update: Tuesday 20 November 2012 [14 news items]

STATS ChipPAC to expand operations in Korea

Nov 20, 13:42

STATS ChipPAC has announced plans to expand its semiconductor assembly and test operation in South Korea. The Singapore-based backend house added that it has signed a non-binding...

Demand for copper wirebonding machines to slide 50% sequentially in 4Q12

Sep 12, 01:40

Demand for copper wirebonding machines from IC backend service companies is expected to decline 50% in the fourth quarter of 2012 as compared to purchases in the third quarter, according...

Taiwan copper wirebonding production value to rise

Sep 3, 12:11

The production value of Taiwan's copper wirebonding segment is expected to rise along with demand over the next three years, according to sources at equipment suppliers.

STATS ChipPAC reaches milestone of over 300 million copper wirebond units shipped

May 4, 13:45

STATS ChipPAC has shipped over 300 million semiconductor packages with copper wirebond interconnect, according to the company. Its previous milestone with shipments of more than 100...

SPIL sees boost in copper wirebonding orders, says paper

Newswatch - Mar 4, 15:41

With more fabless IC firms adopting copper wire to package their products for cost reasons, packaging and testing house Siliconware Precision Industries (SPIL) has seen a substantial...

ASE slowing copper wire bonding expansion, says paper

Newswatch - Sep 23, 16:25

Advanced Semiconductor Engineering (ASE) is slowing down the expansion of its copper wirebonding capacity due to low market visibility, according to a Chinese-language Economic...

SPIL enters LED packaging market

Sep 14, 15:26

Siliconware Precision Industries (SPIL) has entered the LED packaging business and started LED shipments through wirebonding packaging technology to three US-based clients. It is...

ASE raises 2010 capex

Jun 15, 11:52

Advanced Semiconductor Engineering (ASE) has decided to boost its 2010 capex to US$600-700 million from US$450-500 million it earlier planned, said company COO Tien Wu at a recent...

ASE expects higher shipments, gross margin in 2Q10

May 3, 15:48

Chip packaging and testing company Advanced Semiconductor Engineering (ASE) expects shipments to grow by 11-13% sequentially in the second quarter of 2010, driven particularly by...

ASE, SPIL speeding up copper wire bonding expansion

Nov 2, 16:34

Advanced Semiconductor Engineering (ASE) plans to add an additional 2,000 copper wirebonders by the end of 2010, while Siliconware Precision Industries (SPIL) will add 200-300 copper...

ASE and SPIL deny headhunting rumors

Oct 16, 12:23

Taiwan-based chip packaging houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both come out to deny a Citi Investment Research report...

SPIL 2Q09 sales up more than 50%

Jul 8, 15:53

Siliconware Precision Industries (SPIL) has announced unaudited revenues for second-quarter 2009 grew 53.6% sequentially to NT$14.14 billion (US$431.24 million), beating market watchers'...

ASE, SPIL optimistic about 3Q09

Jun 2, 16:10

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industry (SPIL) have fully utilized all wire bonders, with the former using 60-70% and the latter 70-80% of their...

NPC to relocate wirebond capacity to China

Jul 29, 11:38

Having already identified flip-chip (FC) substrates as a key sales driver in 2008, Nan Ya Printed Circuit Board (NPC) plans to relocate its low-margin production to China in order...

Realtime news
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    Before Going to Press | 11h 36min ago

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    Before Going to Press | 11h 53min ago

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    Before Going to Press | Nov 26, 20:43

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    Before Going to Press | Nov 26, 20:27

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    Before Going to Press | Nov 26, 20:06

  • Taiwan market: 4G user base tops 2.1 million at end of October, says NCC

    Before Going to Press | Nov 26, 19:33

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    Before Going to Press | Nov 26, 19:17

  • Inotera orders equipment from Applied Materials

    Before Going to Press | Nov 26, 19:15

  • Co-Tech looking to diversify products

    Before Going to Press | Nov 26, 19:15

  • Micron, Winbond team up for serial NOR flash

    Before Going to Press | Nov 26, 19:15

  • iPhone chip orders slow down, say IC designers

    Before Going to Press | Nov 26, 19:14

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